Abstract: A material conveying device includes a base frame, a first conveying unit, a second conveying unit and a transfer assembly. The first conveying unit is provided on the base frame, the second conveying unit is provided on the base frame, and the transfer assembly is provided on the base frame and can transfer a material between the first conveying unit and the second conveying unit. The present disclosure further provides a processing equipment facilitating material distribution and a material distribution method.

Abstract: A magnetic write head having a stitched magnetic pole (also referred to as a shaping layer) for conducting magnetic flux to the pole tip portion of a magnetic write pole. The stitched magnetic pole has a shape so as to be thicker in a central region that is aligned with the pole tip of the write pole and is thinner a its outer sides. This shape helps to channel magnetic flux to the pole tip portion of the write pole while maintaining sufficient pole surface area for high data rate recording.

Abstract: A chemical mechanical polishing to that can provide uniform polishing across a wafer even when polishing hard wafers such as AlTiC wafers used in the formation of magnetic recording sliders. The chemical mechanical polishing to has a wafer carrier that includes a diaphragm or bladder that is configured such that an inner portion of the bladder can be pneumatically pressurized so as to bow outward, while outer portions remain unpressurized.

Abstract: A magnetic write head having a stitched magnetic pole (also referred to as a shaping layer) for conducting magnetic flux to the pole tip portion of a magnetic write pole. The stitched magnetic pole has a shape so as to be thicker in a central region that is aligned with the pole tip of the write pole and is thinner a its outer sides. This shape helps to channel magnetic flux to the pole tip portion of the write pole while maintaining sufficient pole surface area for high data rate recording.

Abstract: A method for manufacturing a magnetic write head having a tapered leading edge. The method includes depositing a sacrificial non-magnetic layer to a thickness that is at least as great as the thickness of the write pole to be formed. The sacrificial non-magnetic layer is then masked and ion milled so as to form a tapered edge on the sacrificial non-magnetic layer that extends through the thickness of the non-magnetic fill layer. A magnetic material is then deposited and planarized by chemical mechanical polishing. The remaining magnetic material forms the entirety of the magnetic write pole so that there is no need to deposit additional magnetic layers further construct the write pole.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, apparatus (100) includes: (i) platen (106) with polishing surface (110); (ii) head (116) adapted to hold substrate (102) against polishing surface; (iii) mechanism to rotate platen (106) during polishing; (iv) dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) distributor (125) between the nozzles (126, 128) and head (116). In one embodiment, apparatus (100) further includes a wiper (180) between head (116) and distributor (125) to remove used slurry and polishing byproducts from surface (110), thereby reducing agglomerations or deposits that can damage substrate (102) and improving yield. Optionally, apparatus (100) further includes dispenser (186) for dispensing a fluid before and/or after wiper (180) to substantially eliminate buildup of deposits. Method for polishing and substrate polished according to method.

Abstract: A system (100) and method for polishing and planarizing a substrate (105) is provided that reduces non-uniformities in the removal of material from the edge of the substrate due to a rebound effect. In one embodiment system (100) includes a polishing head (140) having a carrier (155), a subcarrier (160) carried by the carrier and adapted to hold the substrate during a polishing operation, and a retaining ring (170) having an inner edge (220) disposed about the subcarrier. A lower surface (210) of the retaining ring (170) is in contact with a polishing surface (125) during the polishing operation, and has at least one annular recess (215) formed therein to enable the polishing surface compressed under the retaining ring to rebound into the annular recess, thereby reducing the rebound effect and inhibiting non-planar polishing of the surface of the substrate (105).

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.

Abstract: A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, the apparatus (100) includes: (i) a platen (106) with a polishing surface (110); (ii) a head (116) adapted to hold the substrate (102) against the polishing surface; (iii) a mechanism to rotate the platen (106) during polishing; (iv) a dispenser (124) having nozzles (126, 128) to dispense slurry on the surface (110); and (v) a distributor (125) between the nozzles (126, 128) and the head (116). In one embodiment, the apparatus (100) further includes a wiper (180) between the head (116) and the distributor (125) to remove used slurry and polishing byproducts from the surface (110), thereby reducing agglomerations or deposits that can damage the substrate (102) and improving yield.

