Abstract: A method of adjusting a laser processing apparatus includes controlling an X-axis galvanometer scanner and a Y-axis galvanometer scanner on the basis of X coordinates and Y coordinates recorded in a coordinate recording section to apply a pulsed laser beam to a workpiece, thereby processing the workpiece, actuating an X-axis moving mechanism and a Y-axis moving mechanism on the basis of the X coordinates and the Y coordinates recorded in the coordinate recording section and causing an image capturing unit to capture an image of processed marks on the workpiece, and detecting shifts between X coordinates and Y coordinates of the processed marks whose image has been captured in the processed mark image capturing step and the X coordinates and the Y coordinates recorded in the coordinate recording section, and recording corrective values in a corrective value recording section.

Abstract: A novel heat-fusible copolymer possessing a combination of excellent properties, including mechanical strength, resistivity against radioactive rays, chemical resistance, low temperature stability, thermal resistance, processabilty, adhesiveness, thermal fusible adhesive stability, and simultaneously satisfying requirements relating to low hygroscopic characteristic and stable dielectric constant. Also, a powder, film, laminated film, laminated insulating material, and article, such as electronic modules and capacitors, made from a thermoplastic polyimide resin composed mainly of the copolymer and suitable for use as electronic components and materials for electronic circuit components. The copolymer possesses a glass transition temperature of 100.degree. C. to 250.degree. C., a hygroscopic degree of 1 or less, and a dielectric rate of 3 or less, and has the following formula: ##STR1## wherein Ar.sub.1 represents a quadrivalent organic radical, Ar.sub.

Abstract: The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.

Abstract: A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

Abstract: The invention discloses a thermosetting imide oligomer represented by the general formula (1A) or (1B): ##STR1## Where Ar.sub.1 indicates a tetravalent aromatic group, Ar.sub.2 indicates a divalent aromatic group, Ar.sub.1 or Ar.sub.2 can be of the same or different kind, X indicates a trivalent group and it can be of the same or different kind, n is an integer selected from 1 to 15, and R is a substitution group having reactivity.The invention further discloses a method for manufacturing a heat resistant laminated sheet using the imide oligomer, which is excellent in heat resistance, hygroscopic resistance and electric properties.