Abstract: An electronics module has a flexible substrate having conductors, an array of functional components on the substrate, the functional components arranged to contact at least one conductor, and perforations in the flexible substrate, the perforations arranged to increase stretchability of the flexible substrate, the conductor arranged around the perforation and the functional components arranged to one of reside between the perforations or partially cover the perforations. A method of manufacturing a flexible electronics module involves mounting at least two functional components onto a flexible substrate, forming electrical interconnects configured to provide connection between the two functional components, and perforating the flexible substrate with cuts configured to increase stretchability of the substrate.

Abstract: A display has a louver shade having at least two louver segments, a display segment mounted on each louver segment, each display segment being a part of a larger display, drive electronics electrically coupled to each display segment to provide image data to display elements in the display segment, and a control circuit to provide the image data to the drive electronics, the control circuit arranged to provide display data when the louver segments are in a closed position.

Abstract: A printing plate has a substrate, an array of cells on the substrate, wherein each cell corresponds to an element of a print image, a deformable polymer material localized into the cells such that each cell is at least partially formed from the deformable polymer material, a reservoir corresponding to each cell to collect the deformable polymer material as needed when the deformable polymer material is one of either melted or softened, and a heater to cause the deformable polymer material to either melt or soften.

Abstract: According to one embodiment, a method of forming a solar energy converter assembly disclosed herein includes providing a solar energy converter configured to convert light incident on a light-receiving surface thereof into another form of energy and providing louver elements adjacent to the light-receiving surface such that light is transmittable between the louver elements to the light-receiving surface along a plurality of directions. Display surfaces of the louver elements are visible along a predetermined direction different from the plurality of directions and non-display surfaces of the louver elements reflect light to the light-receiving surface.

Abstract: The roughness and structural height of printed metal lines is used to pin a fluid. This fluid deposits a top contact material which is connected to the bottom printed contacts through pinholes in the hydrophobic polymer layer. This results in a sandwich-like contact structure achieved in a self-aligned deposition process and having improved source-drain contact for all-additive printed circuits. In one form, the present technique is used for thin film transistor applications, but it may be applied to electrodes in general.

Abstract: A system has a print head to dispense ink onto a print surface to form a printed image, a molding surface to contact the ink to form an informational image in at least the surface of the ink, and a radiation source to solidify the ink into the printed and informational images. A method includes dispensing ink onto a print medium to form a printed image, pressing a molding surface onto the printed image to transfer an informational image onto the printed image, and solidify the ink into the printed and informational images.

Abstract: A fluidic system and method includes a channel reservoir which holds 1.5 milliliters or less of fluid. The agitation mechanism, which is partially integrated with the channel or reservoir, includes a fiber or rod at least partially situated within the channel or reservoir, and which acts to move or vibrate to stir and/or agitate fluid within the channel or reservoir. The fluid is then extracted from an extraction area following the agitation or stirring operation.

Abstract: The roughness and structural height of printed metal lines is used to pin a fluid. This fluid deposits a top contact material which is connected to the bottom printed contacts through pinholes in the hydrophobic polymer layer. This results in a sandwich-like contact structure achieved in a self-aligned deposition process and having improved source-drain contact for all-additive printed circuits. In one form, the present technique is used for thin film transistor applications, but it may be applied to electrodes in general.

Abstract: An apparatus fixes ink on a substrate, such as in ink-jet printing. A leveling member is positioned to contact an ink-bearing side of the substrate at a nip. A radiation source is positioned to direct radiation to the ink-bearing side of the substrate at the nip, the radiation suitable for curing the ink on the substrate.

Abstract: A thin film transistor (TFT) structure is implemented. This embodiment is much less sensitive than conventional TFTs to alignment errors and substrate distortion. In such a configuration, there is no need to define gate features, so the layout is simplified. Moreover, the gate layer may be patterned by several inexpensive printing or non-printing methods.

Abstract: A printing surface includes a substrate having latching electrodes on a first surface, a spacer layer on the first surface of the substrate, the spacer layer patterned to form wells such that the latching electrodes reside in the wells, a deformable membrane, the membrane having conductive regions, on the spacer layer to enclose the wells, each enclosed well and its associated region of the membrane forming a pixel membrane, and actuation circuitry to actuate the electrodes to cause selected ones of the pixel membranes to remain in a deflected state when the pixel membranes receive an impulse to return to an undeflected state.

