Patents by Inventor Kabul Sengupta

Kabul Sengupta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Windowed package having embedded frame
    Patent number: 7223631
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
    Type: Grant
    Filed: February 22, 2006
    Date of Patent: May 29, 2007
    Assignee: Intel Corporation
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Windowed package having embedded frame
    Publication number: 20060141674
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
    Type: Application
    Filed: February 22, 2006
    Publication date: June 29, 2006
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah Thompson
  • Windowed package having embedded frame
    Patent number: 7026707
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: April 11, 2006
    Assignee: Intel Corporation
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Imaging device with liquid crystal shutter
    Publication number: 20040212724
    Abstract: An imaging device may include a package which mounts a liquid crystal shutter and a imaging sensor in an advantageous relationship to provide a compact footprint and improved connectability between the shutter, the imaging sensor and other components of the imaging device. The package may include a first surface which electrically couples the imaging sensor and a second surface which mounts the liquid crystal shutter. Flexible contact pins may be provided on an upper surface of the package to electrically couple the liquid crystal shutter.
    Type: Application
    Filed: May 13, 2004
    Publication date: October 28, 2004
    Inventors: Edward J. Bawolek, Kabul Sengupta, Tonia G. Morris
  • Windowed package having embedded frame
    Publication number: 20040159902
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a top surface, a bottom surface, and a top-to-bottom opening therein. The die is attached to the mold compound, wherein the embedded frame lies below a periphery of the die. The window is attached to the mold compound and located above the die to allow light to reach the die.
    Type: Application
    Filed: February 11, 2004
    Publication date: August 19, 2004
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Windowed non-ceramic package having embedded frame
    Patent number: 6692993
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
    Type: Grant
    Filed: April 10, 2000
    Date of Patent: February 17, 2004
    Assignee: Intel Corporation
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Plastic light selective element for imaging applications
    Patent number: 6623666
    Abstract: An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element including a plastic element and a dye.
    Type: Grant
    Filed: September 13, 2000
    Date of Patent: September 23, 2003
    Assignee: Intel Corporation
    Inventors: Edward J. Bawolek, Kabul Sengupta, Zong-Fu Li
  • Microlens for surface mount products
    Patent number: 6611036
    Abstract: A photosensitive device with a microlens array may be packaged for surface mount packaging and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: August 26, 2003
    Assignee: Intel Corporation
    Inventors: Azar Assadi, Parvin Mossahebi, Kabul Sengupta
  • Plastic light selective element for imaging applications
    Patent number: 6573503
    Abstract: An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element including a plastic element and a dye.
    Type: Grant
    Filed: September 13, 2000
    Date of Patent: June 3, 2003
    Assignee: Intel Corporation
    Inventors: Edward J. Bawolek, Kabul Sengupta, Zong-Fu Li
  • Microlens for surface mount products
    Patent number: 6540946
    Abstract: A photosensitive device with a microlens array may be packaged for surface mount packaging and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: April 1, 2003
    Assignee: Intel Corporation
    Inventors: Azar Assadi, Parvin Mossahebi, Kabul Sengupta
  • Microlens for surface mount products
    Patent number: 6452154
    Abstract: A photosensitive device with a microlens array may be packaged for surface mount packaging and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.
    Type: Grant
    Filed: October 4, 2000
    Date of Patent: September 17, 2002
    Assignee: Intel Corporation
    Inventors: Azar Assadi, Parvin Mossahebi, Kabul Sengupta
  • Windowed non-ceramic package having embedded frame
    Publication number: 20020125552
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
    Type: Application
    Filed: April 10, 2000
    Publication date: September 12, 2002
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Microlens for surface mount products
    Publication number: 20010052629
    Abstract: A photosensitive device with a microlens array may be packaged for surface mount packaging and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.
    Type: Application
    Filed: July 31, 2001
    Publication date: December 20, 2001
    Inventors: Azar Assadi, Parvin Mossahebi, Kabul Sengupta
  • Microlens for surface mount products
    Patent number: 6297540
    Abstract: A photosensitive device with a microlens array may be packaged for surface mount packaging and subsequent mass reflow processing without significantly degrading the optical performance of the microlens. The microlens may be formed using a series of heat steps of increasing time and temperature. In addition, the microlens may be bleached to prevent degradation of its optical transmissivity at temperatures normally associated with surface mount techniques.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: October 2, 2001
    Assignee: Intel Corporation
    Inventors: Azar Assadi, Parvin Mossahebi, Kabul Sengupta
  • Light selective element for imaging applications
    Patent number: 6169280
    Abstract: An image sensing device including a package having opposing side portions, an imaging sensor having a top side portion, and a light selective element coupled to the opposing side portions and overlying the top side portion of the imaging sensor.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: January 2, 2001
    Assignee: Intel Corporation
    Inventors: Edward J. Bawolek, Kabul Sengupta, Zong-Fu Li, Curtis Corum
  • Plastic light selective element for imaging applications
    Patent number: 6169283
    Abstract: An image sensing device including an imaging sensor, a package having opposing side portions, and an infrared light selective element coupled to the opposing side portions and overlying a top side portion of the imaging sensor, the selective element including a plastic element and a dye.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: January 2, 2001
    Assignee: Intel Corporation
    Inventors: Edward J. Bawolek, Kabul Sengupta, Zong-Fu Li
  • Chemically stabilized light selective element for imaging applications
    Patent number: 6163026
    Abstract: An imaging system having an imaging sensor providing sensor signals in response to incident light and control signals, control circuitry configured to generate control signals for controlling said imaging sensor, signal processing circuitry for generating image data in response to said sensor signals, and a light selective element for selecting the incident light encountered by said imaging sensor, the light selective element comprising an ionically-colored glass having a surface that is treated with a chemical stabilizer.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: December 19, 2000
    Assignee: Intel Corporation
    Inventors: Edward J. Bawolek, Kabul Sengupta
  • Passivation protection of sensor devices having a color filter on non-sensor portion
    Patent number: 6111247
    Abstract: A sensor device, an imaging system, and a method of forming a sensor device. The sensor device includes an integrated circuit having a sensor portion and non-sensor portion disposed about the periphery of the sensor portion, a passivation layer overlying a portion of a top surface of the non-sensor portion of the integrated circuit, and a protection layer overlying the passivation layer.
    Type: Grant
    Filed: December 8, 1997
    Date of Patent: August 29, 2000
    Assignee: Intel Corporation
    Inventor: Kabul Sengupta
  • Windowed non-ceramic package having embedded frame
    Patent number: 6072232
    Abstract: An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less than the mold compound. The IC package is capable of being attached to a circuit board via a mass reflow process.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: June 6, 2000
    Assignee: Intel Corporation
    Inventors: Zong-Fu Li, Kabul Sengupta, Deborah L. Thompson
  • Light selective element for imaging applications
    Patent number: 6020582
    Abstract: An image sensing device including a package having opposing side portions, an imaging sensor having a top side portion, and a light selective element coupled to the opposing side portions and overlying the top side portion of the imaging sensor.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: February 1, 2000
    Assignee: Intel Corporation
    Inventors: Edward J. Bawolek, Kabul Sengupta, Zong-Fu Li, Curtis Corum