Patents by Inventor Justin Wendt
Justin Wendt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240038564Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.Type: ApplicationFiled: August 14, 2023Publication date: February 1, 2024Inventors: Andrew Huska, Justin Wendt, Luke Dupin, Cody Peterson
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Publication number: 20230411185Abstract: An apparatus for transferring a semiconductor die (“die”) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A bridge holds a transfer mechanism assembly and a die substrate holder configured to hold the first substrate. A controller is configured to cause the bridge and the transfer mechanism assembly and the die substrate holder to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.Type: ApplicationFiled: May 25, 2022Publication date: December 21, 2023Inventors: Nicholas Steven Busch, Justin Wendt
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Publication number: 20230377917Abstract: An apparatus for a direct transfer of a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape and a second frame secures the substrate. The second frame holds the substrate such that a transfer surface is disposed facing the semiconductor device die on a first side of the wafer tape. A needle is disposed adjacent a second side of the wafer tape opposite the first side. A length of the needle extends in a direction toward the wafer tape. A first needle actuator is used to adjust an angle of the needle to align the die, wafer tape, and transfer surface at which point the needle presses on the second side of the wafer tape to press a semiconductor device die of the one or more semiconductor device die into contact with the transfer surface of the substrate.Type: ApplicationFiled: May 23, 2022Publication date: November 23, 2023Inventors: Sean Kupcow, Nicholas Steven Busch, Justin Wendt
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Patent number: 11728195Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.Type: GrantFiled: August 16, 2021Date of Patent: August 15, 2023Assignee: Rohinni, Inc.Inventors: Andrew Huska, Justin Wendt, Luke Dupin, Cody Peterson
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Patent number: 11728189Abstract: An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.Type: GrantFiled: July 12, 2021Date of Patent: August 15, 2023Assignee: Rohinni, Inc.Inventors: Justin Wendt, Cody Peterson, Andrew Huska
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Publication number: 20230245602Abstract: An electronic device includes a housing and an array of LEDs deposited on a substrate disposed in the housing. The array of LEDs is disposed to form an indicia via which a logo is displayable.Type: ApplicationFiled: January 6, 2023Publication date: August 3, 2023Inventors: Cody Peterson, Andrew Huska, Justin Wendt
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Patent number: 11551591Abstract: An electronic device includes a housing and an array of LEDs deposited on a substrate disposed in the housing. The array of LEDs is disposed to form an indicia via which a logo is displayable.Type: GrantFiled: May 30, 2017Date of Patent: January 10, 2023Assignee: Rohinni, LLCInventors: Cody Peterson, Andrew Huska, Justin Wendt
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Patent number: 11538699Abstract: An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The transfer surface includes ripples in a profile thereof such that an apex on an individual ripple is a point on a first plane and a trough on the individual ripple is a point on a second plane. The semiconductor die is disposed on the transfer surface between the first plane and the second plane such that the second surface of the semiconductor die extends transverse to the first plane and the second plane.Type: GrantFiled: May 15, 2019Date of Patent: December 27, 2022Assignee: Rohinni, LLCInventors: Cody Peterson, Andrew Huska, Justin Wendt
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Patent number: 11293603Abstract: An apparatus includes a coverlay layer having a void therein. A backing layer is disposed against a first side of the coverlay layer. A transmission layer is disposed against a second side of the coverlay layer opposite the first side such that a chamber is formed within the void between the transmission layer and the backing layer. The transmission layer includes a first area having a first level of light transmissivity and a second area having a second level of light transmissivity that is greater than the first level of light transmissivity. The transmission layer is oriented so that at least a portion of each of the first area and the second area overlaps the void. A light source is positioned in the chamber between the first area of the transmission layer and the backing layer.Type: GrantFiled: December 6, 2018Date of Patent: April 5, 2022Assignee: Rohinni, LLCInventors: Cody Peterson, Monica Hansen, Justin Wendt, Clint Adams, Andrew Huska
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Publication number: 20210375656Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.Type: ApplicationFiled: August 16, 2021Publication date: December 2, 2021Inventors: Andrew Huska, Justin Wendt, Luke Dupin, Cody Peterson