Abstract: A system (100) and method for polishing and planarizing a substrate (105) is provided that reduces non-uniformities in the removal of material from the edge of the substrate due to a rebound effect. In one embodiment system (100) includes a polishing head (140) having a carrier (155), a subcarrier (160) carried by the carrier and adapted to hold the substrate during a polishing operation, and a retaining ring (170) having an inner edge (220) disposed about the subcarrier. A lower surface (210) of the retaining ring (170) is in contact with a polishing surface (125) during the polishing operation, and has at least one annular recess (215) formed therein to enable the polishing surface compressed under the retaining ring to rebound into the annular recess, thereby reducing the rebound effect and inhibiting non-planar polishing of the surface of the substrate (105).

Abstract: A solid freeform fabrication process and apparatus for making a three-dimensional object.

Abstract: A freeform fabrication method for making a three-dimensional food object from a design created on a computer, including: (a) providing a support member by which the object is supported while being constructed; (b) operating a material dispensing head for dispensing a continuous or intermittent strand of food composition in a fluent state; this food composition including a liquid ingredient and a primary body-building food material and the dispensed food composition having a rigidity and strength sufficient for permitting the food composition to be built up layer by layer into a three-dimensional shape in a non-solid state; and (c) operating control devices for generating control signals in response to coordinates of the object design and controlling the position of the dispensing head relative to the support member in response to the control signals to control dispensing of the food composition to construct a 3-D shape of this object.

Abstract: A freeform fabrication method for making a three-dimensional food object from a design created on a computer, including: (a) providing a support member by which the object is supported while being constructed; (b) operating a material dispensing head for dispensing a strand of food composition in a fluent state with this food composition comprising a volatile ingredient; (c) operating a material treatment device disposed near the strand of food composition to at least partially remove the volatile ingredient for causing the food composition to achieve a rigid state in which the food composition is built up in a 3-D shape of the object; and (d) operating control devices for generating control signals in response to coordinates of the design of the object and controlling the position of the dispensing head relative to the support member in response to the control signals to control dispensing of the food composition for constructing the object while supported with the support member.

Abstract: A solid freeform fabrication process and apparatus for making a three-dimensional reinforcement shape. The process comprises the steps of (1) operating a multiple-channel material deposition device for dispensing a liquid adhesive composition and selected reinforcement materials at predetermined proportions onto a work surface; (2) during the material deposition process, moving the deposition device and the work surface relative to each other in an X-Y plane defined by first and second directions and in a Z direction orthogonal to the X-Y plane so that the materials are deposited to form a first layer of the shape; (3) repeating these steps to deposit multiple layers for forming a three-dimensional preform shape; and (4) periodically hardening the adhesive to rigidize individual layers of the preform.

Abstract: A solid freeform fabrication process and apparatus for making a three-dimensional object. The process includes the steps of (1) positioning a material deposition sub-system a selected distance from a target surface, (2) operating this sub-system to deposit materials onto the target surface by carrying out the sub-steps of (a) operating a multiple-channel fluid phase delivery device of the deposition sub-system for supplying multiple fluid compositions to a small region proximate the target surface and (b) operating a focused energy source to produce a phase change zone at this region, thereby inducing deposition of materials onto the target surface, and (3) during the material deposition process, moving the deposition sub-system and the target surface relative to one another in a plane defined by first and second directions and in a third direction orthogonal to this plane to form deposition materials into a three dimensional shape. These steps are preferably executed under the control of a computer system.

Abstract: In accordance with a preferred embodiment, a rolling-type planetary ball mill apparatus for producing nanometer-scaled powders is disclosed, the apparatus comprising (a) a main rotary wheel comprising supporting members, (b) a plurality of mill pots which are revolvable by receiving a rotational force from the main rotary wheel through their corresponding supporting members, and are disposed around the main rotary wheel with substantially equal distance between one mill pot and another, each mill pot comprising a tiltable pivotal shaft having rotary coupling means so that the pot can also rotate about its own axis, each pivotal shaft having one end being supportably connected to its corresponding supporting member of the main rotary wheel; (c) motor means in drive relation to the main rotary wheel for providing rotational forces thereto; and (d) a non-revolvable counter-acting supporting ring disposed coaxially with the main rotary wheel and in the close, working vicinity of the mill pots; each tiltable pivot