Abstract: The invention provides a display device, comprising: a first substrate having a display region and a peripheral region adjacent to each other; a second substrate having a first light shield layer and a color resist layer, the color resist layer having a first color resist layer, a second color resist layer and a third color resist layer disposed on the first light shield layer in a strip shape, respectively; a display molecular layer disposed between the first substrate and the second substrate; a first light sensing region disposed on the first substrate and the second substrate; a first spacer region surrounding the first light sensing region, and further comprising: a second light shield layer forming a first projection area on the second substrate; a fourth resist layer forming a second projection area on the second substrate; wherein a ratio of the second projection area to the first projection area is between 0.01 and 0.07.

Abstract: The invention provides a display device, comprising: a first substrate having a display region and a peripheral region adjacent to each other; a second substrate having a first light shield layer and a color resist layer, the color resist layer having a first color resist layer, a second color resist layer and a third color resist layer disposed on the first light shield layer in a strip shape, respectively; a display molecular layer disposed between the first substrate and the second substrate; a first light sensing region disposed on the first substrate and the second substrate; a first spacer region surrounding the first light sensing region, and further comprising: a second light shield layer forming a first projection area on the second substrate; a fourth resist layer forming a second projection area on the second substrate; wherein a ratio of the second projection area to the first projection area is between 0.01 and 0.07.

Abstract: A converter is provided. The converter includes a housing, a circuit board unit, a heat source member, a fan, and a first heat sink. A waterproof area and a ventilation area are formed in the housing. The circuit board unit is disposed in the waterproof area. The heat source member is disposed in the waterproof area and coupled to the circuit board unit. The fan is disposed in the ventilation area, wherein the fan is adapted to generate an air flow. The first heat sink is disposed in the ventilation area, and thermally connected to the heat source member, wherein the air flow is adapted to pass through the first heat sink.

Abstract: A package structure of a power module is provided. The package structure includes a body having a sidewall, a first protruding structure protruding outward from one end of the sidewall, a second protruding structure protruding outward from another end of the sidewall and opposite to the first protruding structure, and a spring having two ends embedded in the first and the second protruding structures, respectively. The stress is transferred to the first and the second protruding structures via the spring, respectively. The equivalent stiffness of the spring is different from that of the body so that the package structure as a whole suffers the stress uniformly.

Abstract: A package structure of a power module is provided. The package structure includes a body having a sidewall, a first protruding structure protruding outward from one end of the sidewall, a second protruding structure protruding outward from another end of the sidewall and opposite to the first protruding structure, and a spring having two ends embedded in the first and the second protruding structures, respectively. The stress is transferred to the first and the second protruding structures via the spring, respectively. The equivalent stiffness of the spring is different from that of the body so that the package structure as a whole suffers the stress uniformly.

Abstract: A converter is provided. The converter includes a housing, a circuit board unit, a heat source member, a fan, and a first heat sink. A waterproof area and a ventilation area are formed in the housing. The circuit board unit is disposed in the waterproof area. The heat source member is disposed in the waterproof area and coupled to the circuit board unit. The fan is disposed in the ventilation area, wherein the fan is adapted to generate an air flow. The first heat sink is disposed in the ventilation area, and thermally connected to the heat source member, wherein the air flow is adapted to pass through the first heat sink.

Abstract: A converter is provided. The converter includes a housing, a slot, a cover, a connection arm and a shaft. The housing includes a housing inner wall. The slot is disposed on the housing inner wall. The connection arm is connected to the cover. The shaft is disposed on the connection arm, wherein the shaft is rotatably connected to the slot, and is adapted to slide in the slot.

Abstract: A package structure of a power module includes an insulation frame, a first circuit substrate, an insulation cover, plural first pins, plural posts and a fastening element. The insulation frame includes a sidewall and a first coupling part. The first coupling part is externally protruded from the sidewall. The first coupling part includes a first mounting structure. The first circuit substrate is combined with a bottom part of the insulation frame. The insulation cover is combined with a top part of the insulation frame. The insulation cover includes a second coupling part. The second coupling part includes a second mounting structure. The plural posts are embedded in the at least one first coupling part of the insulation frame, and partially penetrated through the second coupling part. The fastening element is connected with the first mounting structure and the second mounting structure.

Abstract: An electronic device includes a housing, a touch panel, a processor and one or more conductive rubbers. The touch panel has a contact surface. The processor is disposed inside the housing and coupled to the touch panel. When the one or more conductive rubbers contact the contact surface of the touch panel and the one or more conductive rubbers are compressed by a gravity provided by an object, the processor detects a first value on touch panel and obtains a weight of the object according to the first value.

Abstract: A package structure of a power module includes an insulation frame, a first circuit substrate, an insulation cover, plural first pins, plural posts and a fastening element. The insulation frame includes a sidewall and a first coupling part. The first coupling part is externally protruded from the sidewall. The first coupling part includes a first mounting structure. The first circuit substrate is combined with a bottom part of the insulation frame. The insulation cover is combined with a top part of the insulation frame. The insulation cover includes a second coupling part. The second coupling part includes a second mounting structure. The plural posts are embedded in the at least one first coupling part of the insulation frame, and partially penetrated through the second coupling part. The fastening element is connected with the first mounting structure and the second mounting structure.