Patents by Inventor Kai-Yun Lin
Kai-Yun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230297759Abstract: A method of verifying an integrated circuit stack includes adding a first dummy layer to a first contact pad of a circuit, wherein a location of the first dummy layer is determined based on a location of a second contact pad of a connecting substrate. The method further includes converting the first dummy layer location to the connecting substrate. The method further includes adjusting the first dummy layer location in the circuit in response to a determination that the first dummy layer location is misaligned with the second contact pad. The method further includes performing a first layout versus schematic (LVS) check of the connecting substrate including the first dummy layer in response to a determination that the first dummy layer is aligned with the second contact pad.Type: ApplicationFiled: May 25, 2023Publication date: September 21, 2023Inventors: Feng Wei KUO, Shuo-Mao CHEN, Chin-Yuan HUANG, Kai-Yun LIN, Ho-Hsiang CHEN, Chewn-Pu JOU
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Patent number: 11675957Abstract: A method of verifying an integrated circuit stack includes adding a dummy layer to a contact pad of a functional circuit, wherein a location of the dummy layer is determined based on a location of a contact pad of a connecting substrate. The method further includes converting the dummy layer location to the connecting substrate. The method further includes performing a layout versus schematic (LVS) check of the connecting substrate including the dummy layer in response to a determination that the dummy layer is aligned with the contact pad of the connecting substrate.Type: GrantFiled: May 13, 2021Date of Patent: June 13, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Feng Wei Kuo, Shuo-Mao Chen, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou
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Publication number: 20220246509Abstract: A package structure and a method for forming the same are provided. The package structure includes a die, a first molding surrounding the die, a first redistribution layer (RDL), an interposer disposed over the first RDL, a second molding surrounding the interposer, a first via, and a second RDL. The first RDL includes a first dielectric layer disposed over the die and the first molding, and a first interconnect structure surrounded by the first dielectric layer and electrically connected to the die. The interposer is electrically connected to the die through the first interconnect structure. The first via extends through and within the second molding and is adjacent to the interposer. The second RDL includes a second dielectric layer disposed over the interposer and the second molding, and a second interconnect structure surrounded by the second dielectric layer and electrically connected to the via and the interposer.Type: ApplicationFiled: April 25, 2022Publication date: August 4, 2022Inventors: CHIN-HER CHIEN, PO-HSIANG HUANG, CHENG-HUNG YEH, TAI-YU WANG, MING-KE TSAI, YAO-HSIEN TSAI, KAI-YUN LIN, CHIN-YUAN HUANG, KAI-MING LIU, FONG-YUAN CHANG, CHIN-CHOU LIU, YI-KAN CHENG
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Patent number: 11387177Abstract: A package structure and a method for forming the same are provided. The package structure includes a die, a first molding surrounding the die, a first redistribution layer (RDL), an interposer disposed over the first RDL, a second molding surrounding the interposer, a first via, and a second RDL. The first RDL includes a first dielectric layer disposed over the die and the first molding, and a first interconnect structure surrounded by the first dielectric layer and electrically connected to the die. The interposer is electrically connected to the die through the first interconnect structure. The first via extends through and within the second molding and is adjacent to the interposer. The second RDL includes a second dielectric layer disposed over the interposer and the second molding, and a second interconnect structure surrounded by the second dielectric layer and electrically connected to the via and the interposer.Type: GrantFiled: June 17, 2019Date of Patent: July 12, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chin-Her Chien, Po-Hsiang Huang, Cheng-Hung Yeh, Tai-Yu Wang, Ming-Ke Tsai, Yao-Hsien Tsai, Kai-Yun Lin, Chin-Yuan Huang, Kai-Ming Liu, Fong-Yuan Chang, Chin-Chou Liu, Yi-Kan Cheng
