Patents by Inventor Kamal N. Mehta

Kamal N. Mehta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molded semiconductor package having improved heat dissipation
    Patent number: 4684975
    Abstract: An improved metal tape for tape automated bonding provides for enhanced heat dissipation from the packaged semiconductor device. The invention includes two aspects. In the first aspect, individual metal tape leads are extended inward beyond the peripheral bonding pads of the semiconductor and over the active region of the semiconductor device. In this way, the leads are able to conduct heat away from the active region of the device. The second aspect of the invention relates to improved heat dissipation through the individual leads. The leads are flared or otherwise increased in area in the direction away from the active region of the semiconductor device to prove the radiative dissipation.
    Type: Grant
    Filed: December 16, 1985
    Date of Patent: August 4, 1987
    Assignee: National Semiconductor Corporation
    Inventors: Hem P. Takiar, Kamal N. Mehta