Patents by Inventor Jurgen Hupe
Jurgen Hupe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7815785Abstract: The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that contains peroxide; contacting the etched substrate surface with an acidic treatment solution that contains permanganate; activating the treated substrate surface in an acidic activation solution that contains peroxide; contacting the activated substrate surface with an acidic catalytic solution that contains at least a thiophene derivate and at least a sulfonic acid derivate; metallization of the thus treated substrate surface in an acidic galvanic metallization bath.Type: GrantFiled: May 31, 2007Date of Patent: October 19, 2010Assignee: Enthone Inc.Inventors: Walter Kronenberg, Jürgen Hupe
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Publication number: 20070298170Abstract: The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that contains peroxide; contacting the etched substrate surface with an acidic treatment solution that contains permanganate; activating the treated substrate surface in an acidic activation solution that contains peroxide; contacting the activated substrate surface with an acidic catalytic solution that contains at least a thiophene derivate and at least a sulfonic acid derivate; metallization of the thus treated substrate surface in an acidic galvanic metallization bath.Type: ApplicationFiled: May 31, 2007Publication date: December 27, 2007Applicant: ENTHONE INC.Inventors: Walter Kronenberg, Jurgen Hupe
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Publication number: 20050266165Abstract: A method for metallizing plastic surfaces in which sulfides or polysulfides of activator metal are reduced to metal. This results in a conductive layer on which a metal layer can then be directly electrolytically deposited.Type: ApplicationFiled: May 27, 2005Publication date: December 1, 2005Applicant: Enthone Inc.Inventors: Andreas Mobius, Jurgen Hupe
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Patent number: 6821323Abstract: The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is a created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the layer.Type: GrantFiled: July 31, 2002Date of Patent: November 23, 2004Assignee: Enthone Inc.Inventors: Jane Bell, Joachim Heyer, Jürgen Hupe, Ingo Kalker, Marlies Kleinfeld
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Publication number: 20040026254Abstract: Method for selectively metallizing dielectric materials, the method includes: adhesively covering dielectric materials with an activating layer comprising a conductive material, which layer is subsequently structured by way of laser ablation; and using a subsequent laser treatment to structure the activating layer in such a way that discrete conductive structures are formed, which are subsequently metallized.Type: ApplicationFiled: August 4, 2003Publication date: February 12, 2004Inventors: Jurgen Hupe, Walter Kronenberg, Jorg Kickelhain, Dieter J. Meier
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Patent number: 6589593Abstract: A process for coating substrates having polymer surfaces with metals in the manufacturing of printed circuit boards, in particular in the manufacturing of printed circuit boards having microscopic holes and fine geometries by the application of an electroconductive polymer layer and a subsequent metallization, wherein the electroconductive polymer layer is preferably doped with a zinc-containing, colloidal palladium solution prior to the metallization step, the electroconductive polymer is poly-3,4-ethylenedioxythiophene and a contacting with a copper(II) salt solution is performed prior to the metallization.Type: GrantFiled: November 15, 2000Date of Patent: July 8, 2003Assignee: Blasberg Oberflächentechnik GmbHInventors: Jürgen Hupe, Sabine Fix, Ortrud Steinius
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Patent number: 6576111Abstract: A process for the copper plating of substrates using insoluble anodes in acidic copper baths with separate replenishing of consumed copper ions, characterized in that the major portion of the copper ions is directly supplied in the form of copper carbonate and/or basic copper carbonate, dispensing with diaphragms and auxiliary electrolytes, in a separate tank operated in a bypass mode with respect to the working electrolyte, the released gaseous CO2 being separated off in said separate tank.Type: GrantFiled: December 28, 2000Date of Patent: June 10, 2003Assignee: Balsberg Oberflächentechnik GmbHInventors: Jürgen Hupe, Walter Kronenberg, Eugen Breitkreuz, Ulrich Schmergel
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Publication number: 20020157959Abstract: The object of the invention is to provide a process for electroplating a work piece (1) which is coated with an electrically conducting or modified polymer, wherein, independently of the work piece to be electroplated, it is possible to simultaneously reduce the current density and shorten the electroplating time. The invention includes, as a first step, that the work piece is connected to a current source (8) by multiple adjoining contact elements (5) and covered with a thin metallic coat, except at the points covered by the contact elements and that subsequently, in a second step, the contact elements are removed and an unbroken metal coat (10) is formed.Type: ApplicationFiled: December 19, 2001Publication date: October 31, 2002Inventors: Walter Kronenberg, Jurgen Hupe