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Publication number: 20210264094Abstract: A method of verifying an integrated circuit stack includes adding a dummy layer to a contact pad of a functional circuit, wherein a location of the dummy layer is determined based on a location of a contact pad of a connecting substrate. The method further includes converting the dummy layer location to the connecting substrate. The method further includes performing a layout versus schematic (LVS) check of the connecting substrate including the dummy layer in response to a determination that the dummy layer is aligned with the contact pad of the connecting substrate.Type: ApplicationFiled: May 13, 2021Publication date: August 26, 2021Inventors: Feng Wei KUO, Shuo-Mao CHEN, Chin-Yuan HUANG, Kai-Yun LIN, Ho-Hsiang CHEN, Chewn-Pu JOU
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Patent number: 11023647Abstract: A method of verifying an integrated circuit stack includes adding a dummy layer to a contact pad of a functional circuit, wherein a location of the dummy layer is determined based on a location of a contact pad of a connecting substrate. The method further includes converting the dummy layer location to the connecting substrate. The method further includes determining whether the dummy layer is aligned with the contact pad of the connecting substrate. The method further includes adjusting the dummy layer location in the functional circuit when the dummy layer location is misaligned with the contact pad of the connecting substrate.Type: GrantFiled: March 14, 2018Date of Patent: June 1, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Feng Wei Kuo, Shuo-Mao Chen, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou
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Publication number: 20200395281Abstract: A package structure and a method for forming the same are provided. The package structure includes a die, a first molding surrounding the die, a first redistribution layer (RDL), an interposer disposed over the first RDL, a second molding surrounding the interposer, a first via, and a second RDL. The first RDL includes a first dielectric layer disposed over the die and the first molding, and a first interconnect structure surrounded by the first dielectric layer and electrically connected to the die. The interposer is electrically connected to the die through the first interconnect structure. The first via extends through and within the second molding and is adjacent to the interposer. The second RDL includes a second dielectric layer disposed over the interposer and the second molding, and a second interconnect structure surrounded by the second dielectric layer and electrically connected to the via and the interposer.Type: ApplicationFiled: June 17, 2019Publication date: December 17, 2020Inventors: CHIN-HER CHIEN, PO-HSIANG HUANG, CHENG-HUNG YEH, TAI-YU WANG, MING-KE TSAI, YAO-HSIEN TSAI, KAI-YUN LIN, CHIN-YUAN HUANG, KAI-MING LIU, FONG-YUAN CHANG, CHIN-CHOU LIU, YI-KAN CHENG
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Publication number: 20180203972Abstract: A method of verifying an integrated circuit stack includes adding a dummy layer to a contact pad of a functional circuit, wherein a location of the dummy layer is determined based on a location of a contact pad of a connecting substrate. The method further includes converting the dummy layer location to the connecting substrate. The method further includes determining whether the dummy layer is aligned with the contact pad of the connecting substrate. The method further includes adjusting the dummy layer location in the functional circuit when the dummy layer location is misaligned with the contact pad of the connecting substrate.Type: ApplicationFiled: March 14, 2018Publication date: July 19, 2018Inventors: Feng Wei KUO, Shuo-Mao CHEN, Chin-Yuan HUANG, Kai-Yun LIN, Ho-Hsiang CHEN, Chewn-Pu JOU
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Patent number: 9922160Abstract: A method of verifying an integrated circuit stack includes adding a dummy layer to a contact pad of a functional circuit, wherein a location of the dummy layer is determined based on a location of a contact pad of a connecting substrate. The method further includes converting the dummy layer location to the connecting substrate; and determining whether the dummy layer is aligned with the contact pad of the connecting substrate. The method further includes performing an LVS check of the connecting substrate including the dummy layer; and adjusting the dummy layer location in the functional circuit if the dummy layer location is misaligned with the contact pad of the connecting substrate or the connecting substrate fails the LVS check. The method further includes repeating the converting step, the determining step, and the performing the LVS check step based on the adjusted dummy layer location.Type: GrantFiled: February 12, 2015Date of Patent: March 20, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Feng Wei Kuo, Shuo-Mao Chen, Chin-Yuan Huang, Kai-Yun Lin, Ho-Hsiang Chen, Chewn-Pu Jou
