Abstract: A water-proof connector includes a housing, a plurality of terminals and a waterproof component. The housing has a base portion, a center of a top face of the base portion defines a cavity, a bottom of the cavity defines a plurality of terminal grooves extending frontward and rearward and penetrating a rear face of the base portion. The plurality of terminals are assembled in the terminal grooves of the housing. The waterproof component includes an insulation cover board, a sealing element. The insulation cover board is assembled in the cavity, the sealing element is secondary molded in a rear end of the cavity of the housing and on a rear end of the insulation cover board.

Abstract: A card connector for receiving an electrical card therein includes an insulating housing, a plurality of electrical contacts, a plastic sheet, a shielding shell and a heat activated film. The insulating housing has a bottom wall, a rear wall and two side walls which together form an inserting chamber. The electrical contacts are fixed in the bottom wall of the insulating housing. The plastic sheet is pasted on a bottom of the insulating housing. The shielding shell covers on the insulating housing. The heat activated film is welded between the shielding shell and the rear wall and the side walls of the insulating housing.

Abstract: An improved semiconductor device is provided whereby the semiconductor device is defined by a layered structure comprising a first dielectric layer, a data storage material disposed on the first dielectric layer, and a second dielectric layer disposed on the data storage material, the layered structured substantially forming the outer layer of the semiconductor device. For example, the semiconductor device may be a SONOS structure having an oxide-nitride-oxide (ONO) film that substantially surrounds the SONOS structure. The invention also provides methods for fabricating the semiconductor device and the SONOS structure of the invention.

Abstract: A connector includes an insulating housing, a signal contact set, a ground contact and a fixing pin. A containing slot is formed on the insulating housing and the insulating housing has an engaging structure located inside the containing slot. The signal contact set is installed inside the insulating housing. The ground contact is installed inside the insulating housing and opposite to the signal contact set. The fixing pin is installed inside the insulating housing and located between the signal contact set and the ground contact. The fixing pin includes a main body, a latching portion and an embedding portion. The main body is installed inside the containing slot. The latching portion protrudes from the main body and is for latching the engaging structure. The embedding portion extends from the main body and is for embedding into a mating hole on a circuit board.

Abstract: A door structure includes a rotary cover, a pivotal portion and a shielding component. The rotary cover is connected to a housing in a rotatable manner. The rotary cover covers a slot on the housing as rotating to a closed position. The pivotal portion is connected to the rotary cover and passes through a pivoting hole on the housing to be pivoted on the housing so that the rotary cover is capable of rotating relative to the housing. The shielding component is installed on the pivotal portion and disposed inside the housing. The shielding component is for shielding at least one part of the pivoting hole on the housing when the rotary cover rotates to an open position to expose the slot on the housing and the shielding component pivots to a position corresponding to or nearby the pivoting hole with the pivotal portion.

Abstract: Methods for forming a semiconductor device structure are provided. The method includes providing a substrate and forming an isolation structure in the substrate. The method also includes forming a gate stack structure on the substrate and etching a portion of the substrate to form a recess in the substrate, and the recess is adjacent to the gate stack structure. The method includes forming a stressor layer in the recess, and a portion of the stressor layer is grown along the (311) and (111) crystal orientations.

Abstract: Embodiments for forming a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a gate stack structure formed on the substrate. The semiconductor device structure also includes gate spacers formed on sidewalls of the gate stack structure. The semiconductor device structure further includes an isolation structure formed in the substrate and a source/drain stressor structure formed adjacent to the isolation structure. The source/drain stressor structure includes a capping layer which is formed along the (311) and (111) crystal orientations.

Abstract: The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner.

Abstract: A socket connector includes an insulating housing defining an inserting chamber in the front thereof and a receiving groove in the back face thereof, a plurality of conductive terminals disposed in the insulating housing, and a latch. Two sides of the receiving groove further extend forward to form two inserting grooves of which each front end is communicated with the inserting chamber. The latch has a first base plate positioned in the receiving groove. Two opposite side edges of the first base plate are bent and extend forward to form two first clamping portions inserted in the inserting grooves with front ends thereof projecting into the inserting chamber. Two opposite outer sides of the first clamping portions protrude outward to form a pair of bumps located in the rear of the first clamping portions and resisting against outmost two inner sidewalls of the inserting grooves.

Abstract: An audio jack connector includes an insulating housing which has a base body defining a holding cavity in a bottom thereof and an inserting body defining an inserting chamber, a plurality of electrical terminals disposed in the base body, a fixing member fastened in the holding cavity of the insulating housing to cover and hold the electrical terminals in the base body, and a sealing tape covering under the fixing member and adhered outside the insulating housing and the fixing member to seal up splicing gaps between sidewalls of the holding cavity and peripheral edges of the fixing member. So the audio jack connector can effectively prevent the water vapor and dust passing through the inserting chamber onto a printed circuit board of an electronic product where the audio jack connector is used.

