Patents by Inventor Kam Lam
Kam Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140341691Abstract: Disclosed is a bonding apparatus, comprising: i) a supporting device for supporting a supply of electronic devices; ii) an ejecting device for ejecting an electronic device from the supply of electronic devices; iii) a plurality of delivery devices, each delivery device being for delivering a substrate for bonding the electronic devices thereto; and iv) a plurality of transfer devices, each transfer device having a rotary transfer arm operable to transfer the electronic devices from the supply of electronic devices at one or more pick locations to a respective one of the substrates for bonding thereto, upon the electronic devices being ejected by the ejecting device from the supply of electronic devices at the one or more pick locations. A method of bonding electronic devices to substrates is also disclosed.Type: ApplicationFiled: May 7, 2014Publication date: November 20, 2014Inventors: Kui Kam LAM, Yen Hsi TANG, Wing Fai LAM
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Patent number: 8804136Abstract: Disclosed is an optical apparatus for locating a plurality of placement positions on a carrier object. The optical apparatus comprises: i) an imaging device having a plurality of imaging sensors, each imaging sensor being operative to capture an image of a part of a selected row of placement positions on the carrier object and the plurality of imaging sensors defining a combined field of view that includes all the selected row of placement positions; ii) a positioning device coupled to the imaging device, the positioning device being operative to position the imaging device relative to successive rows of placement positions on the carrier object; and iii) a processor connected to the imaging device and which is configured to receive the images captured by the plurality of imaging sensors for image processing in order to identify exact locations of the placement positions comprised in the selected row of placement positions.Type: GrantFiled: December 6, 2012Date of Patent: August 12, 2014Assignee: ASM Technology Singapore Pte LtdInventors: Kui Kam Lam, Yen Hsi Tang, Wenling Chan, Shun Ming Fung
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Publication number: 20140207569Abstract: A point-of-sale system is provided that permits users to self-manage prepaid debit cards. Such a system may be capable of identifying and managing a number of different prepaid debit cards provided by different card issuers. The system may permit, for example, a user to purchase, activate, load funds, or perform other management operations with such cards. The system may also enforce restrictions associated with particular card types, and follow process flows for activating and performing other operations of such cards. The system may also be easily extendible to other types of prepaid cards through established card network relationships.Type: ApplicationFiled: January 18, 2013Publication date: July 24, 2014Applicant: WAL-MART STORES, INC.Inventors: Kam Lam, Anthony Hylton, Mark Matthews
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Publication number: 20140160492Abstract: Disclosed is an optical apparatus for locating a plurality of placement positions on a carrier object. The optical apparatus comprises: i) an imaging device having a plurality of imaging sensors, each imaging sensor being operative to capture an image of a part of a selected row of placement positions on the carrier object and the plurality of imaging sensors defining a combined field of view that includes all the selected row of placement positions; ii) a positioning device coupled to the imaging device, the positioning device being operative to position the imaging device relative to successive rows of placement positions on the carrier object; and iii) a processor connected to the imaging device and which is configured to receive the images captured by the plurality of imaging sensors for image processing in order to identify exact locations of the placement positions comprised in the selected row of placement positions.Type: ApplicationFiled: December 6, 2012Publication date: June 12, 2014Inventors: Kui Kam LAM, Yen Hsi TANG, Wenling CHAN, Shun Ming FUNG
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Patent number: 8590143Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.Type: GrantFiled: May 25, 2011Date of Patent: November 26, 2013Assignee: ASM Technology Singapore Pte. Ltd.Inventors: Kui Kam Lam, Yen Hsi Tang, Wai Yuen Cheung, Wing Kin Lam
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Publication number: 20130178002Abstract: Method and apparatus for fabricating a light-emitting diode package Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.Type: ApplicationFiled: January 10, 2012Publication date: July 11, 2013Applicant: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Kui Kam LAM, Ka Yee MAK, Yiu Yan WONG, Ming LI
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Publication number: 20130119113Abstract: An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.Type: ApplicationFiled: January 10, 2013Publication date: May 16, 2013Inventors: Kui Kam LAM, Pingliang TU, Chun Hung Samuel IP
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Patent number: 8357013Abstract: The present invention involves connectors for reducing Far-End Crosstalk (FEXT) through the use of novel polarity swapping to negate the cumulative effect of FEXT. Skew adjustment is used to improve the FEXT cancellation from polarity swapping. The polarity reversal location or locations among FEXT sources are optimized to achieve maximum FEXT cancellation. The novelty polarity swapping technique can be applied to a wide variety of connectors, such as mezzanine connectors, backplane connectors, and any other connectors that can benefit from FEXT reduction.Type: GrantFiled: November 5, 2009Date of Patent: January 22, 2013Assignee: Hirose Electric Co., Ltd.Inventors: Tatsuya Arai, Ching-Chao Huang, Clement Kam Lam Luk, Jeremy Buan, Tsutomu Matsuo, Toshiyuki Takada, Masakazu Nagata
