Abstract: The present disclosure provides a chemical mechanical polishing device including a retaining ring and a wafer carrier and a polishing method. The retaining ring is configured on a polishing pad and includes an inner sidewall defining an opening and an outer sidewall opposite to the inner sidewall. The wafer carrier is configured on the polishing pad and is capable of placing a wafer disposed thereon into the opening and facing the polishing pad. The retaining ring has a notch at the corner adjacent to the wafer and the polishing pad.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.

Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.

Abstract: An OCT scanning probe includes a tubular housing, at least one electrode, an optical fiber scanner and an auxiliary localization component. The electrode is disposed on an outer surface of the tubular housing. The optical fiber scanner is disposed in the tubular housing and includes an optical fiber and an optical element. The optical element is disposed on an emitting end of the optical fiber and at corresponding position to a light transmittable portion of the tubular housing. The auxiliary localization component is disposed on the tubular housing, and overlaps part of the light transmittable portion. A light beam emitted from the optical fiber scanner passes through the light transmittable portion to obtain a tomographic image. An interaction of the light beam with the auxiliary localization component causes a characteristic in the tomographic image, with the characteristic corresponding to the auxiliary localization component.

Abstract: An OCT scanning probe includes a tubular housing, at least one electrode, an optical fiber scanner and an auxiliary localization component. The electrode is disposed on an outer surface of the tubular housing. The optical fiber scanner is disposed in the tubular housing and includes an optical fiber and an optical element. The optical element is disposed on an emitting end of the optical fiber and at corresponding position to a light transmittable portion of the tubular housing. The auxiliary localization component is disposed on the tubular housing, and overlaps part of the light transmittable portion. A light beam emitted from the optical fiber scanner passes through the light transmittable portion to obtain a tomographic image. An interaction of the light beam with the auxiliary localization component causes a characteristic in the tomographic image, with the characteristic corresponding to the auxiliary localization component.

Abstract: A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.

Abstract: A method of embedding a magnetic component in a substrate is disclosed. Holes are formed in a substrate by mechanically drilling. Each of the holes includes a top opening, a bottom and sidewall, wherein an area of the top opening is larger than that of the bottom. The sidewall extends from the top opening vertically downwards to a predetermined depth, and then is slanted inwardly to the bottom to form a sloped sidewall at the bottom of the hole. A predetermined region is defined along a portion of an edge of the top opening, and a portion of the substrate material under the predetermined region is removed by routing to form a component accommodation trench with a portion of the sloped sidewall at the bottom. Then, a magnetic component is placed into the component accommodation trench.