Abstract: An electrostatic chuck 55 has an electrostatic member 100 including a dielectric 115 having a surface 120 adapted to receive the substrate 30. The dielectric 115 covers an electrode 105 that is chargeable to electrostatically hold the substrate 30. A support 190 below the electrostatic member 100 has a cavity 300 adapted to hold a gas to serve as a thermal insulator to regulate the flow of heat from the electrostatic chuck 55 to a surface 120 of the chamber 25. The cavity 300 has a cross-sectional profile that is shaped to provide a predetermined temperature profile across the substrate 30.

Abstract: A compliant bond structure 20 comprising wire mesh 25 strands 50 surrounded by compliant metal 40 is useful for bonding a ceramic surface 30 to a metal surface 35. The wire mesh 25 comprises interlocking strands 50 having longitudinal axes that are oriented substantially parallel to the ceramic and metal surfaces 30, 35. More preferably, the wire mesh 25 comprises strands having a coefficient of thermal expansion that is about 0.4 to about 1.6 times the average of the coefficients of thermal expansion of the metal and ceramic surfaces 30, 35.

Abstract: A thermally conductive medium includes a body with a first melting point and phase-changing material encapsulating a portion of the body, with the phase-changing material having a second melting point. The first melting point is greater than the second melting point, and the phase-changing material is configured to be in a liquid phase at temperatures above the second melting point and a solid phase at temperatures below the same. In the liquid phase, an adhesive force is present between the body and the phase-changing material due to capillary attraction, and the phase-changing material may be wettable to one of the two surfaces.

Abstract: An electrostatic chuck 100 useful for holding a substrate 55 in a high density plasma, comprises a dielectric covered electrode 110 having at least one heat transfer gas flow conduit 150 therein. An electrical isolator 200 comprising dielectric material is positioned in the gas flow conduit 150 to (i) electrically isolate the gas in the conduit from the plasma or electrode 110, and (ii) allow passage of heat transfer gas through the conduit. Preferably, the dielectric material comprises a plasma-deactivating material that has a high surface area that reduces plasma formation of gas passing through the conduit 150 in a plasma process. A semiconducting dielectric member 115 useful for rapidly charging and discharging electrostatic chucks is also described.

Abstract: A method of cleaning a hollow article comprises a step of introducing an oxidizing working gas into at least an interior portion of the hollow article, while a sub-atmospheric pressure is being maintained therein. Then, an electric field is applied, so as to convert the oxidizing working gas within at least the interior portion of the article into a low temperature plasma. This leads to oxidizing substances situated at least within the interior portion of the hollow article.