Abstract: Systems and methods are provided to enable efficient testing of an integrated circuit package. Such a system may include an integrated circuit package and a testing device to test a first portion of socket pins of the integrated circuit package corresponding to a first portion of a die area using a socket during a first pass, and test a second portion of socket pins of the integrated circuit package corresponding to a second portion of the die area using the socket during a second pass.

Abstract: An integrated circuit may include an embedded test processor that is capable of performing in-field testing and repair of hardware-related defects without having to remove the integrated circuit from the customer's board. The test processor can be used to drive and monitor test vectors to performing defect screening on input-output circuitry, logic circuitry including lookup table (LUT) circuits and digital signal processing (DSP) circuits, transceiver circuitry, and configuration random-access memory circuitry. The test processor can generate a failure mechanism report and selectively fix repairable defects via a hardware redundancy scheme. The failure mechanism report allows the customer to identify the root cause of failure in the overall system.

Abstract: A method of screening for configuration-related defects in integrated circuits is provided. To detect configuration defects, test pattern configuration data and error correction data for that test pattern are loaded into configuration memory. Existing cyclic redundancy check circuitry on the integrated circuit is recruited to compute check-sum signatures based on the data stored in each frame of the memory array. Defects in configuration memory cells and configuration-related circuitry are identified by comparing the error correction data of frame to the computed check-sum signature of a frame. Localized freezing of programmable logic associated with configuration memory is optionally applied to eliminate data contention and ensure maximum coverage of the memory array during screening. Several test patterns of configuration data are also provided.

Abstract: An integrated circuit may include an embedded test processor that is capable of performing in-field testing and repair of hardware-related defects without having to remove the integrated circuit from the customer's board. The test processor can be used to drive and monitor test vectors to performing defect screening on input-output circuitry, logic circuitry including lookup table (LUT) circuits and digital signal processing (DSP) circuits, transceiver circuitry, and configuration random-access memory circuitry. The test processor can generate a failure mechanism report and selectively fix repairable defects via a hardware redundancy scheme. The failure mechanism report allows the customer to identify the root cause of failure in the overall system.

Abstract: A method of screening for configuration-related defects in integrated circuits is provided. To detect configuration defects, test pattern configuration data and error correction data for that test pattern are loaded into configuration memory. Existing cyclic redundancy check circuitry on the integrated circuit is recruited to compute check-sum signatures based on the data stored in each frame of the memory array. Defects in configuration memory cells and configuration-related circuitry are identified by comparing the error correction data of frame to the computed check-sum signature of a frame. Localized freezing of programmable logic associated with configuration memory is optionally applied to eliminate data contention and ensure maximum coverage of the memory array during screening. Several test patterns of configuration data are also provided.

Abstract: A design-for-test (DFT) circuitry is disclosed. The DFT circuitry includes a first multiplexer operable to transfer one of a clock signal or an inverted clock signal based on a clock polarity control signal. The DFT circuitry also includes a burst counter coupled to the first multiplexer. The burst counter is operable to output a signal at a first logic state for a predefined pulse count. The DFT circuitry also includes a second multiplexer that is operable to output one of the clock polarity control signal or the clock signal according to a signal output from the burst counter. The DFT circuitry may also include a third multiplexer that forwards control signals identifying the predefined pulse count to the burst counter from different sources such as an external pin, a programmable interconnect, and a memory element.

Abstract: Circuits and a method for testing an integrated circuit (IC) are disclosed. A disclosed circuit block includes a selector circuit that is coupled to receive an enable signal and two clock signals. One of the two clock signals is selected as an output of the selector circuit based on the enable signal received. A storage element is coupled to receive the enable signal and the output of the selector circuit as a clock input signal. A logic gate is coupled to receive the output of the storage element and the enable signal. Another selector circuit is coupled to receive an output from the logic gate and the enable signal. The selector circuit selects either the output from the logic gate or the enable signal as a scan enable signal for a scan chain on the IC.

Abstract: A design-for-test (DFT) circuitry is disclosed. The DFT circuitry includes a first multiplexer operable to transfer one of a clock signal or an inverted clock signal based on a clock polarity control signal. The DFT circuitry also includes a burst counter coupled to the first multiplexer. The burst counter is operable to output a signal at a first logic state for a predefined pulse count. The DFT circuitry also includes a second multiplexer that is operable to output one of the clock polarity control signal or the clock signal according to a signal output from the burst counter. The DFT circuitry may also include a third multiplexer that forwards control signals identifying the predefined pulse count to the burst counter from different sources such as an external pin, a programmable interconnect, and a memory element.

Abstract: A programmable integrated circuit may contain multiple logic blocks. Computing equipment may be used to run automated tools that process a design for the programmable integrated circuit to perform corresponding circuit tests. A translation tool may translate a transistor-level description of circuitry on the programmable integrated circuit into a gate-level description. A block-level test configuration data generation tool may generate block-level test configuration data files. The test configuration data files may be used as constraints for an automatic test pattern generation tool that produces block-level test vectors. A full-chip propagation tool may use the block-level test vectors, block-level test configuration data files, and full-chip constraints to produce corresponding full-chip test configuration data and full-chip test vectors for testing the integrated circuit. A translation tool may convert the configuration data and test vectors into a tester file.