Abstract: An ultra low-k dielectric material layer is formed on a semiconductor substrate. In one embodiment, a grid of wires is placed at a distance above a top surface of the ultra low-k dielectric material layer and is electrically biased such that the total electron emission coefficient becomes 1.0 at the energy of electrons employed in electron beam curing of the ultra low-k dielectric material layer. In another embodiment, a polymeric conductive layer is formed directly on the ultra low-k dielectric material layer and is electrically biased so that the total electron emission coefficient becomes 1.0 at the energy of electrons employed in electron beam curing of the ultra low-k dielectric material layer. By maintaining the total electron emission coefficient at 1.0, charging of the substrate is avoided, thus protecting any device on the substrate from any adverse changes in electrical characteristics.

Abstract: An ultra low-k dielectric material layer is formed on a semiconductor substrate. In one embodiment, a grid of wires is placed at a distance above a top surface of the ultra low-k dielectric material layer and is electrically biased such that the total electron emission coefficient becomes 1.0 at the energy of electrons employed in electron beam curing of the ultra low-k dielectric material layer. In another embodiment, a polymeric conductive layer is formed directly on the ultra low-k dielectric material layer and is electrically biased so that the total electron emission coefficient becomes 1.0 at the energy of electrons employed in electron beam curing of the ultra low-k dielectric material layer. By maintaining the total electron emission coefficient at 1.0, charging of the substrate is avoided, thus protecting any device on the substrate from any adverse changes in electrical characteristics.

Abstract: An ultra low-k dielectric material layer is formed on a semiconductor substrate. In one embodiment, a grid of wires is placed at a distance above a top surface of the ultra low-k dielectric material layer and is electrically biased such that the total electron emission coefficient becomes 1.0 at the energy of electrons employed in electron beam curing of the ultra low-k dielectric material layer. In another embodiment, a polymeric conductive layer is formed directly on the ultra low-k dielectric material layer and is electrically biased so that the total electron emission coefficient becomes 1.0 at the energy of electrons employed in electron beam curing of the ultra low-k dielectric material layer. By maintaining the total electron emission coefficient at 1.0, charging of the substrate is avoided, thus protecting any device on the substrate from any adverse changes in electrical characteristics.

Abstract: An ultra low-k dielectric material layer is formed on a semiconductor substrate. In one embodiment, a grid of wires is placed at a distance above a top surface of the ultra low-k dielectric material layer and is electrically biased such that the total electron emission coefficient becomes 1.0 at the energy of electrons employed in electron beam curing of the ultra low-k dielectric material layer. In another embodiment, a polymeric conductive layer is formed directly on the ultra low-k dielectric material layer and is electrically biased so that the total electron emission coefficient becomes 1.0 at the energy of electrons employed in electron beam curing of the ultra low-k dielectric material layer. By maintaining the total electron emission coefficient at 1.0, charging of the substrate is avoided, thus protecting any device on the substrate from any adverse changes in electrical characteristics.

Abstract: The invention is directed to a method for forming a metal coating on a substrate by applying an oxalate of a Group VIII element from the Periodic Table of the Elements to the substrate. The oxalate is selected so that it will decompose to a complex of a zero valent Group VIII element or a Group VIII element on exposure to an energy source. Microelectronic circuits, etch masks or metal contacts on superconductors can be formed by the method when the oxalate coating is exposed to an energy source through a mask or the energy source beamed at the oxalate to trace a pattern on it.The metal thus obtained can be subsequently coated by electroless compositions especially where the Group VIII element is a catalyst for electroless coatings such as palladium. Additionally, the metal coating may be coated by an electrolytic composition.

Abstract: Methods are described for producing a needle probe tip having prescribed magnetic properties for a scanning magnetic force microscope (MFM) on a substrate positioned in an evacuated environment. A substantially rigid, nanometer-scale needle-like structure is produced by selective decomposition of a volatile organic compound by a highly focussed electron beam. Processing steps are described to obtain prescribed magnetic properties of such a needle probe structure; in particular, the fabrication of a single magnetic domain, with hard or soft magnetic properties at the distal end of the needle structure. Three dimensional probe tips are also achieved. These magnetic sensing probes allow magnetic imaging at the nanometer-scale level.