Abstract: An apparatus and related method for preventing leakage of process gases or liquids from a semiconductor wafer processing system, such as an oxidizing furnace. A specific embodiment of the present invention provides a method of preventing leakage of process gases or liquids from a joint of external piping and piping in a semiconductor wafer processing system. The method includes installing as the external piping a tube. The tube has a flange shaped to accommodate an O-ring. The method also includes providing an O-ring for use with the flange, and fastening the O-ring between the flange and the piping with a fastening mechanism to prevent leakage of process gases or liquids from the joint. Yet another embodiment provides a retrofit to existing external piping. A further embodiment provides an apparatus for processing semiconductor substrates that includes use of the O-ring, fastening mechanism and tube with flange.

Abstract: The present invention discloses a detachable torch for providing heat source for a horizontal quartz tube in the process of wet oxygen. The invention includes a combustion chamber, a heating pipe, an oxygen inlet pipe, a hydrogen inlet pipe, and a coupling device. The hydrogen inlet pipe is coupled to the heating pipe via a coupling device. The removal of the coupling device departs the hydrogen inlet pipe from the heating pipe. Thus, when the mouth of the hydrogen inlet pipe gets brittle due to tempering and needs replacement, we only need to replace the hydrogen inlet pipe instead of the entire torch.