Patents by Inventor Kai Numssen

Kai Numssen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10862183
    Abstract: A quad-mode microwave or RF bandpass filter comprises a housing of a conductive material defining a cylindrical cavity and containing a cylindrical dielectric resonator defined by a parallel pair of face surfaces. The dielectric resonator is held within the housing between a pair of support plates of a dielectric material. Internal coupling elements are provided above and/or below the dielectric resonator for coupling between resonating modes. Further mode coupling elements are protruding into the housing.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: December 8, 2020
    Inventors: Kai Numssen, Jörn Pfeifer, Martin Lorenz, Christian Orlob, Christoph Neumaier, Natalie Spaeth
  • Patent number: 10468790
    Abstract: A coaxial plug connector, comprising at least one electrically conductive inner conductor, an electrically conductive outer conductor spaced apart from the at least one inner conductor and disposed around the at least one inner conductor, at least one sleeve, which is made of an insulating plastic, wherein the inner conductor is disposed on an inside circumferential surface of the sleeve, wherein the outer conductor is disposed on an outside circumferential surface of the sleeve, wherein the coaxial plug connector is single-piece and sleeve-like.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: November 5, 2019
    Assignee: IMS Connector Systems GmbH
    Inventors: Muhammad Imtiaz, Kai Numssen
  • Publication number: 20190036240
    Abstract: A coaxial plug connector, comprising at least one electrically conductive inner conductor, an electrically conductive outer conductor spaced apart from the at least one inner conductor and disposed around the at least one inner conductor, at least one sleeve, which is made of an insulating plastic, wherein the inner conductor is disposed on an inside circumferential surface of the sleeve, wherein the outer conductor is disposed on an outside circumferential surface of the sleeve, wherein the coaxial plug connector is single-piece and sleeve-like.
    Type: Application
    Filed: July 20, 2018
    Publication date: January 31, 2019
    Applicant: IMS Connector Systems GmbH
    Inventors: Muhammad Imtiaz, Kai Numssen
  • Publication number: 20180212299
    Abstract: A quad-mode microwave or RF bandpass filter comprises a housing of a conductive material defining a cylindrical cavity and containing a cylindrical dielectric resonator defined by a parallel pair of face surfaces. The dielectric resonator is held within the housing between a pair of support plates of a dielectric material. Internal coupling elements are provided above and/or below the dielectric resonator for coupling between resonating modes. Further mode coupling elements are protruding into the housing.
    Type: Application
    Filed: March 15, 2018
    Publication date: July 26, 2018
    Inventors: Kai Numssen, Jörn Schimmel, Martin Lorenz, Christian Orlob, Christoph Neumaier, Natalie Spaeth
  • Patent number: 9312051
    Abstract: The invention is a coaxial conductor structure for fault-free transmission of a TEM Mode of a HF signal wave within at least one band of frequency bands forming in the context of a dispersion relation. An inner conductor and an outer conductor are spaced radially apart from the inner conductor and an axially extending common conductor section of the inner and the outer conductor. A number n of electrically conductive ring-shaped structures are each fitted between the inner and outer conductor to be radially spaced apart, each of which have an electrical path completely surrounding the inner conductor and are arranged with a spatially periodic sequence with an equal distance between the two ring-shaped structures which are adjacent along the conductor section.
    Type: Grant
    Filed: July 11, 2011
    Date of Patent: April 12, 2016
    Assignee: Spinner GmbH
    Inventors: Martin Lorenz, Kai Numssen, Christoph Neumaier, Natalie Spaeth
  • Patent number: 9083067
    Abstract: A coaxial conductor structure for the interference-free transmission of a propagable TEM mode of an HF signal wave within at least one band of n frequency bands forming within a dispersion relation.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: July 14, 2015
    Assignee: Spinner GmbH
    Inventors: Christoph Neumaier, Martin Lorenz, Natalie Spaeth, Kai Numssen, Josef Kreuzmair
  • Publication number: 20130112477
    Abstract: The invention is a coaxial conductor structure for fault-free transmission of a TEM Mode of a HF signal wave within at least one band of frequency bands forming in the context of a dispersion relation. An inner conductor and an outer conductor are spaced radially apart from the inner conductor and an axially extending common conductor section of the inner and the outer conductor. A number n of electrically conductive ring-shaped structures are each fitted between the inner and outer conductor to be radially spaced apart, each of which have an electrical path completely surrounding the inner conductor and are arranged with a spatially periodic sequence with an equal distance between the two ring-shaped structures which are adjacent along the conductor section.
    Type: Application
    Filed: July 11, 2011
    Publication date: May 9, 2013
    Inventors: Martin Lorenz, Kai Numssen, Christoph Neumaier, Natalie Spaeth
  • Publication number: 20130015927
    Abstract: A coaxial conductor structure for the interference-free transmission of a propagable TEM mode of an HF signal wave within at least one band of n frequency bands forming within a dispersion relation.
    Type: Application
    Filed: March 29, 2011
    Publication date: January 17, 2013
    Inventors: Christoph Neumaier, Martin Lorenz, Natalie Spaeth, Kai Numssen, Josef Kreuzmair
  • Publication number: 20040142824
    Abstract: The present invention relates to a method for the manufacture of a high temperature-superconducting layer on a substrate (1a, 1b) comprising the steps of depositing an RBa2Cu3O7-layer (2) with a low growth rate, wherein R represents yttrium, an element of the group of rare-earth elements (atomic number 57 to 71) or mixtures of two or more of these elements, and the deposition of an XBa2Cu3O7-layer (3) onto the RBa2Cu3O7-layer (2) with high growth rate, wherein X represents yttrium, an element of the group of rare-earth elements (atomic number 57-71) or mixtures of two or more of these elements. Preferably, the low growth rate is <1 nm/s and the high growth rate is >1 nm/s, preferably >2 nm/s and the RBa2Cu3O7-layer (2) is preferably deposited onto an at least biaxially textured substrate (1a) or a substrate with an at least biaxially textured buffer layer (1b).
    Type: Application
    Filed: October 14, 2003
    Publication date: July 22, 2004
    Inventors: Kai Numssen, Helmut Kinder