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Publication number: 20120301251Abstract: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing is disclosed. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually levelled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.Type: ApplicationFiled: May 25, 2011Publication date: November 29, 2012Applicant: ASM TECHNOLOGY SINGAPORE PTE. LTD.Inventors: Kui Kam LAM, Yen Hsi Tang, Wai Yuen Cheung, Wing Kin Lam
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Patent number: 8293043Abstract: A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.Type: GrantFiled: July 24, 2006Date of Patent: October 23, 2012Assignee: ASM Assembly Automation LtdInventors: Kwok Kee Chung, Kui Kam Lam, Chi Keung Leung, Wai Yuen Cheung
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Publication number: 20120094440Abstract: A method of bonding semiconductor dice onto a substrate first uses an optical assembly to perform pattern recognition of a die bonding section of the substrate in which multiple die pads are located so as to identify positions of the multiple die pads simultaneously during such pattern recognition step. After pattern recognition of the said die bonding section, an adhesive is dispensed with an adhesive dispenser onto at least one of the die pads located in the die bonding section. While the adhesive dispenser is dispensing the adhesive to further die pads located in the die bonding section, a pick-and-place arm concurrently bonds a die onto each die pad where the adhesive has already been dispensed.Type: ApplicationFiled: October 15, 2010Publication date: April 19, 2012Inventors: Kwok Kee CHUNG, Kui Kam LAM, Yen Hsi TANG, Kwok Kiu CHAN
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Publication number: 20110272452Abstract: An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.Type: ApplicationFiled: May 4, 2010Publication date: November 10, 2011Inventors: Kui Kam Lam, Pingliang Tu, Chun Hung Samuel Ip
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Patent number: 7977231Abstract: Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.Type: GrantFiled: November 8, 2010Date of Patent: July 12, 2011Assignee: ASM Assembly Automation LtdInventors: Kui Kam Lam, Yen Hsi Tang, Yiu Yan Wong, Hok Man Wan
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Publication number: 20100183141Abstract: The present invention involves chip-to-chip communication systems for reducing Far-End Crosstalk (FEXT) through the use of novel polarity swapping to negate the cumulative effect of FEXT. Skew adjustment is used to improve the FEXT cancellation from polarity swapping. The polarity reversal location or locations among FEXT sources are optimized to achieve maximum FEXT cancellation. The novelty polarity swapping technique can be applied to a wide variety of systems that can benefit from FEXT reduction.Type: ApplicationFiled: November 5, 2009Publication date: July 22, 2010Applicant: Hirose Electric USA Inc.Inventors: Tatsuya Arai, Ching-Chao Huang, Clement Kam Lam Luk, Jeremy Buan, Tsutomu Matsuo, Toshiyuki Takada, Masakazu Nagata
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Publication number: 20100184307Abstract: The present invention involves connectors for reducing Far-End Crosstalk (FEXT) through the use of novel polarity swapping to negate the cumulative effect of FEXT. Skew adjustment is used to improve the FEXT cancellation from polarity swapping. The polarity reversal location or locations among FEXT sources are optimized to achieve maximum FEXT cancellation. The novelty polarity swapping technique can be applied to a wide variety of connectors, such as mezzanine connectors, backplane connectors, and any other connectors that can benefit from FEXT reduction.Type: ApplicationFiled: November 5, 2009Publication date: July 22, 2010Applicant: Hirose Electric USA Inc.Inventors: Tatsuya Arai, Ching-Chao Huang, Clement Kam Lam Luk, Jeremy Buan, Tsutomu Matsuo, Toshiyuki Takada, Masakazu Nagata
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Patent number: 7737808Abstract: A connector has data signal conductors for communicating data signals and voltage reference (power and ground) conductors for the signals' return currents. Voltage reference conductors carrying the same voltage level are coupled together at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals. Decoupling capacitors may alternatively or additionally be inserted between pairs of voltage reference conductors carrying high and low voltage levels at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals.Type: GrantFiled: August 20, 2008Date of Patent: June 15, 2010Assignee: Hirose ElectricInventors: Ching-Chao Huang, Gong-Jong Yeh, Clement Kam Lam Luk, Tatsuya Arai
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Patent number: 7735715Abstract: A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.Type: GrantFiled: December 7, 2007Date of Patent: June 15, 2010Assignee: ASM Assembly Automation LtdInventors: Kui Kam Lam, Chun Hung Samuel Ip
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Publication number: 20100045408Abstract: A connector has data signal conductors for communicating data signals and voltage reference (power and ground) conductors for the signals' return currents. Voltage reference conductors carrying the same voltage level are coupled together at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals. Decoupling capacitors may alternatively or additionally be inserted between pairs of voltage reference conductors carrying high and low voltage levels at one or more points between the ends of the connector to shift the connector's resonant frequency beyond an operating frequency range of the data signals.Type: ApplicationFiled: August 20, 2008Publication date: February 25, 2010Inventors: Ching-Chao Huang, Gong-Jong Yeh, Clement Kam Lam Luk, Tatsuya Arai
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Patent number: 7648901Abstract: A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.Type: GrantFiled: September 28, 2006Date of Patent: January 19, 2010Assignee: ASM Assembly Automation Ltd.Inventors: Ping Liang Tu, Deming Liu, Kui Kam Lam, Man Chung Raymond Ng
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Publication number: 20090145950Abstract: A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.Type: ApplicationFiled: December 7, 2007Publication date: June 11, 2009Inventors: Kui Kam LAM, Chun Hung Samuel Ip