Patents by Inventor Junzoh Matsumura

Junzoh Matsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal casing for semiconductor device having high thermal conductivity and thermal expansion coefficient
    Patent number: 5574959
    Abstract: A metal casing for a semiconductor device is manufactured by a powder metallurgy injection molding process which uses infiltration. The metal casing includes a base member and an enclosure member arranged on the base member. The base member and the enclosure member are formed of an alloy including 20 to 50 percent by volume of copper, equal to or less than 1 percent by weight of nickel and remainder of tungsten or molybdenum. The metal casing is manufactured as a net-shape product by a process which includes the steps of mixing tungsten powder and nickel powder having average particles sizes equal to or less than 40 .mu.
    Type: Grant
    Filed: September 16, 1994
    Date of Patent: November 12, 1996
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Masanori Tsujioka, Junzoh Matsumura