Patents by Inventor Junya Hayasaka

Junya Hayasaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10166779
    Abstract: A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.
    Type: Grant
    Filed: February 1, 2016
    Date of Patent: January 1, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shiro Sujaku, Keiji Watanabe, Kouji Hasegawa, Junya Hayasaka, Satoshi Ibe
  • Patent number: 9610773
    Abstract: A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: April 4, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Ibe, Keiji Watanabe, Junya Hayasaka, Shiro Sujaku, Kouji Hasegawa
  • Publication number: 20160229184
    Abstract: A method for producing a liquid-ejection-head substrate includes providing a substrate having an energy-generating element and a pad, the pad including a wiring layer, the wiring layer in the pad having a relatively thick portion and a relatively thin portion and performing electrical inspection by applying a contact probe to the relatively thin portion of the wiring layer in the pad.
    Type: Application
    Filed: February 2, 2016
    Publication date: August 11, 2016
    Inventors: Satoshi Ibe, Keiji Watanabe, Junya Hayasaka, Shiro Sujaku, Kouji Hasegawa
  • Publication number: 20160229183
    Abstract: A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.
    Type: Application
    Filed: February 1, 2016
    Publication date: August 11, 2016
    Inventors: Shiro Sujaku, Keiji Watanabe, Kouji Hasegawa, Junya Hayasaka, Satoshi Ibe
  • Patent number: 9108406
    Abstract: A device substrate includes a substrate body having an energy generating device provided thereon, where the energy generating device generates energy for ejecting liquid, an ejection port forming member disposed on the substrate body, where the ejection port forming member has a pressure chamber that surrounds the energy generating device and an ejection port that communicates with the pressure chamber, and a supply port configured to supply the liquid to the pressure chamber. The ejection port forming member has a first surface that is in contact with the substrate body and a second surface other than the first surface, and the supply port is formed in the second surface.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: August 18, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kouji Hasegawa, Satoshi Ibe, Jun Yamamuro, Shuhei Oya, Shiro Sujaku, Junya Hayasaka
  • Patent number: 9085141
    Abstract: A liquid ejection head and a printing apparatus can perform high-quality printing by suppressing the shrinkage stress of an adhesive joining a substrate and a flow path forming member and the deformation and peeling of the flow path forming member. A stress dispersing section is formed on the side surface of the substrate.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: July 21, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shuhei Oya, Satoshi Ibe, Jun Yamamuro, Kouji Hasegawa, Shiro Sujaku, Junya Hayasaka
  • Publication number: 20150062260
    Abstract: There are provided a liquid ejection head and a printing apparatus capable of performing high-quality printing by suppressing the shrinkage stress of an adhesive joining a substrate and a flow path forming member and the deformation and peeling of the flow path forming member. A stress dispersing section 11 is formed on the side surface of the substrate 1.
    Type: Application
    Filed: August 21, 2014
    Publication date: March 5, 2015
    Inventors: Shuhei OYA, Satoshi Ibe, Jun Yamamuro, Kouji Hasegawa, Shiro Sujaku, Junya Hayasaka
  • Publication number: 20140340451
    Abstract: A device substrate includes a substrate body having an energy generating device provided thereon, where the energy generating device generates energy for ejecting liquid, an ejection port forming member disposed on the substrate body, where the ejection port forming member has a pressure chamber that surrounds the energy generating device and an ejection port that communicates with the pressure chamber, and a supply port configured to supply the liquid to the pressure chamber. The ejection port forming member has a first surface that is in contact with the substrate body and a second surface other than the first surface, and the supply port is formed in the second surface.
    Type: Application
    Filed: May 13, 2014
    Publication date: November 20, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Kouji Hasegawa, Satoshi Ibe, Jun Yamamuro, Shuhei Oya, Shiro Sujaku, Junya Hayasaka