Abstract: In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.

Abstract: In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.

Abstract: In an embodiment, an apparatus comprising: a heater configured to heat a wafer located on a wafer staging area of the heater, the heater comprising a heater shaft extending below the wafer staging area; and a heater lift assembly comprising: a lift shaft configured to move the heater shaft in a vertical direction; a clamp that connects the heater shaft to the lift shaft; and a damper disposed on top of the clamp.

Abstract: A device for providing electrons and its method of making. The device includes an optical fiber with a tip and a metallic arrangement arranged at the tip. The metallic arrangement is arranged to be excited by an energy source to emit electrons or electron beams.

Abstract: A system and an imaging method for using photoacoustic effect are provided in the present invention. The system includes a light source for generating a light beam, a wave-guide probe and an ultrasound receiving device. The wave-guide probe further has a reception portion and at least one transmission portion. The reception portion receives the light beam and then triggers a photoacoustic effect inside the reception portion so as thereby to generate at least one sound wave thereinside to be further transmitted to the at least one transmission portion. The transmission portion is merged into the organic medium. When the sound wave is transmitted to the transmission portion, an ultrasound area is generated inside the organic medium. The ultrasound receiving device is located adjacent to the organic medium, receives the ultrasound generated in the ultrasound area to form an ultrasound image of the organic medium, so as to achieve the imaging method.

Abstract: An electromagnetic detection device is provided. The electromagnetic detection device includes an induction coil, a converter, and a controller. The induction coil is utilized to sense an RF signal and generate a sensing RF signal by electromagnetic induction of the induction coil which is proportional to the RF signal. The RF signal is transmitted to a shower head to perform a semiconductor process on a wafer for manufacturing an IC in association with the RF signal. The converter is utilized to convert the sensing RF signal into a DC signal. The controller is utilized to determine whether the semiconductor process is normal or abnormal according to the DC signal during the semiconductor process. The semiconductor process will be terminated when the semiconductor process is determined as abnormal.

Abstract: A device projecting images by micro electro-mechanical system (MEMS) technology mirrors includes a base, a first substrate, a first reflective mirror, a second substrate, and a second reflective mirror. The first substrate and the second substrate are adjacently positioned on the base. The first reflective mirror is formed on the first substrate by a micro electro-mechanical system (MEMS) technology and configured for receiving a light beam and rotating in two directions under control of the MEMS for reflect the received light in two directions. The second reflective mirror is formed on the rotatable second substrate to receive the image and be rotated, thus further adjusting the range of the projected images.

Abstract: A device projecting images by micro electro-mechanical system (MEMS) technology mirrors includes a base, a rotating seat, a substrate, a reflective mirror, a driver, and a controller. The rotating seat is rotably positioned on the base. The substrate is positioned on the rotating seat. The at least one MEMS reflective mirror is formed on the substrate and configured for rotating in two directions under control of the attached driver and controller to form two-dimensional images in a range.

Abstract: A system and an imaging method for using photoacoustic effect are provided in the present invention. The system includes a light source for generating a light beam, a wave-guide probe and an ultrasound receiving device. The wave-guide probe further has a reception portion and at least one transmission portion. The reception portion receives the light beam and then triggers a photoacoustic effect inside the reception portion so as thereby to generate at least one sound wave thereinside to be further transmitted to the at least one transmission portion. The transmission portion is merged into the organic medium. When the sound wave is transmitted to the transmission portion, an ultrasound area is generated inside the organic medium. The ultrasound receiving device is located adjacent to the organic medium, receives the ultrasound generated in the ultrasound area to form an ultrasound image of the organic medium, so as to achieve the imaging method.

Abstract: An optical PCB includes a substrate, conductive traces, a solder resist layer, and a light waveguide. The substrate includes a surface. The surface includes a flat area. The conductive traces are formed on the surface of the substrate and only positioned outside of the flat area. The solder resist layer is formed on the substrate and covers the conductive traces. The light waveguide is positioned on the solder resist layer. An orthogonal projection of the light waveguide on the surface of the substrate coincides with the flat area.

Abstract: A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate carries at least two alignment marks for correct and absolute positioning of the lens module on the substrate. The photoelectric unit is positioned on the substrate. The lens module defines at least two through holes aligned with the alignment marks.

