Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.

Abstract: A method includes depositing an etch stop layer over a first conductive feature, performing a first treatment to amorphize the etch stop layer, depositing a dielectric layer over the etch stop layer, etching the dielectric layer to form an opening, etching-through the etch stop layer to extend the opening into the etch stop layer, and filling the opening with a conductive material to form a second conductive feature.

Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.

Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.

Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.

Abstract: A method of modifying a substrate for deposition of charged particles thereon, the method comprising the steps of: providing a substrate that is incapable of bonding to a polyelectrolyte coating that has a charge that is opposite to the charge of the particles that are to be deposited thereon; modifying the surface of the substrate to provide a layer of silicon thereon or therein; and coating the silicon layered surface of the substrate with the polyelectrolyte coating, the polyelectrolyte coating containing functional groups that are capable of forming bonds with said silicon layer and wherein said polyelectrolyte coating enables a substantially even distribution of said charged particles to be deposited thereon.

Abstract: A glass substrate distribution system includes a cassette, a first transmission mechanism, and a second transmission mechanism. The first transmission mechanism transmits the glass substrate to several standby positions outside the cassette. The second transmission mechanism transmits the glass substrate between the standby positions and the glass substrate.

Abstract: A glass substrate distribution system includes a cassette, a first transmission mechanism, and a second transmission mechanism. The first transmission mechanism transmits the glass substrate to several standby positions outside the cassette. The second transmission mechanism transmits the glass substrate between the standby positions and the glass substrate.

Abstract: A glass substrate distribution system includes a cassette, a first transmission mechanism, and a second transmission mechanism. The first transmission mechanism transmits the glass substrate to several standby positions outside the cassette. The second transmission mechanism transmits the glass substrate between the standby positions and the glass substrate.

Abstract: A cassette for placing multiple-sized substrates includes a first board, a second board, two sidewalls, a number of dividers and an adjustable positioning device. The first board, the second board and the two sidewalls form a space. The dividers divide the space into several substrate-receiving spaces for placing substrates. The adjustable positioning device which movably connected to the first board and the second board is used to adjust the width of the substrate-receiving spaces.

Abstract: A glass substrate distribution system includes a cassette, a first transmission mechanism, and a second transmission mechanism. The first transmission mechanism transmits the glass substrate to several standby positions outside the cassette. The second transmission mechanism transmits the glass substrate between the standby positions and the glass substrate.

Abstract: A support device of a cassette includes a plurality of spacers and a support. The spacers extend from the side boards of the cassette into the substrate retaining space. The support is disposed on the spacers to support the substrates.