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Publication number: 20160239598Abstract: A method of verifying an integrated circuit stack includes adding a dummy layer to a contact pad of a functional circuit, wherein a location of the dummy layer is determined based on a location of a contact pad of a connecting substrate. The method further includes converting the dummy layer location to the connecting substrate; and determining whether the dummy layer is aligned with the contact pad of the connecting substrate. The method further includes performing an LVS check of the connecting substrate including the dummy layer; and adjusting the dummy layer location in the functional circuit if the dummy layer location is misaligned with the contact pad of the connecting substrate or the connecting substrate fails the LVS check. The method further includes repeating the converting step, the determining step, and the performing the LVS check step based on the adjusted dummy layer location.Type: ApplicationFiled: February 12, 2015Publication date: August 18, 2016Inventors: Feng Wei KUO, Shuo-Mao CHEN, Chin-Yuan HUANG, Kai-Yun LIN, Ho-Hsiang CHEN, Chewn-Pu JOU
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Patent number: 8359554Abstract: A method of designing and verifying 3D integrated circuits (3D IC) including providing a first layout corresponding to a first device of a 3D IC. The first layout includes a first interface layer. A second layout corresponding to a second device of the 3D IC is also provided. The second layout includes a second interface layer. A verification of the 3D is performed by verifying the first and second interface layers. The verification includes performing at least one of a design rule check (DRC) or a layout-versus-schematic (LVS) on the first and/or second interface layers.Type: GrantFiled: October 14, 2011Date of Patent: January 22, 2013Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Hsing Wang, Chih Sheng Tsai, Ying-Lin Liu, Kai-Yun Lin
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Publication number: 20120036489Abstract: A method of designing and verifying 3D integrated circuits (3D IC) including providing a first layout corresponding to a first device of a 3D IC. The first layout includes a first interface layer. A second layout corresponding to a second device of the 3D IC is also provided. The second layout includes a second interface layer. A verification of the 3D is performed by verifying the first and second interface layers. The verification includes performing at least one of a design rule check (DRC) or a layout-versus-schematic (LVS) on the first and/or second interface layers.Type: ApplicationFiled: October 14, 2011Publication date: February 9, 2012Applicant: Taiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")Inventors: Chung-Hsing Wang, Chih Sheng Tsai, Ying-Lin Liu, Kai-Yun Lin
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Patent number: 8060843Abstract: A method of designing a 3D integrated circuit (3D IC) including providing a first layout corresponding to a first device of a 3D IC and a second layout corresponding to a second device of a 3D IC is provided. A verification, such as LVS or DRC, may be performed not only on each device separately, but may also be performed to ensure proper connectivity between devices. The verification may be performed on a single layout file (e.g., GDS II file) including the interface layer of the first and second die. Dummy feature pattern may be determined for the 3D IC using a layout including the interface layers of the first and second devices.Type: GrantFiled: June 18, 2008Date of Patent: November 15, 2011Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chung-Hsing Wang, Chih Sheng Tsai, Ying-Lin Liu, Kai-Yun Lin
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Publication number: 20090319968Abstract: A method of designing a 3D integrated circuit (3D IC) including providing a first layout corresponding to a first device of a 3D IC and a second layout corresponding to a second device of a 3D IC is provided. A verification, such as LVS or DRC, may be performed not only on each device separately, but may also be performed to ensure proper connectivity between devices. The verification may be performed on a single layout file (e.g., GDS II file) including the interface layer of the first and second die. Dummy feature pattern may be determined for the 3D IC using a layout including the interface layers of the first and second devices.Type: ApplicationFiled: June 18, 2008Publication date: December 24, 2009Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chung-Hsing Wang, Chih Sheng Tsai, Ying-Lin Liu, Kai-Yun Lin