Abstract: A photoelectric coupling module includes a substrate, a photoelectric unit, and a lens module. The substrate defines a positioning recess. The photoelectric unit is positioned on the substrate. The lens module includes a reflection surface, a plurality of first lenses, and a plurality of second lens. Optical axes of the first lenses cross optical axes of the second lenses on the reflection surface. The lens module further includes a positioning portion extending downward from a bottom surface, and the positioning portion is received in the positioning recess. The first lenses are aligned with the photoelectric unit.

Abstract: A miniature projection device includes a rotatable bracket assembly, a rotating plate, a driving device, and a light source unit. The rotating plate is rotatably mounted to the rotatable bracket assembly. The driving device is configured to drive the rotatable bracket assembly to rotate in a first direction, and to drive the rotatable plate to rotate in a second direction. The first direction is substantially perpendicular to the second direction. The light source unit is mounted on the rotatable plate and is capable of rotating together with the rotating plate. The light source unit is configured to emit laser beams and to project the laser beams onto a screen.

Abstract: An exemplary laser projection device includes a substrate, a first laser diode, a second laser diode, a third laser diode, and a triangular spectroscope located among the first, second and third laser diodes. The first, second and third laser diodes are located at vertices of a triangle, respectively. The spectroscope is located on light paths of the laser diodes. The spectroscope includes a first lateral face, a second lateral face, and a third lateral face interconnecting the first lateral face and the second lateral face. Each lateral face of the spectroscope is corresponding with one respective laser diode. A first and a second light splitting films are formed on two of the lateral faces of the spectroscope respectively. Light emitted from the laser diodes is adjusted by the first and second light splitting films to transmit along a common direction and be mixed with each other.

Abstract: A circuit board comprises a signal routing layer, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first ground layer, a second ground layer, and a third ground layer. The signal routing layer includes chip traces, connector traces, and signal traces connected to components. The first dielectric layer, the first ground layer, the second dielectric layer, the second ground layer, the third dielectric layer, and the third ground layer, in that order, are located at gradually increasing distances from the signal routing layer. The first ground layer corresponds to the chip traces, the second ground layer corresponds to the signal traces, and the third ground layer corresponds to the connector traces.

Abstract: An exemplary laser projection device includes a substrate, three laser chips mounted on the substrate, and a spectroscope arranged on laser beams paths of the laser chips. Each laser chip is a laser diode. The spectroscope includes a first group of splitters, and a second group of splitters spaced from the first group of splitters. Laser beams emitted from the laser chips are adjusted into the second group of splitters by the first group of splitters. And then, the laser beams adjusted into the second group of splitters are adjusted to be oriented toward the same direction and mixed together to obtain light of a predetermined color.

Abstract: Optical connector includes a circuit board, a photoelectric element, a driver chip, a coupler, and a holder holding an optical fiber. The circuit board includes a substrate having a first surface and an opposing second surface and a circuit portion formed on the substrate. The substrate defines a receiving groove in the second surface and a through hole passing through a bottom surface of the receiving groove and the first surface. The photoelectric element and the driver chip are positioned on the bottom surface, and the photoelectric element aligns with the through hole. The coupler is positioned on the first surface and aligns with the photoelectric element through the through hole. The holder is supported on the first surface and connected to the coupler. The coupler optically couples the optical fiber with the photoelectric element.

Abstract: An optical connector package includes a substrate and a casing positioned on the substrate and comprising a positioning pin. The casing and the substrate cooperatively define a receiving space. The positioning pin defines a vent functioning as a sole channel communicating the receiving space with the outside of the casing. The vent is sealed after the optical connector package subjects to all required heating processes.

Abstract: A circuit board includes a mounting surface and a number of connecting pads on the mounting surface. Each of the connecting pads defines a mounting area for mounting an element thereon. At least two of the connecting pads are substantially circular-shaped.

Abstract: An optical fiber coupler includes a male port and a female port. The male port includes a main body, the male transmission lens and the male receiving lens positioned on the main body, and a male optical wave guide assembly. The male base board includes at least one male optical wave guide. Each male optical wave guide includes a male first alignment portion and a male second alignment portion. The male first alignment portion is optically coupled with one male receiving lens; and a male second alignment portion has a greater width than that of the male first alignment portion. The structure of the female port is similar to the male port.