Abstract: An electrical connector for electrically connecting pins of an external electrical device with a printed circuit board comprises an insulative housing, a plurality of contact-receiving passages defined in the insulative housing, and a plurality of contacts secured in corresponding contact-receiving passages. The insulative housing has stopping blocks which are positioned beside the contact-receiving passages for blocking the pins of the external electrical device.

Abstract: A ball grid array socket connector (1) includes an insulative base (10), a number of conductive contacts (18) fixed to the base, a number of solder balls (30) attached to tail portions (32) of corresponding contacts and a cover (20) movably attached to the base. The base has a top surface (14), a bottom surface (16) and defines a number of cavities (12) through the top surface and the bottom surface. The cavities are arranged in a matrix. The contacts are received in corresponding cavities of the base. The base provides a number of stand-offs (28) which downwardly protrude from the bottom surface of the base and terminate at a plane (D) generally parallel with the bottom surface of the base. The solder balls each have a bottom tip (31) that downwardly extends beyond the plane D. The base defines a number of notches (26) in the bottom surface thereof. The notches are located at outer sides of the matrix of cavities.

Abstract: A ZIF socket (1) for receiving pins (6) of a CPU includes a dielectric base (3), a cover (4) movably mounted on the dielectric base, and a plurality of contacts (2) received in the base. Each contact comprises a soldering section (20), a retaining section (21) secured within a passageway (30) of the base, a connecting section (23), and a contacting section (22) for electrically connecting with the pin. An L-shaped portion (25) is formed by the contacting section and the connecting section. A guiding section (24) extends along an inner edge of the L-shaped portion and is coined in a blade-shape.

Abstract: An LGP connector comprises an insulative housing and a plurality of contacts. The housing defines a plurality of passageway sections for receiving the contacts therein. Each contact includes a soldering base for soldering the contact to a printed circuit board and an upper contact beam for electrically connecting the contact with an LGP chip, thereby electrically connecting the chip with the printed circuit board. Each contact comprises a pair of anti-rotation tabs extending from an end of the soldering base, and each passageway section transversely defines an anti-rotation cavity in a bottom face thereof and at a first side wall thereof for retaining the anti-rotation tabs of the contact.

Abstract: A connector comprises an insulative housing in which a plurality of passageways are defined. A plurality of contacts are received in the passageways. Each contact comprises an engagement plate loosely retained in the passageway, a positioning section connected to the engagement plate via a first flexible neck and mounted thereon a solder ball, a contacting section located above the positioning section and connected to the positioning section via a second flexible neck. When the solder ball is soldered on a printed circuit board and the housing and the contact is urged by an external electrical device, the housing is moved downward with respect to the engagement plate of the contact and the contacting section is pressed downward by the external electrical device, with the second flexible neck being deformed for providing a normal force facilitating the contacting section to abut against the external electrical device.

Abstract: A contact comprises a plate, a positioning section connected to the plate via a first flexible neck and adapted to be mounted by an external solder ball, a contacting section located above and connected to the positioning section via a second flexible neck. The first flexible neck is deformable to absorb a tension originated from the plate. The second flexible neck is deformable to force the contacting section to abut against an external electrical device when the external electrical device urges the contacting section to electrically connect to the solder ball via the contact.