Patents by Inventor Juying Dou
Juying Dou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8218284Abstract: An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer and electric contact pins (within an electrostatic chuck) is provided to significantly reduce the scratch and damage on the wafer backside.Type: GrantFiled: July 24, 2008Date of Patent: July 10, 2012Assignee: Hermes-Microvision, Inc.Inventors: Zhong-Wei Chen, Yi Xiang Wang, Juying Dou
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Publication number: 20120098409Abstract: This invention relates to a filament for electron emission cathode which is employed in an electron microscope, a critical dimension examine tool, an electron beam lithograph machine, an electron beam tester and other electron beam related systems as an electron source. Embodiments of the present invention discloses method with which a Re (Rhenium) is used as heat source such that vibration issue of prior tungsten filament can be depressed.Type: ApplicationFiled: October 21, 2010Publication date: April 26, 2012Applicant: HERMES MICROVISION, INC.Inventor: Juying DOU
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Patent number: 8094428Abstract: An apparatus for increasing electric conductivity to a wafer substrate, when exposed to electron beam irradiation, is disclosed. More specifically, a methodology to breakdown the insulating layer on wafer backside is provided to significantly reduce the damage on the wafer backside while proceeding with the grounding process.Type: GrantFiled: October 27, 2008Date of Patent: January 10, 2012Assignee: Hermes-Microvision, Inc.Inventors: Yi Xiang Wang, Juying Dou, Kenichi Kanai, Jun Jiang, Zheng Fan, Qingyu Meng, Jay Chen
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Patent number: 8022609Abstract: A thermal field emission cathode which is employed in an electron microscope, a critical dimension examine tool, an electron beam lithograph machine, an electron beam tester and other electron beam related systems as an electron source is disclosed. Embodiments disclose changing coating shape, coating position and shorten emitter length to extend the lifetime of the field emission cathode.Type: GrantFiled: June 24, 2008Date of Patent: September 20, 2011Assignee: Hermes-Microvision, Inc.Inventors: Zhong-Wei Chen, Juying Dou
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Patent number: 7960697Abstract: The present invention relates to a charged particle beam apparatus which employs a scanning electron microscope for sample inspection and defect review. The present invent provides solution of improving imaging resolution by utilizing a field emission cathode tip with a large tip radius, applying a large accelerating voltage across ground potential between the cathode and anode, positioning the beam limit aperture before condenser lens, utilizing condenser lens excitation current to optimize image resolution, applying a high tube bias to shorten electron travel time, adopting and modifying SORIL objective lens to ameliorate aberration at large field of view and under electric drifting and reduce the urgency of water cooling objective lens while operating material analysis. The present invent provides solution of improving throughput by utilizing fast scanning ability of SORIL and providing a large voltage difference between sample and detectors.Type: GrantFiled: October 23, 2008Date of Patent: June 14, 2011Assignee: Hermes-Microvision, Inc.Inventors: Zhongwei Chen, Weiming Ren, Joe Wang, Xuedong Liu, Juying Dou, Fumin He, Feng Cao, Yan Ren, Xiaoli Guo, Wei He, Qingpo Xi
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Publication number: 20110084591Abstract: A thermal field emission cathode which is employed in an electron microscope, a critical dimension examine tool, an electron beam lithograph machine, an electron beam tester and other electron beam related systems as an electron source is disclosed. Embodiments disclose changing coating shape, coating position and shorten emitter length to extend the lifetime of the field emission cathode.Type: ApplicationFiled: December 17, 2010Publication date: April 14, 2011Applicant: HERMES-MICROVISION, INC.Inventors: Zhong-Wei CHEN, Juying Dou
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Publication number: 20110051306Abstract: A wafer grounding apparatus and method adaptable to a charged particle beam apparatus is disclosed. A wafer substrate is supported by a wafer mount. A grounding pin is arranged to be in contact with a backside film formed on a backside of the wafer substrate. A grounding pulse generator provides at least one pulse to drive the grounding pin such that dielectric breakdown occurring at the backside film leads to establishment of a current path through the backside films. Accordingly, a current flows in the wafer substrate through this current path and then flows out of the wafer substrate via at least one current return path formed from capacitive coupling between the wafer substrate and the wafer mount.Type: ApplicationFiled: September 1, 2009Publication date: March 3, 2011Applicant: HERMES MICROVISION, INC.Inventors: YI-XIANG WANG, JUYING DOU, KENICHI KANAI
