Abstract: The invention relates to a composition containing at least the two following components: a) a silver carboxylate, and b) a terpene, an ink for ink jet printing and a paste for printing with a screen printing method, wherein the ink or the paste, respectively, each contains the composition according to the invention. The invention also relates to a method for producing a pattern on a substrate, at least comprising the following steps: A) providing a substrate and a composition containing at least one silver carboxylate and one terpene; B) applying the composition to the substrate while preserving a precursor with the pattern; C) treating the precursor with the pattern according to a treatment step that is selected from the group consisting of: a) at a temperature of more than 200° C. for at least 10 minutes, wherein the treatment is preferably carried out in an atmosphere of air; b) a photonic sintering process; c) a combination of a) and b), wherein the substrate to which the pattern is applied is preserved.

Abstract: The invention relates to a composition containing at least the two following components: a) a silver carboxylate, and b) a terpene, an ink for ink jet printing and a paste for printing with a screen printing method, wherein the ink or the paste, respectively, each contains the composition according to the invention. The invention also relates to a method for producing a pattern on a substrate, at least comprising the following steps: A) providing a substrate and a composition containing at least one silver carboxylate and one terpene; B) applying the composition to the substrate while preserving a precursor with the pattern; C) treating the precursor with the pattern according to a treatment step that is selected from the group consisting of: a) at a temperature of more than 200° C. for at least 10 minutes, wherein the treatment is preferably carried out in an atmosphere of air; b) a photonic sintering process; c) a combination of a) and b), wherein the substrate to which the pattern is applied is preserved.

Abstract: The present invention relates to a method for manufacturing a semiconductor wafer comprising: i) applying a MOD ink composition to a semiconductor wafer, thereby forming a precursor layer; and ii) curing the precursor layer. In an embodiment, the application in step i) is carried out by inkjet printing. The method for inkjet printing MOD ink has low equipment cost and low power consumption; no material waste; on-demand printing and easy selective deposition/design flexibility (no etching required). In addition, the method of the present invention improves the adhesion and electric conductivity of the metallization layer on backside of the wafer.

Abstract: A method of manufacturing a semiconductor package which is at least in part covered by an electromagnetic interference shielding layer. The method includes at least these steps: i. providing the semiconductor package and an ink composition having at least a compound comprising at least one metal precursor and at least one organic compound; ii. applying at least a part of the ink composition onto the semiconductor package, wherein a precursor layer is formed; and iii. treating the precursor layer with an irradiation of a peak wavelength in the range from 100 nm to 1 mm. Further disclosed is a semiconductor package comprising an electromagnetic interference shielding layer comprising at least one metal, wherein the semiconductor package is obtainable by the aforementioned method. Still further disclosed are a semiconductor package comprising an electromagnetic interference shielding layer having a specific conductance and thickness, and uses of an ink composition.

Abstract: A sensor unit for detecting a spatial temperature profile, having at least one substrate with a first surface and a second surface situated at least regionally opposite the first surface. The substrate is configured at least regionally to be flexible. At least one adhesion means is arranged at least regionally on the first surface and/or on the second surface for attaching the sensor unit to at least one measurement body. At least one sensor field is arranged on the second surface of the substrate. One aspect also relates to a method for producing a sensor unit.

Abstract: A method of manufacturing a semiconductor package which is at least in part covered by an electromagnetic interference shielding layer. The method includes at least these steps: i. providing the semiconductor package and an ink composition having at least a compound comprising at least one metal precursor and at least one organic compound; ii. applying at least a part of the ink composition onto the semiconductor package, wherein a precursor layer is formed; and iii. treating the precursor layer with an irradiation of a peak wavelength in the range from 100 nm to 1 mm. Further disclosed is a semiconductor package comprising an electromagnetic interference shielding layer comprising at least one metal, wherein the semiconductor package is obtainable by the aforementioned method. Still further disclosed are a semiconductor package comprising an electromagnetic interference shielding layer having a specific conductance and thickness, and uses of an ink composition.

Abstract: The invention relates to a composition containing at least the two following components: a) a silver carboxylate, and b) a terpene, an ink for ink jet printing and a paste for printing with a screen printing method, wherein the ink or the paste, respectively, each contains the composition according to the invention. The invention also relates to a method for producing a pattern on a substrate, at least comprising the following steps: A) providing a substrate and a composition containing at least one silver carboxylate and one terpene; B) applying the composition to the substrate while preserving a precursor with the pattern; C) treating the precursor with the pattern according to a treatment step that is selected from the group consisting of: a) at a temperature of more than 200° C. for at least 10 minutes, wherein the treatment is preferably carried out in an atmosphere of air; b) a photonic sintering process; c) a combination of a) and b), wherein the substrate to which the pattern is applied is preserved.

Abstract: A sensor unit for detecting a spatial temperature profile, having at least one substrate with a first surface and a second surface situated at least regionally opposite the first surface. The substrate is configured at least regionally to be flexible. At least one adhesion means is arranged at least regionally on the first surface and/or on the second surface for attaching the sensor unit to at least one measurement body. At least one sensor field is arranged on the second surface of the substrate. One aspect also relates to a method for producing a sensor unit.

Abstract: Process for producing a layer structure, which comprises the steps: E1. provision of a composition comprising i. gold (Au) particles in an amount in the range from 0.1 to 50% by weight; ii. a balance to 100% by weight of a polar, protic organic solvent; iii. less than 5% by weight of water, where the % by weight, in each case based on the total mass of the composition, add up to 100% by weight; E2. application of the composition to a substrate to give a precursor; E3. heating of the precursor to a temperature in the range from 25 to 200° C. to give the layer structure.

Abstract: The invention relates to a mixture containing a gold thiolate, a rhodium(III) compound, and a solvent that contains at least one OH group, in which the mixture has a ratio V=(a)/(b)?2.2; (a) is the fraction of solvent and (b) is the gold fraction of the gold thiolate, each relative to the total weight of the mixture.

Abstract: Process for producing a layer structure (2), which comprises the steps: E1. provision of a composition (6) comprising i. gold (Au) particles in an amount in the range from 0.1 to 50% by weight; ii. a balance to 100% by weight of a polar, protic organic solvent; iii. less than 5% by weight of water, where the % by weight, in each case based on the total mass of the composition (6), add up to 100% by weight; E2. application of the composition (6) to a substrate (4) to give a precursor (12); E3. heating of the precursor (12) to a temperature in the range from 25 to 200° C. to give the layer structure (2).

Abstract: The invention relates to a mixture containing a gold thiolate, a rhodium(III) compound, and a solvent that contains at least one OH group, in which the mixture has a ratio V=(a)/(b)?2.2; (a) is the fraction of solvent and (b) is the gold fraction of the gold thiolate, each relative to the total weight of the mixture.