Abstract: A flexible inflatable hinge includes curable resin for rigidly positioning panels of solar cells about the hinge in which wrap around contacts and flex circuits are disposed for routing power from the solar cells to the power bus further used for grounding the hinge. An indium tin oxide and magnesium fluoride coating is used to prevent static discharge while being transparent to ultraviolet light that cures the embedded resin after deployment for rigidizing the inflatable hinge.

Abstract: A boom structure deployed by inflating the structure to a desired shape and rigidizing the structure via an external influence. The structure frame has a series of frame members which are made of a fibrous material and a resin material. This frame is encased in between a pair of membrane layers, an inner membrane inflatable to move the frame into its desired shape and an outer membrane that allows for folding the structure. Following inflation of the inner layer, an external influence acts on the resin material to solidify it, and render the structure rigid. The external influence may also act on the resin material to soften it when it is already rigid, to allow for collapsing and folding of the structure.

Abstract: A boom structure deployed by inflating the structure to a desired shape and rigidizing the structure via an external influence. The structure frame has a series of frame members which are made of a fibrous material and a resin material. This frame is encased in between a pair of membrane layers, an inner membrane inflatable to move the frame into its desired shape and an outer membrane that allows for folding the structure. Following inflation of the inner layer, an external influence acts on the resin material to solidify it, and render the structure rigid. The external influence may also act on the resin material to soften it when it is already rigid, to allow for collapsing and folding of the structure.

Abstract: The present invention provides a semiconductor device packaging assembly and method for manufacturing the assembly. Preferably, the method of the present invention is used to assemble a plurality of semiconductor chips, such that the throughput of assembly can be enhanced. The method comprises the steps of: providing a bottom frame matrix including a plurality of bottom frame units, each of which unit comprises a bottom supporting portion and a bottom frame portion; providing a bridge frame including a plurality of bridge frame units, each of which unit comprises a bridge frame portion and a plurality of conducting bars; placing each of the semiconductor chips on each of the bottom supporting portions, respectively, and bonding each bottom frame unit and each bridge frame unit together, wherein, the conducting bars extending from each bridge frame portion toward corresponding chips are electrically coupled to bonding areas of the corresponding chips.

Abstract: The present invention provides a semiconductor device packaging assembly and method for manufacturing the assembly. Preferably, the method of the present invention is used to assemble a plurality of semiconductor chips, such that the throughput of assembly can be enhanced. The method comprises the steps of: providing a bottom frame matrix including a plurality of bottom frame units, each of which unit comprises a bottom supporting portion and a bottom frame portion; providing a bridge frame including a plurality of bridge frame units, each of which unit comprises a bridge frame portion and a plurality of conducting bars; placing each of the semiconductor chips on each of the bottom supporting portions, respectively; and bonding each bottom frame unit and each bridge frame unit together, wherein, the conducting bars extending from each bridge frame portion toward corresponding chips are electrically coupled to bonding areas of the corresponding chips.