Patents by Inventor Kaeko Kitamura

Kaeko Kitamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6265113
    Abstract: An X-ray absorber is deposited on a membrane. A stress adjust step is applied so that the average film stress of the X-ray absorber is 0. After patterning the X-ray absorber, the position accuracy of the pattern is measured. Then, a stress adjust process is applied to the patterned X-ray mask. Accordingly, a stress adjustment method is used to acquire an X-ray mask that has no pattern position offset of the X-ray absorber.
    Type: Grant
    Filed: July 16, 1998
    Date of Patent: July 24, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Yabe, Kaeko Kitamura, Kenji Marumoto, Sunao Aya, Koji Kise
  • Patent number: 6212252
    Abstract: An X-ray mask which is provided with an alignment mark and a transfer circuit pattern having a high position accuracy can be manufactured through a simplified manufacturing process. A membrane allowing passage of X-rays is formed on a substrate. A X-ray absorber intercepting transmission of X-rays is formed on the membrane. The substrate includes a window exposing the membrane. The X-ray absorber includes a transfer circuit pattern and an alignment mark formed in a region not overlapping with the window in a plan view.
    Type: Grant
    Filed: October 23, 1998
    Date of Patent: April 3, 2001
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Koji Kise, Hideki Yabe, Sunao Aya, Kaeko Kitamura, Kenji Marumoto, Shigeto Ami
  • Patent number: 5905005
    Abstract: An antireflection film formed on a membrane of an X-ray mask has an amorphous structure. A patterned X-ray absorber intercepting transmission of X-rays is formed to be in contact with the front surface of the antireflection film. Thus, an X-ray mask having excellent pattern positional accuracy and a method of fabricating the same are obtained.
    Type: Grant
    Filed: October 14, 1997
    Date of Patent: May 18, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Yabe, Kaeko Kitamura, Kei Sasaki
  • Patent number: 5879840
    Abstract: A film-forming method and an apparatus for a X-ray mask and a film-forming apparatus which are able to diminish stress unevenness in the X-ray mask to zero when a X-ray absorber is formed on a mask substrate by sputtering a target 3 during rotation of the mask substrate. Firstly, a dummy mask substrate is prepared instead of a mask substrate. A dummy X-ray absorber 6 is formed on this dummy X-ray substrate 5 within a sputtering range. Secondly, a stress distribution is measured at every position along a straight line passing through a center of the dummy X-ray absorber 6 and then a desirable stress distribution range X is selected at such a location so as to have a good linear characteristic in a portion of a compressive stress curve which decreases toward an outer periphery of the dummy X-ray absorber 6 in the stress distribution.
    Type: Grant
    Filed: August 1, 1997
    Date of Patent: March 9, 1999
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideki Yabe, Kaeko Kitamura, Masao Kouhashi, Masamitsu Okamura, Kei Sasaki