Patents by Inventor Junping Wu
Junping Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240160597Abstract: A link negotiation system includes a second device that determines a link configuration policy based on a status of a receiver of an interface of the second device, where the link configuration policy indicates an association relationship between a unidirectional logical lane and a unidirectional physical lane in a high-speed serial link between a first device and the second device, the unidirectional logical lane is a logical lane from the first device to the second device in the high-speed serial link, and the unidirectional physical lane is a physical lane from the first device to the second device in the high-speed serial link; and sends the link configuration policy to the first device.Type: ApplicationFiled: January 5, 2024Publication date: May 16, 2024Inventors: Wei Pan, Pingyu Wu, Junping Luo
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Publication number: 20240123058Abstract: Provided are an epitope peptide (or a variant thereof) that can be used for preventing or treating an EBV infection, a recombinant protein containing the epitope peptide (or variant thereof) and a carrier protein, and the use of the epitope peptide (or variant thereof) and the recombinant protein. Further provided are an antibody against the epitope peptide, and the use thereof in the detection, prevention and/or treatment of an EBV infection and/or diseases caused by the infection.Type: ApplicationFiled: January 29, 2022Publication date: April 18, 2024Inventors: Yixin CHEN, Xiao ZHANG, Junping HONG, Miao XU, Qian WU, Ling ZHONG, Ningshao XIA
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Patent number: 11055360Abstract: Embodiments of the disclosure provide a data write-in method and apparatus. The data write-in method includes: selecting a target replica server from a plurality of replica servers managed by a metadata server according to remaining capacity of the plurality of replica servers; selecting a write-in disk in the target replica server according to remaining capacity and load of disks managed by the target replica server; and storing write-in data into the write-in disk through the target replica server.Type: GrantFiled: May 3, 2018Date of Patent: July 6, 2021Assignee: Alibaba Group Holding LimitedInventors: Chengyu Dong, Jiaji Zhu, Haiyong Zhang, Feng Cao, Yong Wang, Wenhui Yao, Junping Wu, Yang Wu, Yuanyuan Dong, Dongzheng Wu, Jing Lu
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Publication number: 20180253506Abstract: Embodiments of the disclosure provide a data write-in method and apparatus. The data write-in method includes: selecting a target replica server from a plurality of replica servers managed by a metadata server according to remaining capacity of the plurality of replica servers; selecting a write-in disk in the target replica server according to remaining capacity and load of disks managed by the target replica server; and storing write-in data into the write-in disk through the target replica server.Type: ApplicationFiled: May 3, 2018Publication date: September 6, 2018Inventors: Chengyu DONG, Jiaji ZHU, Haiyong ZHANG, Feng CAO, Yong WANG, Wenhui YAO, Junping WU, Yang WU, Yuanyuan DONG, Dongzheng WU, Jing LU
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Patent number: 10020208Abstract: A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5/N for each rotation of the chuck, where ? is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5?n during the cleaning process, where ? is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.Type: GrantFiled: January 27, 2017Date of Patent: July 10, 2018Assignee: ACM Research (Shanghai) Inc.Inventors: Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia, Yunwen Huang, Zhifeng Gao, Hui Wang
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Publication number: 20170140952Abstract: A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5/N for each rotation of the chuck, where ? is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5?n during the cleaning process, where ? is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.Type: ApplicationFiled: January 27, 2017Publication date: May 18, 2017Applicant: ACM Research (Shanghai) Inc.Inventors: Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia, Yunwen Huang, Zhifeng Gao, Hui Wang
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Patent number: 9633833Abstract: A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or counter clockwise.Type: GrantFiled: September 30, 2016Date of Patent: April 25, 2017Assignee: ACM RESEARCH (SHANGHAI) INC.Inventors: Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia, Yunwen Huang, Zhifeng Gao, Yue Ma, Hui Wang
