Patents by Inventor Junxian Li
Junxian Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11938589Abstract: Disclosed are a dry ice cleaning and recycling device and a method a connecting rod. The device includes a dry ice ejector module, a clamping module, and a box, and the dry ice ejector module and the clamp module are both arranged in the box; the dry ice ejector module includes a spray gun guide rail and a cleaning nozzle vertically and slidably connected to the spray gun guide rail; and the clamp module includes a clamp guide rail and a clamp horizontally and slidably connected to the clamp guide rail. The device further includes a dry ice recycling device, the dry ice recycling device includes a dry ice recycling collector and a condenser pipe, and two ends of the condenser pipe are communicated with the box and the dry ice recycling collector respectively.Type: GrantFiled: September 20, 2022Date of Patent: March 26, 2024Assignee: GUANGDONG UNIVERSITY OF TECHNOLOGYInventors: Guan Wang, Guohua Chen, Sihao Lin, Junxian Li, Jieyu Zhu
-
Publication number: 20230338848Abstract: Provided are a method and an apparatus for displaying a game and a terminal, which provides a graphical user interface of the game through a touch terminal, wherein the graphical user interface comprises a large map of a game scene, the method comprises steps of: providing at least two virtual earth surface units in the large map of the game scene, wherein the virtual earth surface units respectively have a passage port; determining, in response to a first operation for a first virtual earth surface unit of the at least two virtual earth surface units, at least one second virtual earth surface unit having a communication relationship with a passage port of the first virtual earth surface unit of the at least two virtual earth surface units; and then, marking at least one path between the first virtual earth surface unit and the second virtual earth surface unit.Type: ApplicationFiled: January 19, 2022Publication date: October 26, 2023Applicant: NETEASE (HANGZHOU) NETWORK CO., LTD.Inventors: Yiming FENG, Junxian LI
-
Publication number: 20230294143Abstract: Provided are a laser cavitation composite ultrasonic cleaning device and cleaning method for a connecting rod, which belong to the technical field of bushing gap cleaning of engine connecting rods. Provided are a laser cavitation composite ultrasonic cleaning device and cleaning method for a connecting rod, the cleaning device comprises a cleaning tank, a bracket, a low-frequency ultrasonic vibrator, a first laser head, and a second laser head; the low-frequency ultrasonic vibrator is located on an outer side of a bottom portion of the cleaning tank; the first laser head is located above the bracket, and the second laser head is located at a lower portion in the cleaning tank. According to the cleaning device, laser light is combined with an ultrasonic wave, cooperated with light path assemblies, and the laser light is focused in a bolt hole and a bushing gap of the connecting rod.Type: ApplicationFiled: August 1, 2022Publication date: September 21, 2023Inventors: Guan WANG, Junxian LI, Sihao LIN, Jieyu ZHU, Guohua CHEN, Chong ZHANG
-
Publication number: 20230294242Abstract: Disclosed are a dry ice cleaning and recycling device and a method a connecting rod. The device includes a dry ice ejector module, a clamping module, and a box, and the dry ice ejector module and the clamp module are both arranged in the box; the dry ice ejector module includes a spray gun guide rail and a cleaning nozzle vertically and slidably connected to the spray gun guide rail; and the clamp module includes a clamp guide rail and a clamp horizontally and slidably connected to the clamp guide rail. The device further includes a dry ice recycling device, the dry ice recycling device includes a dry ice recycling collector and a condenser pipe, and two ends of the condenser pipe are communicated with the box and the dry ice recycling collector respectively.Type: ApplicationFiled: September 20, 2022Publication date: September 21, 2023Inventors: Guan WANG, Guohua CHEN, Sihao LIN, Junxian LI, Jieyu ZHU
-
