Patents by Inventor KAI YEE WAN

KAI YEE WAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for determining a sustained thermal power envelope comprising multiple heat sources
    Patent number: 10168752
    Abstract: Various embodiments of systems and methods are disclosed for determining a thermal power envelope. One method comprises determining a set of component and operating point combinations for a plurality of components in a portable computing device. Each component and operating point combination in the set defines an available operating point for each of the plurality of components. The portable computing device is iteratively set to each of the component and operating point combinations in the set. At each of the component and operating point combinations, power consumption data and skin temperature data is collected from a plurality of temperature sensors. An enhanced thermal power envelope is generated comprising the power consumption data and the skin temperature data for each of the component and operating point combinations.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: January 1, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Kwangyoon Lee, Kai Yee Wan, Adam Cunningham, Melanie Dolores Oclima
  • SYSTEMS AND METHODS FOR DETERMINING A SUSTAINED THERMAL POWER ENVELOPE COMPRISING MULTIPLE HEAT SOURCES
    Publication number: 20170262030
    Abstract: Various embodiments of systems and methods are disclosed for determining a thermal power envelope. One method comprises determining a set of component and operating point combinations for a plurality of components in a portable computing device. Each component and operating point combination in the set defines an available operating point for each of the plurality of components. The portable computing device is iteratively set to each of the component and operating point combinations in the set. At each of the component and operating point combinations, power consumption data and skin temperature data is collected from a plurality of temperature sensors. An enhanced thermal power envelope is generated comprising the power consumption data and the skin temperature data for each of the component and operating point combinations.
    Type: Application
    Filed: June 23, 2016
    Publication date: September 14, 2017
    Inventors: KWANGYOON LEE, KAI YEE WAN, ADAM CUNNINGHAM, MELANIE DOLORES OCLIMA