Abstract: Provided are a sensing device and a manufacturing method thereof. The sensing device includes a substrate, a red light chip, an infrared light chip, and a green light chip. The red light chip, the infrared light chip, and the green light chip are disposed on the front face of the substrate. Five front face pads are disposed on the front face of the substrate. Five back face pads are disposed on the back face of the substrate. The third back face pad is connected to the fourth back face pad by a conductive line. One of the five front face pads is electrically connected to a corresponding one of the five back face pads.

Abstract: Provided are a method for machining a device and the device. The method for machining a device includes die bonding, primary dicing, filling by a baffle wall material, grinding and secondary dicing. In the step of grinding machining, a semi-finished product is placed on a platform surface of a grinding and fixing platform, a grinding working end of a grinding device is controlled to operate, and with the platform surface of the grinding and fixing platform as a height reference, the grinding working end grinds from above the semi-finished product toward the grinding and fixing platform and operates to a preset height. Through the special machining process, the probability of the appearance of white glue on a top surface of the device is reduced, which is conducive to ensuring a production yield of the device.

Abstract: A structure of a heat dissipation substrate of power LEDs and a device made by using the same overcomes drawbacks such as complex structure of power LEDs, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of the heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other. The through hole is smaller than the blind hole, and both of them share the same direction of axis. The heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit.

Abstract: The present invention provides manufacturing methods for a power LED substrate with a mounting hole and a heat sink and for its power LED product and products thereof. The disclosed fabrication methods for power LED heat-dissipating substrate include the following steps a) selecting substrate material and processing; b) fabricating heat sink; c) assembling substrate and heat sink. The manufacturing methods of power LED products are based upon the manufacturing methods for heat-dissipating substrate, including the following steps: mounting LED die, bonding wire, packaging, post hardening, separating components, testing, classifying, and taping.

Abstract: Provided is an LED light source module, comprising a PCB board with electrically conductive pathways, for example wire lines, and at least one through hole; at least one semiconductor light-emitting device; electronic components forming a driving circuit; a metal housing with a groove; and at least one heat sink; wherein the semiconductor light-emitting device is electrically connected to the PCB board, electronic components are disposed on the PCB board, the PCB board is disposed in the groove of the metal housing, the heat sink is disposed in the through hole and connected to the PCB board, the semiconductor light-emitting device is disposed on the upper surface of the heat sink and the bottom of the heat sink is welded with the metal housing.

Abstract: A structure of heat dissipation substrate of power LED and a device made thereof overcomes drawbacks such as complex structure of power LED, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other, and the through hole is smaller than the blind hole, and both of them share the same direction of axis; the heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit; a plurality of counterbores may be arranged on the circuit board; the circuit board may also comprise a plurality of position lines for cutting and a plurality of slots and/or holes.

Abstract: This invention relates to light-emitting diodes or devices (LEDs), such as LED lighting assemblies and methods of manufacturing them. More particularly, this invention relates to white-light LED lighting assemblies, devices, and components, methods for packaging white-light LEDs, and LED devices produced thereby. A method for packaging a white-light LED is provided comprising providing a substrate with a resin injection hole and a vent hole, a packaging housing, at least one LED chip, a supporting frame and resin, installing the LED chip on the substrate, coating an inner wall of the packaging housing with fluorescent powder, connecting the packaging housing to the substrate by way of the supporting frame, so that a cavity is formed therebetween, injecting the resin into the cavity between the packaging housing and the substrate by way of the resin injection hole so that gas within the cavity is discharged by way of the vent hole, and curing the resin.