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Patent number: 7759653Abstract: The present invention includes an electron beam device for examining defects on semiconductor devices. The device includes an electron source for generating a primary electron beam, wherein the total acceleration potential is divided and is provided across the ground potential. Also included is at least one condenser lens for pre-focusing the primary electron beam, an aperture for confining the primary electron beam to ameliorate electron-electron interaction, wherein the aperture is positioned right underneath the last condenser lens, and a SORIL objective lens system for forming immersion magnetic field and electrostatic field to focus the primary beam onto the specimen in the electron beam path. A pair of grounding rings for providing virtual ground voltage potential to those components within the electron beam apparatus installed below a source anode and above a last polepiece of the SORIL objective lens.Type: GrantFiled: May 30, 2008Date of Patent: July 20, 2010Assignee: Hermes Microvision, Inc.Inventors: Zhong-Wei Chen, Xuedong Liu, Xu Zhang, Weiming Ren, Juying Dou
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Publication number: 20100102227Abstract: The present invention relates to a charged particle beam apparatus which employs a scanning electron microscope for sample inspection and defect review. The present invent provides solution of improving imaging resolution by utilizing a field emission cathode tip with a large tip radius, applying a large accelerating voltage across ground potential between the cathode and anode, positioning the beam limit aperture before condenser lens, utilizing condenser lens excitation current to optimize image resolution, applying a high tube bias to shorten electron travel time, adopting and modifying SORIL objective lens to ameliorate aberration at large field of view and under electric drifting and reduce the urgency of water cooling objective lens while operating material analysis. The present invent provides solution of improving throughput by utilizing fast scanning ability of SORIL and providing a large voltage difference between sample and detectors.Type: ApplicationFiled: October 23, 2008Publication date: April 29, 2010Applicant: HERMES-MICROVISION, INCInventors: ZHONGWEI CHEN, WEIMING REN, JOE WANG, XUEDONG LIU, JUYING DOU, FUMIN HE, FENG CAO, YAN REN, XIAOLI GUO, WEI HE, QINGPO XI
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Publication number: 20100103583Abstract: An apparatus for increasing electric conductivity to a wafer substrate, when exposed to electron beam irradiation, is disclosed. More specifically, a methodology to breakdown the insulating layer on wafer backside is provided to significantly reduce the damage on the wafer backside while proceeding with the grounding process.Type: ApplicationFiled: October 27, 2008Publication date: April 29, 2010Applicant: HERMES-MICROVISION, INC.Inventors: YI XIANG WANG, JUYING DOU, JUN JIANT, ZHENG FAN, QINGYU MENG
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Publication number: 20100019462Abstract: An apparatus for increasing electric conductivity to a wafer substrate when exposures to electron beam irradiation is disclosed. More specifically, a more free mechanical contact between a wafer and electric contact pins (within an electrostatic chuck) is provided to significantly reduce the scratch and damage on the wafer backside.Type: ApplicationFiled: July 24, 2008Publication date: January 28, 2010Applicant: Hermes-Microvision, Inc.Inventors: Zhong-Wei CHEN, Yi Xiang Wang, Juying Dou
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Publication number: 20090315444Abstract: A thermal field emission cathode which is employed in an electron microscope, a critical dimension examine tool, an electron beam lithograph machine, an electron beam tester and other electron beam related systems as an electron source is disclosed. Embodiments disclose changing coating shape, coating position and shorten emitter length to extend the lifetime of the field emission cathode.Type: ApplicationFiled: June 24, 2008Publication date: December 24, 2009Applicant: Hermes-Microvision, Inc.Inventors: Zhong-Wei Chen, Juying Dou
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Publication number: 20090294664Abstract: The present invention includes an electron beam device for examining defects on semiconductor devices. The device includes an electron source for generating a primary electron beam, wherein the total acceleration potential is divided and is provided across the ground potential. Also included is at least one condenser lens for pre-focusing the primary electron beam, an aperture for confining the primary electron beam to ameliorate electron-electron interaction, wherein the aperture is positioned right underneath the last condenser lens, and a SORIL objective lens system for forming immersion magnetic field and electrostatic field to focus the primary beam onto the specimen in the electron beam path. A pair of grounding rings for providing virtual ground voltage potential to those components within the electron beam apparatus installed below a source anode and above a last polepiece of the SORIL objective lens.Type: ApplicationFiled: May 30, 2008Publication date: December 3, 2009Applicant: HERMES MICROVISION, INC.Inventors: Zhong-Wei Chen, Xuedong Liu, Xu Zhang, Weiming Ren, Juying Dou