Publication number: 20230294140Abstract: Disclosed are a full-automatic high-pressure spray cleaning and rust prevention device and an application method thereof. The device comprises a cleaning platform, a center rod and a swingable clamp module; the center rod is arranged on the cleaning platform, and an upper end is fixedly provided with the swingable clamp module; the swingable clamp module comprises a worm gear and worm assembly and a clamp, and the worm gear and worm assembly is capable of driving the clamp to deflect up and down; a driving mechanism arranged in a bottom portion of the cleaning platform is in driving connection with the center rod, so that the center rod is capable of driving the swingable clamp module to realize vertical lifting motion and rotary station switching; and the cleaning platform is sequentially provided with a positioning and spraying area, an air-drying area and a rust prevention area around the center rod.Type: ApplicationFiled: January 14, 2023Publication date: September 21, 2023Inventors: Guan WANG, Guohua CHEN, Junxian LI, Sihao LIN, Jieyu ZHU, Lei GUAN, Zanfeng LIU
-
Patent number: 11695098Abstract: A light-emitting diode (LED) sub-chip and a method of producing the same are provided. The LED sub-chip comprises an epitaxial layer disposed on a growth substrate, where the epitaxial layer comprises a plurality of electrodes. The groove disposed between the LED sub-chip and a second LED sub-chip, where the groove penetrates through the epitaxial layer separating the two sub-chips. The bridge insulating layer at least partially covering a sidewall of the groove, where the sidewall comprises a first surface and a second surface above the first surface, where the texture of the second surface is less granular than a texture of the first surface. The bridge electrode on the bridge insulating layer, where the bridge electrode connects respective electrodes of the two sub-chips at the first surface.Type: GrantFiled: November 11, 2019Date of Patent: July 4, 2023Assignee: Xiamen Changelight Co., Ltd.Inventors: Yingce Liu, Junxian Li, Zhao Liu, Zhendong Wei, Xuan Huang
-
Patent number: 11621380Abstract: A flip-chip of light emitting diode includes at least one reflective layer, at least one N-type electrode, at least one P-type electrode, at least one distributed Bragg reflector, and an epitaxial unit. The epitaxial unit includes a substrate, an N-type layer, an active layer, and a P-type layer, wherein the substrate, the N-type layer, the active layer, and the P-type are sequentially stacked. The epitaxial unit has at least one N-type layer exposed portion, which is extended from the outer side surface of the P-type layer to the N-type layer via the active layer. The at least one reflective layer is formed on the P-type layer, wherein the at least one distributed Bragg reflector is integrally bonded to the N-type layer, the active layer, the P-type layer, and the at least one reflective layer. The at least one N-type electrode is electrically connected with the N-type layer and the at least one P-type electrode is electrically connected with the P-type layer.Type: GrantFiled: July 31, 2018Date of Patent: April 4, 2023Assignee: Xiamen Changelight Co., Ltd.Inventors: Xingen Wu, Yingce Liu, Junxian Li, Qilong Wu
-
Patent number: 11621375Abstract: A light-emitting diode (LED) chip (2) comprises a substrate (20), an epitaxial structure (21), a transparent conductive layer (22), a passivation protective layer (23), and at least one electrode (25). The epitaxial structure (21) is disposed on the substrate (20). The transparent conductive layer (22) is disposed on the epitaxial structure (21). The transparent conductive layer (22) defines one or more first through holes (220) that extend through the transparent conductive layer (22). The passivation protective layer (23) is disposed on the transparent conductive layer (22). The passivation protective layer (23) defines one or more second through holes (230) that extend through the passivation protective layer (23). The electrode (25) is disposed on the passivation protective layer (23). The electrode (25) electrically connects the transparent conductive layer (11) through the one or more second through holes (230).Type: GrantFiled: October 7, 2017Date of Patent: April 4, 2023Assignee: Xiamen Changelight Co., Ltd.Inventors: Yingce Liu, Bin Song, Junxian Li, Qilong Wu, Yang Wang, Kaixuan Chen, Zhendong Wei, Xingen Wu, Hongyi Zhou, Lihe Cai, Xinmao Huang, Zhiwei Lin, Yongtong Li, Qimeng Lyu, Hexun Cai, Gengcheng Li
