Patents by Inventor Kail S. Wathne

Kail S. Wathne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder reflow processor
    Patent number: 5524810
    Abstract: A tunnel-type processor for solder flow application of solder connections to circuit elements on a circuit board. The boards with deposited solder are passed through a heating zone and a cooling zone, on a platen. Heated or cooled gas is injected into the zones to maintain a suitable temperature along with the platen. A housing with an exhaust conduit encloses the platen and limits flow of gas from one zone into another. An optional top manifold can be provided to discharge gas into a respective zone.
    Type: Grant
    Filed: April 14, 1994
    Date of Patent: June 11, 1996
    Assignee: Sikama International, Inc.
    Inventor: Kail S. Wathne