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Publication number: 20210343558Abstract: An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.Type: ApplicationFiled: July 12, 2021Publication date: November 4, 2021Inventors: Justin Wendt, Cody Peterson, Andrew Huska
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Patent number: 11094571Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.Type: GrantFiled: September 28, 2018Date of Patent: August 17, 2021Assignee: Rohinni, LLCInventors: Andrew Huska, Cody Peterson, Justin Wendt, Luke Dupin
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Patent number: 11069551Abstract: A method of dampening a force applied to an electrically-actuatable element during a transfer of the electrically-actuatable element from a first side of a first substrate to a second substrate. The method includes positioning a needle adjacent a second side of the first substrate opposite the first side of the first substrate. The needle is moved via a needle actuator to a position at which the needle presses on the second side of the first substrate to press the electrically-actuatable element into contact with the second substrate disposed adjacent the first side of the first substrate. A force applied to the electrically-actuatable element is dampened when the needle presses the electrically-actuatable element into contact with the second substrate.Type: GrantFiled: November 26, 2018Date of Patent: July 20, 2021Assignee: Rohinni, LLCInventors: Justin Wendt, Cody Peterson, Clinton Adams, Sean Kupcow, Andrew Huska
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Patent number: 11062923Abstract: An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.Type: GrantFiled: September 28, 2018Date of Patent: July 13, 2021Assignee: Rohinni, LLCInventors: Justin Wendt, Cody Peterson, Andrew Huska
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Publication number: 20210142700Abstract: An electronic device includes a housing and an array of LEDs deposited on a substrate disposed in the housing. The array of LEDs is disposed to form an indicia via which a logo is displayable.Type: ApplicationFiled: May 30, 2017Publication date: May 13, 2021Inventors: Cody Peterson, Andrew Huska, Justin Wendt
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Publication number: 20200105551Abstract: An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.Type: ApplicationFiled: September 28, 2018Publication date: April 2, 2020Inventors: Justin Wendt, Cody Peterson, Andrew Huska
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Publication number: 20200105566Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.Type: ApplicationFiled: September 28, 2018Publication date: April 2, 2020Inventors: Andrew Huska, Cody Peterson, Justin Wendt, Luke Dupin
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Patent number: 10471545Abstract: An apparatus includes a needle including a hole extending from a first end to a second end through the needle and an energy-emitting device arranged in the hole of the needle. The energy-emitting device being configured to emit a specific wavelength and intensity of energy directed at an electrically-actuatable element to bond a circuit trace and the electrically-actuatable element.Type: GrantFiled: November 23, 2016Date of Patent: November 12, 2019Assignee: Rohinni, LLCInventors: Justin Wendt, Andrew Huska, Cody Peterson
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Publication number: 20190267265Abstract: An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The transfer surface includes ripples in a profile thereof such that an apex on an individual ripple is a point on a first plane and a trough on the individual ripple is a point on a second plane. The semiconductor die is disposed on the transfer surface between the first plane and the second plane such that the second surface of the semiconductor die extends transverse to the first plane and the second plane.Type: ApplicationFiled: May 15, 2019Publication date: August 29, 2019Inventors: Cody Peterson, Andrew Huska, Justin Wendt
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Patent number: 10309589Abstract: An apparatus includes a coverlay layer having a void therein. A backing layer is disposed against a first side of the coverlay layer. A transmission layer is disposed against a second side of the coverlay layer opposite the first side such that a chamber is formed within the void between the transmission layer and the backing layer. The transmission layer includes a first area having a first level of light transmissivity and a second area having a second level of light transmissivity that is greater than the first level of light transmissivity. The transmission layer is oriented so that at least a portion of each of the first area and the second area overlaps the void. A light source is positioned in the chamber between the first area of the transmission layer and the backing layer.Type: GrantFiled: May 13, 2016Date of Patent: June 4, 2019Assignee: Rohinni, LLCInventors: Cody Peterson, Monica Hansen, Justin Wendt, Clint Adams, Andrew Huska