-
Patent number: 11616171Abstract: A flip light emitting chip and a manufacturing method thereof are disclosed, wherein the flip light emitting chip comprises an N-type semiconductor layer, an active region, a P-type semiconductor layer, a reflective layer, a barrier layer, a bonding layer, a first insulating layer, an extended electrode layer, a second insulating layer, an N-type electrode, and a P-type electrode sequentially grown from a substrate. The first insulating layer has at least one first channel and at least one second channel. A first extended electrode portion and a second extended electrode portion of the extended electrode layer are respectively formed on the first insulating layer and extended to the N-type semiconductor layer via the first channel and to the barrier layer via the second channel. The second insulating layer has at least one third channel and at least one fourth channel.Type: GrantFiled: August 14, 2019Date of Patent: March 28, 2023Assignee: Xiamen Changelight Co., Ltd.Inventors: Yingce Liu, Zhao Liu, Junxian Li, Zhendong Wei, Xingen Wu
-
Patent number: 11527679Abstract: A semiconductor light emitting chip includes a substrate and an N-type semiconductor layer sequentially developed from the substrate, an active region, a P-type semiconductor layer, a reflective layer, at least two insulating layers, an anti-diffusion layer and an electrode set. One of the insulating layers is extended to surround the inner peripheral portion of the reflective layer, and another the insulating layer is extended to surround the outer peripheral portion of the reflective layer, such that the insulating layer isolates the anti-diffusion layer from the P-type semiconductor layer. The electrode set includes an N-type electrode and a P-type electrode, wherein the N-type electrode is electrically connected to the N-type semiconductor layer, and the P-type electrode is electrically connected to the P-type semiconductor layer.Type: GrantFiled: July 30, 2019Date of Patent: December 13, 2022Assignee: Xiamen Changelight Co., Ltd.Inventors: Xingen Wu, Yingce Liu, Junxian Li, Zhendong Wei
-
Patent number: 11469349Abstract: A semiconductor chip of a LED and a manufacturing method thereof are disclosed. The semiconductor chip includes a substrate, an N-type semiconductor layer, an active region, a P-type semiconductor layer, and at least one semiconductor exposing portion extending from the P-type semiconductor layer to the N-type semiconductor layer. The semiconductor chip further includes one or more current blocking layers, a transparent conductive layer, an N-type electrode, and a P-type electrode, wherein the current blocking layer encapsulates the P-type semiconductor in such a manner to be stacked on the P-type semiconductor layer. The transparent conductive layer has one or more through holes corresponding to the one or more current blocking layers respectively. The N-type electrode is stacked on the N-type semiconductor layer and the P-type electrode is stacked on the N-type semiconductor layer. The P-type prongs of the P-type electrode are retained in the through holes of the transparent conductive layer respectively.Type: GrantFiled: July 16, 2019Date of Patent: October 11, 2022Assignee: Xiamen Changelight Co., Ltd.Inventors: Xingen Wu, Junxian Li, Yingce Liu, Zhendong Wei, Hongyi Zhou
-
Patent number: 11456399Abstract: A LED chip includes a substrate, an N-type semiconductor layer, an active region, a P-type semiconductor layer, a transparent electric conductive layer, and a passivation protective layer stacked with each other in sequence. The passivation protective layer has a plurality holes corresponding to different positions of the transparent electric conductive layer respectively. A P-type electrode is electrically linked with the transparent electric conductive layer through said plurality of holes, while an N-type electrode is electrically linked with said N-type semiconductor layer.Type: GrantFiled: July 30, 2018Date of Patent: September 27, 2022Assignee: Xiamen Changelight Co., Ltd.Inventors: Zhendong Wei, Junxian Li, Qilong Wu, Yingce Liu, Hongyi Zhou
-
