Patents by Inventor Kai-Hung Cheng
Kai-Hung Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990375Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.Type: GrantFiled: June 29, 2022Date of Patent: May 21, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Shih-Wen Huang, Jaming Chang, Kai Hung Cheng, Chia-Hui Lin, Jei Ming Chen
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Patent number: 11990440Abstract: A structure and a formation method of a semiconductor device are provided. The semiconductor device structure includes a semiconductor substrate and an interconnection structure over the semiconductor substrate. The semiconductor device structure also includes a first conductive pillar over the interconnection structure. The first conductive pillar has a first protruding portion extending towards the semiconductor substrate from a lower surface of the first conductive pillar. The semiconductor device structure further includes a second conductive pillar over the interconnection structure. The second conductive pillar has a second protruding portion extending towards the semiconductor substrate from a lower surface of the second conductive pillar. The first conductive pillar is closer to a center point of the semiconductor substrate than the second conductive pillar. A bottom of the second protruding portion is wider than a bottom of the first protruding portion.Type: GrantFiled: August 27, 2021Date of Patent: May 21, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hui-Min Huang, Ming-Da Cheng, Wei-Hung Lin, Chang-Jung Hsueh, Kai-Jun Zhan, Yung-Sheng Lin
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Publication number: 20240128219Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.Type: ApplicationFiled: December 6, 2023Publication date: April 18, 2024Inventors: Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng
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Publication number: 20240128412Abstract: A micro LED structure includes a first micro LED chip having opposite first and second sides, a second micro LED chip adjacent to the first side of the second micro LED chip, a third micro LED chip adjacent to the first side of the first micro LED chip, and optical structures respectively over the first micro LED chip, the second micro LED chip and the third micro LED chip. Each of the first, second and third micro LED chip includes a semiconductor stack, a metal pad and a reflective coating layer. The semiconductor stack includes a first semiconductor layer, an active layer in contact with the first semiconductor layer, and a second semiconductor layer in contact with the active layer. The metal pad is in contact with the first semiconductor layer, and the reflective coating layer is disposed around sidewalls of the semiconductor stack.Type: ApplicationFiled: December 28, 2023Publication date: April 18, 2024Inventors: Kai-Hung CHENG, Fu-Han HO
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Patent number: 11961817Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.Type: GrantFiled: July 8, 2021Date of Patent: April 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Kai Jun Zhan, Chang-Jung Hsueh, Hui-Min Huang, Wei-Hung Lin, Ming-Da Cheng
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Publication number: 20240107901Abstract: Provided is a resistive random access memory (RRAM). The resistive random access memory includes a plurality of unit structures disposed on a substrate. Each of the unit structures includes a first electrode, and a first metal oxide layer. The first electrode is disposed on the substrate. The first metal oxide layer is disposed on the first electrode. In addition, the resistive random access memory includes a second electrode. The second electrode is disposed on the plurality of unit structures and connected to the plurality of unit structures.Type: ApplicationFiled: December 5, 2023Publication date: March 28, 2024Applicant: United Microelectronics Corp.Inventors: Kai Jiun Chang, Chun-Hung Cheng, Chuan-Fu Wang
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Patent number: 11894495Abstract: A micro LED structure includes a first micro LED chip having opposite first and second sides, a second micro LED chip adjacent to the first side of the second micro LED chip, a third micro LED chip adjacent to the first side of the first micro LED chip, and optical structures respectively over the first micro LED chip, the second micro LED chip and the third micro LED chip. Each of the first, second and third micro LED chip includes a semiconductor stack, a metal pad and a reflective coating layer. The semiconductor stack includes a first semiconductor layer, an active layer in contact with the first semiconductor layer, and a second semiconductor layer in contact with the active layer. The metal pad is in contact with the first semiconductor layer, and the reflective coating layer is disposed around sidewalls of the semiconductor stack.Type: GrantFiled: June 2, 2021Date of Patent: February 6, 2024Assignee: Lextar Electronics CorporationInventors: Kai-Hung Cheng, Fu-Han Ho
