Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: A segmented optical modulator includes two optical modulator segments located along a main face of a photonic chip, and two RF transmission lines connected to drive a corresponding one of the two optical modulator segments. A signal electrode of one of the transmission lines includes a segment that is vertically capacitively coupled to a plurality of spaced ground-connected metallic elements disposed in sequence along a length of the segment above or below thereof so as to be capacitively coupled thereto.

Abstract: An electro-optic device, such as an optical modulator, comprises: a driver for generating a plurality of identical time-synchronized copies of an input electrical signal, and a photonic integrated circuit, including an optical waveguide structure and a plurality of phase-modulating electro-optical modulator segments. Each one of the modulator segments configured to receive a respective one of the plurality of the copies of the input electrical signal. Instead of incorporating a required phase delay between the copies of the input electrical signal into the driver structure, a multi-layer interconnect substrate is provided that includes a plurality of insulating layers alternating with a plurality of conductive layers.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: A modular assembly for opto-electronic systems has a substrate on which various photonic integrated circuit (PIC) chips and electronic integrated circuit (EIC) chips are mounted. One or more waveguide (WG) chips mounted on the substrate align the optical communication between the PIC chips and fiber blocks for optical fibers. Preconfigured electrical connections in the substrate allow the PIC and EIC chips to communicate with one another and to communicate with solder bumps on the substrate for integration of the modular assembly with other electronic components.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical absorption based device using a semiconductor-dielectric-semiconductor structure. In one embodiment, the device may include an optical waveguide to transmit light inputted by a light source. The waveguide may include a first semiconductor layer, a second semiconductor layer disposed above the first semiconductor layer, a dielectric layer disposed between the first and second semiconductor layers, and an absorptive material layer disposed between the dielectric layer and the first or second semiconductor layer. The absorptive material layer may have a variable light absorption coefficient to allow intensity of light to be modulated through modulation of the absorption coefficient. The light may be substantially confined between the first and second semiconductor layers of the waveguide. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for an optical absorption based device using a semiconductor-dielectric-semiconductor structure. In one embodiment, the device may include an optical waveguide to transmit light inputted by a light source. The waveguide may include a first semiconductor layer, a second semiconductor layer disposed above the first semiconductor layer, a dielectric layer disposed between the first and second semiconductor layers, and an absorptive material layer disposed between the dielectric layer and the first or second semiconductor layer. The absorptive material layer may have a variable light absorption coefficient to allow intensity of light to be modulated through modulation of the absorption coefficient. The light may be substantially confined between the first and second semiconductor layers of the waveguide. Other embodiments may be described and/or claimed.