Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (4): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): the ratio H/E between the amount by mole, E, of the epoxy group in the component [A] and the amount by mole, H, of active hydrogen in the component [B] is 0.50 or more and 1.30 or less. (2): at least a part of the component [C] satisfies 0.10 or more and 0.

Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.

Abstract: An object of the present invention is to provide an epoxy resin composition excellent in elastic modulus and strength, and a prepreg and a fiber reinforced composite material with the epoxy resin composition. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or more. (2): at least a part of the component [C] satisfies that the Hansen solubility parameter distance L to the component [A] is 20.0 or less.

Abstract: An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications, has high Tg, and is excellent in elastic modulus and strength. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (2): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, (1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or less, (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.

Abstract: A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

Abstract: A prepreg having excellent tackiness as well as excellent resin strength after curing and strength in the non-fiber direction is described; and a fiber-reinforced composite material using the prepreg, where the prepreg is composed of reinforcing fibers and a resin composition which includes [A] an epoxy resin, [B] a dicyanamide and [C] a compound having a melting point of 130° C. or lower and a solubility parameter whose difference from the solubility parameter of [B] is 8 or less.

Abstract: An epoxy resin composition includes: an [A] epoxy resin at least comprising an [A1] isocyanurate epoxy resin and an [A2] glycidyl amine epoxy resin; [B] dicyandiamide; and [C] diaminodiphenyl sulfone, wherein (1) an average epoxy equivalent of the [A] epoxy resin is 115 g/eq to 150 g/eq, and (2) an amount of the component [C] added is an amount of 0.05 equivalent to 0.3 equivalent relative to epoxy groups in the [A] epoxy resin in terms of active hydrogen groups.

Abstract: A fiber reinforced composite material having high interlaminar toughness and compressive strength under wet heat conditions, as well as an epoxy resin composition for production thereof and a prepreg producible from the epoxy resin composition is described. The prepreg includes at least constituents [A], [B], and [C] as specified below and reinforcement fiber, wherein 90% or more of constituent [C] exists in the depth range accounting for 20% of the prepreg thickness from the prepreg surface: [A] epoxy resin; [B] epoxy resin curing agent; and [C] polymer particles insoluble in epoxy resin.

Abstract: An epoxy resin composition includes: an [A] epoxy resin at least comprising an [A1] isocyanurate epoxy resin and an [A2] glycidyl amine epoxy resin; [B] dicyandiamide; and [C] diaminodiphenyl sulfone, wherein (1) an average epoxy equivalent of the [A] epoxy resin is 115 g/eq to 150 g/eq, and (2) an amount of the component [C] added is an amount of 0.05 equivalent to 0.3 equivalent relative to epoxy groups in the [A] epoxy resin in terms of active hydrogen groups.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: The invention provides a fiber reinforced composite material having high interlaminar toughness and compressive strength under wet heat conditions, as well as an epoxy resin composition for production thereof and a prepreg producible from the epoxy resin composition. The prepreg comprises at least constituents [A], [B], and [C] as specified below and reinforcement fiber, wherein 90% or more of constituent [C] exists in the depth range accounting for 20% of the prepreg thickness from the prepreg surface: [A] epoxy resin [B] epoxy resin curing agent [C] polymer particles insoluble in epoxy resin and falling under any of the following [Cx] to [Cz]: [Cx] polymer particles insoluble in epoxy resin and giving a particle diameter distribution chart meeting the following requirements from (x-i) to (x-iii): (x-i) the chart has at least two peaks, (x-ii) the particles giving the two highest peaks have a diameter ratio in the range of 1.

Abstract: It is an object of the present invention to provide a stable solid preparation comprising a 4,5-epoxymorphinan derivative or a pharmacologically acceptable acid addition salt thereof as an effective ingredient. That is, the present invention provides the stable solid preparation comprising the 4,5-epoxymorphinan derivative or the pharmacologically acceptable acid addition salt thereof as the effective ingredient, and comprising sodium thiosulfate, a sugar or a sugar alcohol and hydroxypropylcellulose having a low degree of substitution in an amount of 1 to 30% by weight per weight of a unit containing the effective ingredient.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2) (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.

Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.