Patents by Inventor Kabirkumar J. Mirpuri

Kabirkumar J. Mirpuri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE ON SUBSTRATE PACKAGE
    Publication number: 20170053858
    Abstract: Embodiments herein may relate to a patch on interposer (PoINT) architecture. In embodiments, the PoINT architecture may include a plurality of solder joints between a patch and an interposer. The solder joints may include a relatively high temperature solder ball and a relatively low temperature solder paste that at least partially surrounds the solder ball. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: August 20, 2015
    Publication date: February 23, 2017
    Inventors: Jan Krajniak, Carl L. Deppisch, Kabirkumar J. Mirpuri, Hongjin Jiang, Fay Hua, Yuying Wei, Beverly J. Canham, Jiongxin Lu, Mukul P. Renavikar
  • FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS
    Publication number: 20170042043
    Abstract: A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
    Type: Application
    Filed: October 21, 2016
    Publication date: February 9, 2017
    Inventors: SIVAKUMAR NAGARAJAN, SANDEEP RAZDAN, NISHA ANANTHAKRISHNAN, CRAIG J. WEINMAN, KABIRKUMAR J. MIRPURI
  • Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process
    Patent number: 9504168
    Abstract: A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: November 22, 2016
    Inventors: Sivakumar Nagarajan, Sandeep Razdan, Nisha Ananthakrishnan, Craig J. Weinman, Kabirkumar J. Mirpuri
  • HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
    Publication number: 20160260679
    Abstract: Apparatuses, processes, and systems related to an interconnect with an increased z-height and decreased reflow temperature are described herein. In embodiments, an interconnect may include a solder ball and a solder paste to couple the solder ball to a substrate. The solder ball and/or solder paste may be comprised of an alloy with a relatively low melting point and an alloy with a relatively high melting point.
    Type: Application
    Filed: March 27, 2014
    Publication date: September 8, 2016
    Applicant: Intel Corporation
    Inventors: Kabirkumar J. Mirpuri, Hongjin Jiang, Tyler N. Osborn, Rajen S. Sidhu, Ibrahim Bekar, Susheel G. Jadhav
  • FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS
    Publication number: 20130263446
    Abstract: A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5.
    Type: Application
    Filed: September 30, 2011
    Publication date: October 10, 2013
    Applicant: Intel Corporation
    Inventors: Sivakumar Nagarajan, Sandeep Razdan, Nisha Ananthakrishnan, Craig J. Weinman, Kabirkumar J. Mirpuri