Publication number: 20220302352Abstract: A mini LED chip and a manufacturing method thereof are provided. The mini LED chip includes a growth substrate and a light-emitting epitaxial layer including a first type semiconductor layer, a luminous layer, and a second type semiconductor layer. The second type semiconductor layer and the luminous layer include an electrode contact hollow part that exposes the first type semiconductor layer. Further, the mini LED chip includes a transparent conductive layer disposed on a side of the second type semiconductor layer facing away from the growth substrate, an extended electrode disposed on a side of the transparent conductive layer facing away from the growth substrate, an insulating and isolating reflection layer covering the electrode contact hollow part and an exposed surface of the transparent conductive layer and the extended electrode facing away from the growth substrate, and a first bonding electrode and a second bonding electrode.Type: ApplicationFiled: June 3, 2022Publication date: September 22, 2022Applicant: XIAMEN CHANGELIGHT CO., LTD.Inventors: Yingce LIU, Junxian LI, Zhao LIU, Xuan HUANG, Xingen WU
-
Publication number: 20210343904Abstract: A flip light emitting chip and a manufacturing method thereof are disclosed, wherein the flip light emitting chip comprises an N-type semiconductor layer, an active region, a P-type semiconductor layer, a reflective layer, a barrier layer, a bonding layer, a first insulating layer, an extended electrode layer, a second insulating layer, an N-type electrode, and a P-type electrode sequentially grown from a substrate. The first insulating layer has at least one first channel and at least one second channel. A first extended electrode portion and a second extended electrode portion of the extended electrode layer are respectively formed on the first insulating layer and extended to the N-type semiconductor layer via the first channel and to the barrier layer via the second channel. The second insulating layer has at least one third channel and at least one fourth channel.Type: ApplicationFiled: August 14, 2019Publication date: November 4, 2021Inventors: Yingce LIU, Zhao LIU, Junxian LI, Zhendong WEI, Xingen WU
-
Publication number: 20210336089Abstract: A semiconductor light emitting chip includes a substrate and an N-type semiconductor layer sequentially developed from the substrate, an active region, a P-type semiconductor layer, a reflective layer, at least two insulating layers, an anti-diffusion layer and an electrode set. One of the insulating layers is extended to surround the inner peripheral portion of the reflective layer, and another the insulating layer is extended to surround the outer peripheral portion of the reflective layer, such that the insulating layer isolates the anti-diffusion layer from the P-type semiconductor layer. The electrode set includes an N-type electrode and a P-type electrode, wherein the N-type electrode is electrically connected to the N-type semiconductor layer, and the P-type electrode is electrically connected to the P-type semiconductor layer.Type: ApplicationFiled: July 30, 2019Publication date: October 28, 2021Inventors: Xingen WU, Yingce LIU, Junxian LI, Zhendong WEI
-
Publication number: 20210091262Abstract: A semiconductor chip of a LED and a manufacturing method thereof are disclosed. The semiconductor chip includes a substrate, an N-type semiconductor layer, an active region, a P-type semiconductor layer, and at least one semiconductor exposing portion extending from the P-type semiconductor layer to the N-type semiconductor layer. The semiconductor chip further includes one or more current blocking layers, a transparent conductive layer, an N-type electrode, and a P-type electrode, wherein the current blocking layer encapsulates the P-type semiconductor in such a manner to be stacked on the P-type semiconductor layer. The transparent conductive layer has one or more through holes corresponding to the one or more current blocking layers respectively. The N-type electrode is stacked on the N-type semiconductor layer and the P-type electrode is stacked on the N-type semiconductor layer. The P-type prongs of the P-type electrode are retained in the through holes of the transparent conductive layer respectively.Type: ApplicationFiled: July 16, 2019Publication date: March 25, 2021Applicant: XIAMEN CHANGELIGHT CO.,LTD.Inventors: Xingen WU, Junxian LI, Yingce LIU, Zhendong WEI, Hongyi ZHOU