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Patent number: 11709128Abstract: An optical detection apparatus includes a substrate, a light source, a light sensor, a light-guiding structure. The substrate has a top surface. The light source on the top surface is configured to generate detection light toward an object over the light source. The light sensor is located on the top surface. The light-guiding structure is above the top surface and at least partially above the light source. A central axis of the light-guiding structure is vertical to the top surface, and the light source and the light sensor are at opposite sides relative to the central axis. The light-guiding structure is configured to deflect the detection light from one of the opposite sides at which the light source is located to another one of the opposite side at which the light sensor is located, such that the detection light reflected by the object moves toward the light sensor.Type: GrantFiled: April 29, 2021Date of Patent: July 25, 2023Assignee: Lextar Electronics CorporationInventors: Fu-Han Ho, Kai-Hung Cheng
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Publication number: 20230138130Abstract: The present disclosure provides a compound shown as formula (I), formula (II), which is used to prepare a radiocontrast tracer that can target binding to Tau protein.Type: ApplicationFiled: January 21, 2022Publication date: May 4, 2023Inventors: Ming-Hsin Li, Shih-Wei Lo, Kai-Hung Cheng, Liang-Hsun Huang, Li-Ming Wang
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Patent number: 11570339Abstract: According to the disclosure, a photodiode package structure is provided. The photodiode package structure includes a substrate, a photodiode chip on the substrate, a plurality of shutters above the photodiode chip, and a seal member covering the substrate and the photodiode chip, in which the shutters are embedded in the seal member.Type: GrantFiled: September 30, 2020Date of Patent: January 31, 2023Assignee: Lextar Electronics CorporationInventors: Kai-Hung Cheng, Fu-Han Ho
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Publication number: 20220393078Abstract: A micro LED structure includes a first micro LED chip having opposite first and second sides, a second micro LED chip adjacent to the first side of the second micro LED chip, a third micro LED chip adjacent to the first side of the first micro LED chip, and optical structures respectively over the first micro LED chip, the second micro LED chip and the third micro LED chip. Each of the first, second and third micro LED chip includes a semiconductor stack, a metal pad and a reflective coating layer. The semiconductor stack includes a first semiconductor layer, an active layer in contact with the first semiconductor layer, and a second semiconductor layer in contact with the active layer. The metal pad is in contact with the first semiconductor layer, and the reflective coating layer is disposed around sidewalls of the semiconductor stack.Type: ApplicationFiled: June 2, 2021Publication date: December 8, 2022Inventors: Kai-Hung CHENG, Fu-Han HO
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Publication number: 20220328360Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.Type: ApplicationFiled: June 29, 2022Publication date: October 13, 2022Inventors: Shih-Wen Huang, Jaming Chang, Kai Hung Cheng, Chia-Hui Lin, Jei Ming Chen
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Publication number: 20220268690Abstract: An optical detection apparatus includes a substrate, a light source, a light sensor, a light-guiding structure. The substrate has a top surface. The light source on the top surface is configured to generate detection light toward an object over the light source. The light sensor is located on the top surface. The light-guiding structure is above the top surface and at least partially above the light source. A central axis of the light-guiding structure is vertical to the top surface, and the light source and the light sensor are at opposite sides relative to the central axis. The light-guiding structure is configured to deflect the detection light from one of the opposite sides at which the light source is located to another one of the opposite side at which the light sensor is located, such that the detection light reflected by the object moves toward the light sensor.Type: ApplicationFiled: April 29, 2021Publication date: August 25, 2022Inventors: Fu-Han HO, Kai-Hung CHENG