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Patent number: 6007866Abstract: The process for producing through-connected printed circuit boards or multilayered printed circuit boards with a polymer base with conductive polymers using a combined desmearing and direct metalization process (multilayering) is performed by subjecting the polymer base materials, provided with bore holes, to the following process steps:1) swelling in a per se known treatment liquid and rinsing with water;2) treatment with alkaline permanganate solution (desmearing);3) rinsing with water;4) rinsing with acidic aqueous solution (pH value about 1, rinsing time 10 to 120 s, depending on acid content);5) rinsing with water;6) rinsing with alkaline aqueous solution (pH 8 to 9.5);7) rinsing with water;8) rinsing with microemulsion of ethylene-3,4-dioxythiophene (catalyst);9) rinsing with acid (fixation);10) rinsing with water;11) coppering;12) rinsing with water; and13) drying;14) usual process steps for creating the printed circuit pattern.Type: GrantFiled: March 13, 1998Date of Patent: December 28, 1999Assignee: Blasberg Oberflachentechnik GmbHInventors: Jurgen Hupe, Sabine Fix
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Patent number: 5373629Abstract: A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one photoresist layer temporarily exposing the electroconductive circuit pattern by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, characterized in thata) the surfaces of the substrate, after hole-drilling and a subsequent mechanical surface-treatment, are laminated with a suitable photoresist, exposed to light and developed so that the circuit pattern image is exposed,b) the surfaces of the substrate are pre-treated in a solution having oxidizing activity,c) after removal of the residual solution by rinsing, the substrate is introduced into a solution which contains at least one heterocyclic monomer, and more specifically pyrrole, thiophene, furane or derivative(s) thereof, which in a polymeric forType: GrantFiled: February 28, 1992Date of Patent: December 20, 1994Assignee: Blasberg-Oberflachentechnik GmbHInventors: Jurgen Hupe, Walter Kronenberg
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Patent number: 5194313Abstract: A process is described for manufacturing through-hole plated single-layer or multi-layer printed circuit boards based on a polymeric substrate material or on a ceramic material provided optionally on both sides with at least one electroconductive layer by electroplating or electroless plating with a metal layer also on those surfaces which have not been coated with a conductive metal layer, said process being characterized in thata) the surfaces of the substrate are pre-treated in a solution having oxidizing activity,b) after removal of the residual soltuion by rinsing, the substrate is introduced into a solution which contains at least one monomer, and more specifically pyrrole, furane, thiophene or derivative(s) thereof, which in a polymeric or copolymeric form is electrically conductive,c) the substrate is then transferred into an acidic solution whereby an electrically conductive polymeric layer is formed, more specifically of polymerized or copolymerized pyrrole, furane, thiophene or derivative(s) thereoType: GrantFiled: August 17, 1990Date of Patent: March 16, 1993Assignee: Blas-Berg-Oberflachentechnik GmbHInventors: Jurgen Hupe, Walter Kronenberg
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Patent number: 5145572Abstract: The process for manufacturing through-hole contacting plated printed circuit boards by direct metal electrodeposition on catalytically activated surfaces of the substrate material is improved by pre-treatment prior to electrodepositing the metal, preferably with a solution containing one or more nitrogen-containing organic compounds.Type: GrantFiled: December 9, 1991Date of Patent: September 8, 1992Assignee: Blasberg Oberflachentechnik GmbHInventors: Jurgen Hupe, Herbert Iwan
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Patent number: 4990395Abstract: Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areasa) are galvanically coated with a coating of a black metal in an acidic medium;b) the resist is removed and then the copper areas having been exposed thereby are removed by etching;c) the conductor plates are provided with an adhering solder mask;d) at those parts that are not covered by the solder mask the black metal coating is removed and, if desired, the copper areas exposed thereby are provided with a well solderable metal layer.Type: GrantFiled: May 16, 1988Date of Patent: February 5, 1991Assignee: Blasberg Oberflachentechnik GmbHInventors: Jurgen Hupe, Frank Sonnenschein, Herbert Breidenbach
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Patent number: 4750976Abstract: Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areas(a) are galvanically coated with a coating of a black metal in an acidic medium;(b) the resist is removed and then the copper areas having been exposed thereby are removed by etching;(c) the conductor plates are provided with an adhering solder mask;(d) at those parts that are not covered by the solder mask the black metal coating is removed and, if desired, the copper areas exposed thereby are provided with a well solderable metal layer.Type: GrantFiled: December 9, 1985Date of Patent: June 14, 1988Assignee: Blasberg Oberflachentechnik GmbHInventors: Jurgen Hupe, Frank Sonnenschein, Herbert Breidenbach