-
Publication number: 20200251616Abstract: A light-emitting diode (LED) sub-chip and a method of producing the same are provided. The LED sub-chip comprises an epitaxial layer disposed on a growth substrate, where the epitaxial layer comprises a plurality of electrodes. The groove disposed between the LED sub-chip and a second LED sub-chip, where the groove penetrates through the epitaxial layer separating the two sub-chips. The bridge insulating layer at least partially covering a sidewall of the groove, where the sidewall comprises a first surface and a second surface above the first surface, where the texture of the second surface is less granular than a texture of the first surface. The bridge electrode on the bridge insulating layer, where the bridge electrode connects respective electrodes of the two sub-chips at the first surface.Type: ApplicationFiled: November 11, 2019Publication date: August 6, 2020Applicant: Xiamen Changelight Co. Ltd.Inventors: Yingce LIU, Junxian LI, Zhao LIU, Zhendong WEI, Xuan HUANG
-
Publication number: 20200251632Abstract: A flip-chip of light emitting diode includes at least one reflective layer, at least one N-type electrode, at least one P-type electrode, at least one distributed Bragg reflector, and an epitaxial unit. The epitaxial unit includes a substrate, an N-type layer, an active layer, and a P-type layer, wherein the substrate, the N-type layer, the active layer, and the P-type are sequentially stacked. The epitaxial unit has at least one N-type layer exposed portion, which is extended from the outer side surface of the P-type layer to the N-type layer via the active layer. The at least one reflective layer is formed on the P-type layer, wherein the at least one distributed Bragg reflector is integrally bonded to the N-type layer, the active layer, the P-type layer, and the at least one reflective layer. The at least one N-type electrode is electrically connected with the N-type layer and the at least one P-type electrode is electrically connected with the P-type layer.Type: ApplicationFiled: July 31, 2018Publication date: August 6, 2020Inventors: Xingen WU, Yingce LIU, Junxian LI, Qilong WU
-
Publication number: 20200176635Abstract: A LED chip includes a substrate, an N-type semiconductor layer, an active region, a P-type semiconductor layer, a transparent electric conductive layer, and a passivation protective layer stacked with each other in sequence. The passivation protective layer has a plurality holes corresponding to different positions of the transparent electric conductive layer respectively. A P-type electrode is electrically linked with the transparent electric conductive layer through said plurality of holes, while to an N-type electrode is electrically linked with said N-type semiconductor layer.Type: ApplicationFiled: July 30, 2018Publication date: June 4, 2020Inventors: Zhendong WEI, Junxian LI, Qilong WU, Yingce LIU, Hongyi ZHOU
-
Publication number: 20200020830Abstract: A light-emitting diode (LED) chip (2) comprises a substrate (20), an epitaxial structure (21), a transparent conductive layer (22), a passivation protective layer (23), and at least one electrode (25). The epitaxial structure (21) is disposed on the substrate (20). The transparent conductive layer (22) is disposed on the epitaxial structure (21). The transparent conductive layer (22) defines one or more first through holes (220) that extend through the transparent conductive layer (22). The passivation protective layer (23) is disposed on the transparent conductive layer (22). The passivation protective layer (23) defines one or more second through holes (230) that extend through the passivation protective layer (23). The electrode (25) is disposed on the passivation protective layer (23). The electrode (25) electrically connects the transparent conductive layer (11) through the one or more second through holes (230).Type: ApplicationFiled: October 7, 2017Publication date: January 16, 2020Inventors: Yingce LIU, Bin SONG, Junxian LI, Qilong WU, Yang WANG, Kaixuan CHEN, Zhendong WEI, Xingen WU, Hongyi ZHOU, Lihe CAI, Xinmao HUANG, Zhiwei LIN, Yongtong LI, Qimeng LYU, Hexun CAI, Gengcheng LI