Patents by Inventor Junki Ishimoto
Junki Ishimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8342907Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: GrantFiled: November 30, 2009Date of Patent: January 1, 2013Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Publication number: 20100075576Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: ApplicationFiled: November 30, 2009Publication date: March 25, 2010Inventors: Yoichi KOBAYASHI, Shunsuke NAKAI, Hitoshi TSUJI, Yasuo TSUKUDA, Junki ISHIMOTO, Kazunari SHINYA
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Patent number: 7645181Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: GrantFiled: August 27, 2008Date of Patent: January 12, 2010Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Publication number: 20090011680Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: ApplicationFiled: August 27, 2008Publication date: January 8, 2009Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Patent number: 7438627Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: GrantFiled: June 27, 2007Date of Patent: October 21, 2008Assignees: Ebara Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Publication number: 20070254557Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: ApplicationFiled: June 27, 2007Publication date: November 1, 2007Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Patent number: 7252575Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: GrantFiled: October 15, 2003Date of Patent: August 7, 2007Assignees: EBARA Corporation, Shimadzu CorporationInventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Publication number: 20060166606Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.Type: ApplicationFiled: October 15, 2003Publication date: July 27, 2006Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Junki Ishimoto, Kazunari Shinya
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Patent number: 6999168Abstract: An external signal detection circuit is installed in a new measuring section, and generation and end timing of a readout signal of a spectrometric detector is directly controlled, and a readout signal in synchronization with an external start signal is generated. After input of measurement standby instructions, the external start signal is monitored anytime. Before detection of the external start signal, the new measuring section is shifted to a pause state and after the detection of the external start signal, transition to a measurement state is made. By this configuration, delay time between input time of the external start signal and readout start time of data is defined and valid measurable time at the time of setting short storage time is increased.Type: GrantFiled: May 28, 2004Date of Patent: February 14, 2006Assignee: Shimadzu CorporationInventor: Junki Ishimoto
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Publication number: 20040239927Abstract: An external signal detection circuit is installed in a new measuring section, and generation and end timing of a readout signal of a spectrometric detector is directly controlled, and a readout signal in synchronization with an external start signal is generated. After input of measurement standby instructions, the external start signal is monitored anytime. Before detection of the external start signal, the new measuring section is shifted to a pause state and after the detection of the external start signal, transition to a measurement state is made. By this configuration, delay time between input time of the external start signal and readout start time of data is defined and valid measurable time at the time of setting short storage time is increased.Type: ApplicationFiled: May 28, 2004Publication date: December 2, 2004Applicant: Shimadzu CorporationInventor: Junki Ishimoto