Patents by Inventor Ka-Shing Li

Ka-Shing Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240116126
    Abstract: An ultrasonic transducer includes an elongated transducer body with an aperture for mounting a piezoelectric driver stack for driving the ultrasonic transducer to operate at a first resonant frequency, a mounting flange for mounting the transducer body to a wire bonding machine, a rigid connecting member having first and second ends which are respectively connected to the mounting flange and the transducer body at a first nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency and a flexible connecting member extending between the mounting flange and the transducer body at a second nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency.
    Type: Application
    Filed: October 11, 2022
    Publication date: April 11, 2024
    Inventors: Tsz Kit YU, Ka Shing KWAN, Hoi Ting LAM, Hing Leung LI
  • Publication number: 20240116127
    Abstract: An ultrasonic transducer that is configured to selectively operate at first or second resonant frequency during wire bonding operations includes an elongated transducer body an aperture for mounting a piezoelectric driver stack for driving the ultrasonic transducer to operate at the first or second resonant frequency and a mounting flange connected to the transducer body at a first nodal vibration region of the transducer body when the ultrasonic transducer is operated at the first resonant frequency. The elongated transducer has a length substantially equal to two wavelengths of a first oscillatory wave that is transmitted along the length of the transducer body when the transducer is operated at the first resonant frequency, and substantially equal to a half wavelength of a second oscillatory wave that is transmitted along the length of the transducer body when the transducer is operated at the second resonant frequency.
    Type: Application
    Filed: August 2, 2023
    Publication date: April 11, 2024
    Inventors: Tsz Kit YU, Ka Shing KWAN, Hoi Ting LAM, Hing Leung LI
  • Patent number: 8809121
    Abstract: A method of dividing a two dimensional array of encapsulated integrated circuits into individual integrated circuit packages uses a first series of parallel cuts (32) extending fully through the leadframe (16) and encapsulation layer (14), and defining rows of the array. The cuts terminate before the beginning and end of the rows such that the integrity of the array is maintained by edge portions (34) at the ends of the rows. After plating contact pads (18), a second series of parallel cuts (36) is made extending fully through the leadframe (16) and encapsulation layer (14). This separates the array into columns thereby providing singulation of packages between the edge portions (34).
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: August 19, 2014
    Assignee: NXP B.V.
    Inventors: Martin Ka Shing Li, Max Leung, Pompeo Umali
  • Publication number: 20130302945
    Abstract: A method of dividing a two dimensional array of encapsulated integrated circuits into individual integrated circuit packages uses a first series of parallel cuts (32) extending fully through the leadframe (16) and encapsulation layer (14), and defining rows of the array. The cuts terminate before the beginning and end of the rows such that the integrity of the array is maintained by edge portions (34) at the ends of the rows. After plating contact pads (18), a second series of parallel cuts (36) is made extending fully through the leadframe (16) and encapsulation layer (14). This separates the array into columns thereby providing singulation of packages between the edge portions (34).
    Type: Application
    Filed: September 29, 2010
    Publication date: November 14, 2013
    Applicant: NXP B.V.
    Inventors: Martin Ka Shing Li, Max Leung, Pompeo Umali
  • Patent number: 7595565
    Abstract: A do-it-yourself wind power generation wall includes a plurality of wind power generation modules, each having a bushing, a wind power generation unit and a connecting rod. The exterior of the bushing forms a plurality of insert portions, and the wind power generation unit includes an electric generator connected to the bushing, and a vane wheel connected to the electric generator and formed on a side of the bushing, and an end of the connecting rod is sheathed onto an insert portion of the bushing, and each wind power generation module is connected to form a power generation wall. The invention allows users to freely install the power generation wall according to the environment of the application and greatly enhances the site and scope of using the power generation wall.
    Type: Grant
    Filed: August 14, 2007
    Date of Patent: September 29, 2009
    Assignee: Jetpro Technology Inc.
    Inventors: Shih H Chen, Ka-Shing Li
  • Publication number: 20090045633
    Abstract: A do-it-yourself wind power generation wall includes a plurality of wind power generation modules, each having a bushing, a wind power generation unit and a connecting rod. The exterior of the bushing forms a plurality of insert portions, and the wind power generation unit includes an electric generator connected to the bushing, and a vane wheel connected to the electric generator and formed on a side of the bushing, and an end of the connecting rod is sheathed onto an insert portion of the bushing, and each wind power generation module is connected to form a power generation wall. The invention allows users to freely install the power generation wall according to the environment of the application and greatly enhances the site and scope of using the power generation wall.
    Type: Application
    Filed: August 14, 2007
    Publication date: February 19, 2009
    Inventors: Shih H. CHEN, Ka-Shing Li