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Publication number: 20220227728Abstract: The present invention discloses a series of nuclear medicine tracers that are combined with brain microtubule-associated protein Tau targeting compounds to produce a group of compounds of nuclear medicine that can be utilized for imaging of microtubule-associated protein Tau. When the positrons released by the decay encounter the electrons of the cells in the sample, utilizing the positron decay characteristics of fluorine-18 or iodine-124 isotope to generate mutual destruction reactions, a pair of opposite gamma rays is formed which are imaged by positron emission tomography. The compounds can be applied for the in vivo detection of microtubule-associated protein Tau deposits in the brain. The invention provides a strategy for diagnosis of Alzheimer's disease and a method to measure the efficacy of therapeutic drugs targeting microtubule-associated protein Tau.Type: ApplicationFiled: January 19, 2021Publication date: July 21, 2022Inventors: MING-HSIN LI, KAI-HUNG CHENG, SHENG-NAN LO, SHIH-WEI LO, YUAN-RUEI HUANG, JENN-TZONG CHEN
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Patent number: 11380593Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.Type: GrantFiled: September 14, 2020Date of Patent: July 5, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shih-Wen Huang, Jaming Chang, Kai Hung Cheng, Chia-Hui Lin, Jei Ming Chen
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Publication number: 20220103726Abstract: According to the disclosure, a photodiode package structure is provided. The photodiode package structure includes a substrate, a photodiode chip on the substrate, a plurality of shutters above the photodiode chip, and a seal member covering the substrate and the photodiode chip, in which the shutters are embedded in the seal member.Type: ApplicationFiled: September 30, 2020Publication date: March 31, 2022Inventors: Kai-Hung CHENG, Fu-Han HO
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Patent number: 11202577Abstract: A system and method for monitoring cardiovascular and brain functions in combination with a physiological detection device, which uses a smart wearable device to detect physiological data such as heart rate and pulse pressure of a user, and transmits the physiological data to an arithmetic function. An electronic device in which a preset function and a calculation formula are built in, and the physiological data can be converted into corresponding determination parameters to monitor the possibility and risk of cardiovascular diseases and neurodegenerative diseases.Type: GrantFiled: October 28, 2019Date of Patent: December 21, 2021Inventors: Ming-Hsin Li, Kai-Hung Cheng, Shih-Wei Lo
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Patent number: 11195717Abstract: A four-layer photoresist and method of forming the same are disclosed. In an embodiment, a method includes forming a semiconductor fin; depositing a target layer on the semiconductor fin; depositing a BARC layer on the target layer; depositing a first mask layer over the BARC layer, the first mask layer being deposited using a plasma process with an RF power of less than 50 W; depositing a second mask layer over the first mask layer using a plasma process with an RF power of less than 500 W; depositing a photoresist layer over the second mask layer; patterning the photoresist layer, the second mask layer, the first mask layer, and the BARC layer to form a first mask; and selectively removing the target layer from a first portion of the semiconductor fin using the first mask, the target layer remaining on a second portion of the semiconductor fin.Type: GrantFiled: August 3, 2020Date of Patent: December 7, 2021Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Dong-Sheng Li, Chia-Hui Lin, Kai Hung Cheng, Yao-Hsu Sun, Wen-Cheng Wu, Bo-Cyuan Lu, Sung-En Lin, Tai-Chun Huang
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Publication number: 20210121074Abstract: A system and method for monitoring cardiovascular and brain functions in combination with a physiological detection device, which uses a smart wearable device to detect physiological data such as heart rate and pulse pressure of a user, and transmits the physiological data to an arithmetic function. An electronic device in which a preset function and a calculation formula are built in, and the physiological data can be converted into corresponding determination parameters to monitor the possibility and risk of cardiovascular diseases and neurodegenerative diseases.Type: ApplicationFiled: October 28, 2019Publication date: April 29, 2021Inventors: MING-HSIN LI, KAI-HUNG CHENG, SHIH-WEI LO
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Patent number: D1024051Type: GrantFiled: August 10, 2021Date of Patent: April 23, 2024Assignee: Acer IncorporatedInventors: Hui-Jung Huang, Hong-Kuan Li, I-Lun Li, Ling-Mei Kuo, Kuan-Ju Chen, Fang-Ying Huang, Kai-Hung Huang, Szu-Wei Yang, Kai-Teng Cheng