Abstract: An electronic device includes a housing having a top wall, and a microphone module mounted in the housing. The microphone module includes a mounting seat having two oppositely spaced-apart upright suspension surfaces extending transversely from the top wall. A buffer member includes a main body disposed between and spaced apart from the suspension surfaces, and two suspension bumps protruding from the main body toward and abutting respectively and tightly against the suspension surfaces. The main body has an inner portion defining an accommodating space. A microphone body is disposed in the accommodating space.

Abstract: Embodiments for forming a semiconductor device structure are provided. The semiconductor device structure includes a substrate and a gate stack structure formed on the substrate. The semiconductor device structure also includes gate spacers formed on sidewalls of the gate stack structure. The semiconductor device structure further includes an isolation structure formed in the substrate and a source/drain stressor structure formed adjacent to the isolation structure. The source/drain stressor structure includes a capping layer which is formed along the (311) and (111) crystal orientations.

Abstract: The present invention discloses a display device including a base, a screen and a fixing mechanism. The fixing mechanism is connected to the base and the screen for fixing the screen on the base. The fixing mechanism includes a supporting structure rotatably installed on the base. Two ends of the supporting structure selectively engage with a plurality of constraining portions on the screen so as to fix the screen at different view angles relative to the base. The fixing mechanism further includes a resilient component sheathing with the supporting structure. An end of the resilient component is fixed on the base, and the other end of the resilient component is fixed on the supporting structure. The resilient component provides torque to the supporting structure as the screen rotates relative to the base.

Abstract: An improved semiconductor device is provided whereby the semiconductor device is defined by a layered structure comprising a first dielectric layer, a data storage material disposed on the first dielectric layer, and a second dielectric layer disposed on the data storage material, the layered structured substantially forming the outer layer of the semiconductor device. For example, the semiconductor device may be a SONOS structure having an oxide-nitride-oxide (ONO) film that substantially surrounds the SONOS structure. The invention also provides methods for fabricating the semiconductor device and the SONOS structure of the invention.

Abstract: An improved semiconductor device is provided whereby the semiconductor device is defined by a layered structure comprising a first dielectric layer, a data storage material disposed on the first dielectric layer, and a second dielectric layer disposed on the data storage material, the layered structured substantially forming the outer later of the semiconductor device. For example, the semiconductor device may be a SONOS structure having an oxide-nitride-oxide (ONO) film that substantially surrounds the SONOS structure. The invention also provides methods for fabricating the semiconductor device and the SONOS structure of the invention.

Abstract: The present invention discloses a display device including a base, a screen and a fixing mechanism. The fixing mechanism is connected to the base and the screen for fixing the screen on the base. The fixing mechanism includes a supporting structure rotatably installed on the base. Two ends of the supporting structure selectively engage with a plurality of constraining portions on the screen so as to fix the screen at different view angles relative to the base. The fixing mechanism further includes a resilient component sheathing with the supporting structure. An end of the resilient component is fixed on the base, and the other end of the resilient component is fixed on the supporting structure. The resilient component provides torque to the supporting structure as the screen rotates relative to the base.

Abstract: A door structure includes a rotary cover, a pivotal portion and a shielding component. The rotary cover is connected to a housing in a rotatable manner. The rotary cover covers a slot on the housing as rotating to a closed position. The pivotal portion is connected to the rotary cover and passes through a pivoting hole on the housing to be pivoted on the housing so that the rotary cover is capable of rotating relative to the housing. The shielding component is installed on the pivotal portion and disposed inside the housing. The shielding component is for shielding at least one part of the pivoting hole on the housing when the rotary cover rotates to an open position to expose the slot on the housing and the shielding component pivots to a position corresponding to or nearby the pivoting hole with the pivotal portion.

Abstract: The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner.

Abstract: An improved semiconductor device is provided whereby the semiconductor device is defined by a layered structure comprising a first dielectric layer, a data storage material disposed on the first dielectric layer, and a second dielectric layer disposed on the data storage material, the layered structured substantially forming the outer later of the semiconductor device. For example, the semiconductor device may be a SONOS structure having an oxide-nitride-oxide (ONO) film that substantially surrounds the SONOS structure. The invention also provides methods for fabricating the semiconductor device and the SONOS structure of the invention.

Abstract: A receptacle connector adapted for soldering with a circuit board and engaging with a plug connector includes an insulating housing, a plurality of terminals molded in the insulating housing, at least two first connecting elements, a second connecting element, a first waterproof board, a second waterproof board, and a shielding shell surrounding the insulating housing. The insulating housing has a top wall which defines at least two locating grooves for receiving the first connecting elements therein. The second connecting element has a base plate mounted to a bottom of the bottom wall. The first waterproof board is mounted to a top of the insulating housing. The second waterproof board is mounted under the second connecting element. A top face of the first waterproof board and a bottom face of the second waterproof board are coated with waterproof adhesive material to form a waterproof adhesive layer respectively.