Abstract: A copper-ceramic composite: includes a ceramic substrate containing alumina and a copper or copper alloy coating on the ceramic substrate. The alumina has a mean grain shape factor Ra(Al2O3), defined as the arithmetic mean of the shape factors R of the alumina grains, of at least 0.4.

Abstract: The invention relates to a copper-ceramic composite, comprising a ceramic substrate, which contains aluminum oxide, a coating on the ceramic substrate made of copper or a copper alloy, wherein the aluminum oxide has an average grain form factor Ra(Al2O3), determined as an arithmetic average value from the form factors of the grains of the aluminum oxide, the copper or the copper alloy has an average grain form factor Ra(Cu), determined as an arithmetic average of the form factors of the grains of the copper or copper alloy, and the average grain form factors of the aluminum oxide and copper or copper alloy meet the following condition: 0.5?Ra(Al2O3)/Ra(Cu)?2.0.

Abstract: The invention relates to a copper-ceramic composite comprising:—a ceramic substrate;—a copper or copper alloy coating in which the copper or copper alloy has grain sizes of 10 ?m to 300 ?m and a number distribution of the grain sizes with a median d50 and an arithmetic mean darith, the ratio of d50 to darith (d50/darith) being between 0.75 and 1.10.

Abstract: The invention relates to a copper/ceramic composite comprising—a ceramic substrate which contains aluminum oxide, —a coating which lies on the ceramic substrate and which is made of copper or a copper alloy, wherein the copper or the copper alloy has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Cu)=d50/darith; the aluminum oxide has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Al2O3)=d50/darith; and S(Al2O3) and S(Cu) satisfy the following condition: 0.7?S(Al2O3)/S(Cu)?1.4.

Abstract: The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 ?m to 300 ?m.

Abstract: The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 ?m to 300 ?m.

Abstract: The invention relates to a copper/ceramic composite comprising—a ceramic substrate which contains aluminum oxide, —a coating which lies on the ceramic substrate and which is made of copper or a copper alloy, wherein the copper or the copper alloy has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Cu)=d50/darith; the aluminum oxide has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Al2O3)=d50/darith; and S(Al2O3) and S(Cu) satisfy the following condition: 0.7<S(Al2O3)/S(Cu)?1.4.

Abstract: One aspect is a logic power module, with at least one logic component, at least one power component and a substrate. The logic element and the power component are provided in separate areas on the substrate. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.

Abstract: The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 ?m to 300 ?m.

Abstract: The invention relates to a copper-ceramic composite comprising: a ceramic substrate containing alumina; a copper or copper alloy coating on the ceramic substrate; the alumina has a mean grain shape factor Ra(Al2O3), defined as the arithmetic mean of the shape factors R of the alumina grains, of at least 0.4.

Abstract: The invention relates to a copper-ceramic composite, comprising a ceramic substrate, which contains aluminum oxide, a coating on the ceramic substrate made of copper or a copper alloy, wherein the aluminum oxide has an average grain form factor Ra(Al2O3), determined as an arithmetic average value from the form factors of the grains of the aluminum oxide, the copper or the copper alloy has an average grain form factor Ra(Cu), determined as an arithmetic average of the form factors of the grains of the copper or copper alloy, and the average grain form factors of the aluminum oxide and copper or copper alloy meet the following condition: 0.5?Ra(Al2O3)/Ra(Cu)?2.0.

Abstract: The present invention relates to a copper-ceramic composite comprising—a ceramic substrate which contains aluminum oxide, the aluminum oxide having particle sizes in the range of 0.01 ?m to 25 ?m and a quantity distribution of the particle sizes with a median value d50 and an arithmetic mean value darith, and the ratio of d50 to darith being in the range of 0.75 to 1.10, —a coating made of copper or a copper alloy provided on the ceramic substrate.

Abstract: Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.