Abstract: Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles.

Abstract: Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles.

Abstract: A variable voltage protection component in accordance with this invention comprises a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. With this configuration, the reinforcing layer defines a uniform thickness for the variable voltage protection component that is resist to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection component can be attached to a compressible ground plane to form a variable voltage protection device. Methods are provided for making the variable voltage protection component and device.

Abstract: A variable voltage protection component in accordance with this invention comprises a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. With this configuration, the reinforcing layer defines a uniform thickness for the variable voltage protection component that is resist to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection component can be attached to a compressible ground plane to form a variable voltage protection device. Methods are provided for making the variable voltage protection component and device.

Abstract: A variable voltage protection component in accordance with this invention comprises a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. With this configuration, the reinforcing layer defines a uniform thickness for the variable voltage protection component that is resist to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection component can be attached to a compressible grounding plane to form a variable voltage protection device. Methods are provided for making the variable voltage protection component and device.

Abstract: A variable voltage protection component is provided with a reinforcing layer of insulating material having a substantially constant thickness embedded in a voltage variable material. The reinforcing layer defines a uniform thickness for the variable voltage protection component that is resistant to compressive forces that may cause a reduction in the clamp voltage or a short in the voltage variable material. In addition, the variable voltage protection device component can be attached to a compressible ground plane to form a variable voltage protection device.

Abstract: A mass-producible, cost-effective discrete electrical protection device utilizing a precision gap between two electrically conductive members attached to an electrically insulating substrate to provide over-voltage protection to an electrical device. In one aspect, the electrical protection device is a surface mountable device. In another aspect, the device has through-holes for accommodating leads on an electrical connector. Methods are provided also for making the electrical protection device.

Abstract: Disclosed is a variable voltage protection device for electronic devices which in one aspect comprises a thin layer of neat dielectric polymer or glass positioned between a ground plane and an electrical conductor for overvoltage protection, wherein the neat polymer or glass layer does not include the presence of conductive or semiconductive particles. Also disclosed is the combination of the neat dielectric polymer or glass thin layer positioned on a conventional variable voltage protection material comprising a binder containing conductive or semiconductive particles. A multi-layer variable voltage protection component is disclosed comprising three layers of overvoltage protection material wherein the outer two layers contain a lower percentage of conductive or semiconductive particles and wherein the inner layer contains a higher percentage of conductive or semiconductive particles.

Abstract: Plural groups of one or more magnetic domain devices each are mounted in an array on the circuitized surface of a common substrate. A rectangular pattern of slots is provided in the substrate around each group. Each group is encompassed through the slots by the turns of the inner and outer orthogonal solenoids of its own exlusive rotational magnetic field drive system and permanent magnet bias field closed structure. Each device has a pattern of I/O pads located on its undersurface which are bonded to a corresponding pattern of terminal pads which are part of the circuitized surface of the substrate. The interconnecting signal lines to the terminal pads of the substrate pass through one or more of the four intersection corners formed between the slots of the rectangular pattern. Preferably, the substrate also accommodates integrated circuit modules and/or other components mounted thereon which are associated with the drive, sense and other support circuitry for the magnetic domain devices.

Abstract: A plurality of metal studs are plated on a chip carrier surface in a pattern to match a terminal metal footprint on a chip to be joined. The studs are of sufficient height to permit flux cleaning, if necessary. After the studs are in place, the chip is aligned with the carrier and attached thereto, the chip pads containing a small amount of solder to provide the connecting joints. The carrier and chip are made of materials having nearly equal thermal expansion characteristics.

Abstract: This is a microelectronic multilayer circuit structure having circuit compatibility encapsulated within the circuit package including conductive electrical interconnection means formed by uniquely metallizing the "via" and/or blind interconnection holes within the circuit package. The assembly process provides means of uniformly metallizing the interlayer connecting holes.