Patents by Inventor Justin Diep

Justin Diep has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11800685
    Abstract: Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: October 24, 2023
    Assignee: ARRIS Enterprises LLC
    Inventors: Justin Diep, Chien-Cheng Huang, John Hausman, Hai Lin
  • Publication number: 20210378134
    Abstract: Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.
    Type: Application
    Filed: August 12, 2021
    Publication date: December 2, 2021
    Applicant: ARRIS Enterprises LLC
    Inventors: Justin DIEP, Chien-Cheng HUANG, John HAUSMAN, Hai LIN
  • Patent number: 11122707
    Abstract: Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: September 14, 2021
    Assignee: ARRIS Enterprises LLC
    Inventors: Justin Diep, Chien-Cheng Huang, John Hausman, Hai Lin
  • Publication number: 20200022281
    Abstract: Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 16, 2020
    Inventors: Justin Diep, Chien-Cheng Huang, John Hausman, Hai Lin