Abstract: A heat removing edge guide system removes heat from a circuit board. The system includes a heat sink plate, a stationary guide fixed to the mounting surface of the heat sink plate, and a moving guide slidably mounted on a top surface of the stationary guide. Sliding of the moving guide along the upper surface of the stationary guide causes a change in the vertical distance between the mounting surface of the heat sink plate and the upper surface of the moving guide. The moving guide, the stationary guide and the heat sink plate form a thermally conductive path. A screw-adjusted side guide can also be provided to cause a wedging with a lateral wall of the chassis support and thus provide an additional heat sink path and system stability.