Abstract: A thermistor has a mixture of a temperature sensitive material and a conductive material, and an electrode in electrical contact with the mixture. A method of manufacturing a thermistor includes depositing conductive contacts onto a substrate, printing a thermistor mixture of temperature sensitive material and a conductive material over the contact, and annealing the thermistor mixture to produce a flexible thermistor on the conductive contacts.

Abstract: The roughness and structural height of printed metal lines is used to pin a fluid. This fluid deposits a top contact material which is connected to the bottom printed contacts through pinholes in the hydrophobic polymer layer. This results in a sandwich-like contact structure achieved in a self-aligned deposition process and having improved source-drain contact for all-additive printed circuits. In one form, the present technique is used for thin film transistor applications, but it may be applied to electrodes in general.

Abstract: A first patterned contact layer, for example a gate electrode, is formed over an insulative substrate. Insulating and functional layers are formed at least over the first patterned contact layer. A second patterned contact layer, for example source/drain electrodes, is formed over the functional layer. Insulative material is then selectively deposited over at least a portion of the second patterned contact layer to form first and second wall structures such that at least a portion of the second patterned contact layer is exposed, the first and second wall structures defining a well therebetween. Electrically conductive or semiconductive material is deposited within the well, for example by jet-printing, such that the first and second wall structures confine the conductive or semiconductive material and prevent spreading and electrical shorting to adjacent devices. The conductive or semiconductive material is in electrical contact with the exposed portion of the second patterned contact layer to form, e.g.

Abstract: A first patterned contact layer, for example a gate electrode, is formed over an insulative substrate. Insulating and functional layers are formed at least over the first patterned contact layer. A second patterned contact layer, for example source/drain electrodes, is formed over the functional layer. Insulative material is then selectively deposited over at least a portion of the second patterned contact layer to form first and second wall structures such that at least a portion of the second patterned contact layer is exposed, the first and second wall structures defining a well therebetween. Electrically conductive or semiconductive material is deposited within the well, for example by jet-printing, such that the first and second wall structures confine the conductive or semiconductive material and prevent spreading and electrical shorting to adjacent devices. The conductive or semiconductive material is in electrical contact with the exposed portion of the second patterned contact layer to form, e.g.

Abstract: A thin film transistor (TFT) structure is implemented. This embodiment is much less sensitive than conventional TFTs to alignment errors and substrate distortion. In such a configuration, there is no need to define gate features, so the layout is simplified. Moreover, the gate layer may be patterned by several inexpensive printing or non-printing methods.

Abstract: An embodiment is a method and apparatus to construct a shielded cable, wire, or circuit. A first insulator layer is deposited on a first conductor or semiconductor layer. A second conductor or semiconductor layer is deposited on the first insulator layer. A second insulator layer is deposited on the first insulator layer. The second insulator layer covers the second conductor or semiconductor layer and defines a shielded region. A third conductor or semiconductor layer is deposited on the first conductor or semiconductor layer. The third conductor or semiconductor layer covers the first and second insulator layers. At least one of the first, second, and third conductor or semiconductor layers, and the first and second insulator layers is deposited by printing.

Abstract: An apparatus fixes ink on a substrate, such as in ink-jet printing. A leveling member is positioned to contact an ink-bearing side of the substrate at a nip. A radiation source is positioned to direct radiation to the ink-bearing side of the substrate at the nip, the radiation suitable for curing the ink on the substrate.

Abstract: A system has a print head to dispense ink onto a print surface to form a printed image, a molding surface to contact the ink to form an informational image in at least the surface of the ink, and a radiation source to solidify the ink into the printed and informational images. A method includes dispensing ink onto a print medium to form a printed image, pressing a molding surface onto the printed image to transfer an informational image onto the printed image, and solidify the ink into the printed and informational images.

Abstract: A first patterned contact layer, for example a gate electrode, is formed over an insulative substrate. Insulating and functional layers are formed at least over the first patterned contact layer. A second patterned contact layer, for example source/drain electrodes, is formed over the functional layer. Insulative material is then selectively deposited over at least a portion of the second patterned contact layer to form first and second wall structures such that at least a portion of the second patterned contact layer is exposed, the first and second wall structures defining a well therebetween. Electrically conductive or semiconductive material is deposited within the well, for example by jet-printing, such that the first and second wall structures confine the conductive or semiconductive material and prevent spreading and electrical shorting to adjacent devices. The conductive or semiconductive material is in electrical contact with the exposed portion of the second patterned contact layer to form, e.g.