Patents by Inventor Kai-Wei CHIANG

Kai-Wei CHIANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071953
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above- mentioned memory device is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20240071954
    Abstract: A memory device including a base semiconductor die, conductive terminals, memory dies, an insulating encapsulation and a buffer cap is provided. The conductive terminals are disposed on a first surface of the base semiconductor die. The memory dies are stacked over a second surface of the base semiconductor die, and the second surface of the base semiconductor die is opposite to the first surface of the base semiconductor die. The insulating encapsulation is disposed on the second surface of the base semiconductor die and laterally encapsulates the memory dies. The buffer cap covers the first surface of the base semiconductor die, sidewalls of the base semiconductor die and sidewalls of the insulating encapsulation. A package structure including the above-mentioned memory device is also provided.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kai-Ming Chiang, Chao-wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai, Sheng-Feng Weng, Yu-Hao Chen, Sheng-Hsiang Chiu, Chih-Wei Lin, Ching-Hua Hsieh
  • Publication number: 20170178330
    Abstract: The present invention discloses an interior mobile mapping system and method thereof. The interior mobile mapping method comprises the following steps: establishing a plurality of interior reference points; obtaining coordinates of the plurality of interior reference points corresponded to an interior coordinate system; moving from one interior reference point which is closest to an interior object; taking a picture for the interior object at more than two different places individually; and calculating the coordinate of the interior object corresponded to an exterior coordinate system according to the respective position of the interior object in the pictures and the coordinates of the different shooting locations.
    Type: Application
    Filed: December 17, 2015
    Publication date: June 22, 2017
    Inventors: Chih-Hung LI, Kai-Wei CHIANG, Chien-Hsun CHU, Chen-Kai LIAO, Guang-Je TSAI
  • Publication number: 20160171017
    Abstract: A mobile positioning apparatus and a positioning method thereof are provided. The mobile positioning apparatus retrieves sensing information and an environment image with environment image featured points. The mobile positioning apparatus determines first location information according to the sensing information, and selects a data image corresponding to the first location information from an image database. The data image has data image featured points which correspond to the environment image featured points. The mobile positioning apparatus determines second location information according to the environment image, the data image, the environment image featured points and the data image featured points, and determines second location information of the mobile positioning apparatus.
    Type: Application
    Filed: January 31, 2015
    Publication date: June 16, 2016
    Inventors: Chih-Hung LI, Kai-Wei CHIANG, Chen-Kai LIAO, Chien-Hsun CHU, Guang-Je TSAI