Patents by Inventor Kamal Kumar Sikka

Kamal Kumar Sikka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and structure for cooling a dual chip module with one high power chip
    Patent number: 7031162
    Abstract: Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mates to a heat sink with the smallest interface gap. The variable and higher gaps between the lower power spreaders and the heat sink base are accommodated by compressible thermal pad or grease materials.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: April 18, 2006
    Assignee: International Business Machines Corporation
    Inventors: Amilcar R. Arvelo, Kamal Kumar Sikka, Hilton T. Toy