Abstract: A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface.

Abstract: A tunable PLC optical filter having sequentially connected thermally tunable Mach-Zehnder (MZ) interferometers is described. The MZ interferometers, having free spectral ranges matching ITU frequency grid spacing, are tuned so as to have a common passband centered on the frequency of the signal being selected, while having at least one of the stopbands centered on any other ITU frequency. Any other optical channel that may be present at any other ITU frequency is suppressed as a result. The PLC chip, including a zero-dispersion lattice-filter interleaver stage, a switchable fine-resolution stage and, or a retroreflector for double passing the filter, is packaged into a hot-pluggable XFP transceiver package. A compensation heater is used to keep constant the amount of heat applied to the PLC chip inside the XFP package, so as to lessen temperature variations upon tuning of the PLC optical filter.

Abstract: An optical device for rearranging wavelength channels in an optical network is disclosed. The optical device has a wavelength selective coupler having one input port and a plurality of output ports coupled to a plurality of input ports of an optical grating demultiplexor such as an arrayed waveguide grating. The wavelength channels in each of the input ports are dispersed by the demultiplexor and are directed to a plurality of output ports of the optical grating demultiplexor. As a result, at least one wavelength channel at each of the input ports of the optical grating demultiplexor is coupled into a common output port. The optical device is useful in passive optical networks wherein a same demultiplexor is used for simultaneous multiplexing and demultiplexing of wavelength channels.

Abstract: An optical device for rearranging wavelength channels in an optical network is disclosed. The optical device has a wavelength selective coupler having one input port and a plurality of output ports coupled to a plurality of input ports of an optical grating demultiplexor such as an arrayed waveguide grating. The wavelength channels in each of the input ports are dispersed by the demultiplexor and are directed to a plurality of output ports of the optical grating demultiplexor. As a result, at least one wavelength channel at each of the input ports of the optical grating demultiplexor is coupled into a common output port. The optical device is useful in passive optical networks wherein a same demultiplexor is used for simultaneous multiplexing and demultiplexing of wavelength channels.

Abstract: A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface.

Abstract: A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface.

Abstract: A tunable PLC optical filter having sequentially connected thermally tunable Mach-Zehnder (MZ) interferometers is described. The MZ interferometers, having free spectral ranges matching ITU frequency grid spacing, are tuned so as to have a common passband centered on the frequency of the signal being selected, while having at least one of the stopbands centered on any other ITU frequency. Any other optical channel that may be present at any other ITU frequency is suppressed as a result. The PLC chip, including a zero-dispersion lattice-filter interleaver stage, a switchable fine-resolution stage and, or a retroreflector for double passing the filter, is packaged into a hot-pluggable XFP transceiver package. A compensation heater is used to keep constant the amount of heat applied to the PLC chip inside the XFP package, so as to lessen temperature variations upon tuning of the PLC optical filter.

Abstract: A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface.

Abstract: A wafer-scale probe card for temporary electrical contact to a sample wafer or other device, for burn-in and test. The card includes a plurality of directly metallized single-walled or multi-walled nanotubes contacting a pre-arranged electrical contact pattern on the probe card substrate. The nanotubes are arranged into bundles for forming electrical contacts between areas of the device under test and the probe card. The bundles are compressible along their length to allow a compressive force to be used for contacting the probe card substrate to the device under test. A strengthening material may be disposed around and/or infiltrate the bundles. The nanotubes forming the bundles may be patterned to provide a pre-determined bundle profile. Tips of the bundles may be metallized with a conductive material to form a conformal coating on the bundles; or metallized with a conductive material to form a continuous, single contact surface.