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Patent number: 9595457Abstract: A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5?/N for each rotation of the chuck, where ? is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5?n during the cleaning process, where ? is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.Type: GrantFiled: December 12, 2008Date of Patent: March 14, 2017Assignee: ACM Research (Shanghai) Inc.Inventors: Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia, Yunwen Huang, Zhifeng Gao, Hui Wang
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Publication number: 20170032959Abstract: A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or counter clockwise.Type: ApplicationFiled: September 30, 2016Publication date: February 2, 2017Inventors: Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia, Yunwen Huang, Zhifeng Gao, Yue Ma, Hui Wang
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Patent number: 9492852Abstract: A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or counter clockwise.Type: GrantFiled: March 31, 2009Date of Patent: November 15, 2016Assignee: ACM Research (Shanghai) Inc.Inventors: Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia, Yunwen Huang, Zhifeng Gao, Yue Ma, Hui Wang
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Publication number: 20140053978Abstract: A method and apparatus integrating semiconductor manufacturing processes of stress free electrochemical copper polishing (SFP), removal of the Tantalum oxide or Titanium oxide formed during SFP process and XeF2 gas phase etching barrier layer Ta/TaN or Ti/TiN process. Firstly, at least a portion of the plated copper film is polished by SFP. Secondly the barrier metal oxide film formed during SFP process is etched away by etchant. Finally, the barrier layer Ta/TaN or Ta/TiN is removed with XeF2 gas phase etching. The apparatus accordingly consists of three sub systems: stress free copper electropolishing system, barrier layer oxide film removal system and barrier layer Ta/TaN or Ti/TiN gas phase etching system.Type: ApplicationFiled: October 31, 2013Publication date: February 27, 2014Applicant: ACM Research (Shanghai) Inc.Inventors: Jian Wang, Zhaowei Jia, Junping Wu, Liangzhi Xie, Hui Wang
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Patent number: 8598039Abstract: This invention relates to a method and apparatus by integrating semiconductor manufacturing processes of stress free electrochemical copper polishing (SFP), removal of the Tantalum oxide or Titanium oxide formed during SFP process and XeF2 gas phase etching barrier layer Ta/TaN or Ti/TiN process. Firstly, at least portion of plated copper film is polished by SFP. Secondly the barrier metal oxide film formed during SFP process is etched away by etchant. Finally, the barrier layer Ta/TaN or Ta/TiN is removed with XeF2 gas phase etching. The apparatus accordingly consists of three sub systems: stress free copper electropolishing system, barrier layer oxide film removal system and barrier layer Ta/TaN or Ti/TiN gas phase etching system.Type: GrantFiled: August 20, 2008Date of Patent: December 3, 2013Assignee: ACM Research (Shanghai) Inc.Inventors: Jian Wang, Zhaowei Jia, Junping Wu, Liangzhi Xie, Hui Wang
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Publication number: 20120097195Abstract: A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process by turn the semiconductor substrate or the ultra/mega sonic device clockwise or count clockwise.Type: ApplicationFiled: March 31, 2009Publication date: April 26, 2012Inventors: Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia, Yunwen Huang, Zhifeng Gao, Yue Ma, Hui Wang
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Publication number: 20110290277Abstract: A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5?/N for each rotation of the chuck, where ? is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5?n during the cleaning process, where ? is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.Type: ApplicationFiled: December 12, 2008Publication date: December 1, 2011Inventors: Jian Wang, Sunny Voha Nuch, Liangzhi Xie, Junping Wu, Zhaowei Jia, Yunwen Huang, Zhifeng Gao, Hui Wang
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Publication number: 20110177692Abstract: This invention relates to a method and apparatus by integrating semiconductor manufacturing processes of stress free electrochemical copper polishing (SFP), removal of the Tantalum oxide or Titanium oxide formed during SFP process and XeF2 gas phase etching barrier layer Ta/TaN or Ti/TiN process. Firstly, at least portion of plated copper film is polished by SFP. Secondly the barrier metal oxide film formed during SFP process is etched away by etchant. Finally, the barrier layer Ta/TaN or Ta/TiN is removed with XeF2 gas phase etching. The apparatus accordingly consists of three sub systems: stress free copper electropolishing system, barrier layer oxide film removal system and barrier layer Ta/TaN or Ti/TiN gas phase etching system.Type: ApplicationFiled: August 20, 2008Publication date: July 21, 2011Inventors: Jian Wang, Zhaowei Jia, Junping Wu, Liangzhi Xie, Hui Wang