Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.

Abstract: A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.

Abstract: A metal clad substrate is disclosed. The metal clad substrate includes a metal baseplate, a metal layer, and a thermally conductive bonding layer disposed therebetween. The thermally conductive bonding layer includes a lower adhesive layer, a fiber-containing layer, and an upper adhesive layer. An upper side and a lower side of the upper adhesive layer contacts the metal layer and the fiber-containing layer, respectively. An upper side and a lower side of the lower adhesive layer contacts the fiber-containing layer and the metal baseplate, respectively. Each of the metal layer and the metal baseplate has a thickness of 0.3 mm - 15 mm. The fiber-containing layer includes a polymer as well as a heat conductive filler and a short fiber evenly dispersed in the polymer. The short fiber is in shape of a string and has a length of 5 µm-210 µm.

Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.

Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.

Abstract: An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.

Abstract: A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.

Abstract: A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and ?1V. The microrough surface has a roughness Rz of 2-18 ?m.

Abstract: A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and ?1V. The microrough surface has a roughness Rz of 2-18 ?m.