Patents by Inventor Kamanio Chattopadhyay
Kamanio Chattopadhyay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190262951Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0 to 1 wt % Cu; from 0 to 0.5 wt % Co; from 0.0001 to 1.0% Sb; and the balance Sn, together with any unavoidable impurities.Type: ApplicationFiled: May 7, 2019Publication date: August 29, 2019Applicant: ALPHA ASSEMBLY SOLUTIONS, INC.Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K. N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Publication number: 20190255662Abstract: A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.Type: ApplicationFiled: May 7, 2019Publication date: August 22, 2019Applicant: ALPHA ASSEMBLY SOLUTIONS INC.Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K. N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Publication number: 20180290244Abstract: A lead-free solder alloy, comprising from 35 to 59% wt Bi; Cu in a concentration up to 1.0 wt %; from 0.01 to 0.5 wt % Ni; and the balance Sn, together with any unavoidable impurities, with certain embodiments further comprising Ag, such as up to 1 wt % Ag.Type: ApplicationFiled: June 8, 2018Publication date: October 11, 2018Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Patent number: 9816159Abstract: The present subject matter describes Ni—Al—Zr alloys, which include Ni as the major component, with the additions of 9-20% Al and 4-14% Zr by atomic percentage. In one embodiment, the present subject matter describes a group of alloy compositions in a Nickel-Aluminum-Zirconium (Ni—Al—Zr) system corresponding to a concentration range of about 9-20% Al and about 4-14% Zr by atomic percentages, and the balance being Ni. In other embodiment, the present subject matter includes at least one eutectic constituent including at least two of the intermetallic compounds or phases Ni3Al, NiAl, Ni5Zr, Ni7Zr2 and derivatives that are realized within the aforementioned composition group.Type: GrantFiled: June 4, 2012Date of Patent: November 14, 2017Assignee: INDIAN INSTITUTE OF SCIENCEInventors: Chandrasekhar Tiwary, Sanjay Kashyap, Olu Emmanuel Femi, Dipankar Banerjee, Kamanio Chattopadhyay
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Publication number: 20170304955Abstract: The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to .0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to .0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to .0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.Type: ApplicationFiled: July 7, 2017Publication date: October 26, 2017Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K. N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Publication number: 20170136583Abstract: A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag.Type: ApplicationFiled: January 30, 2017Publication date: May 18, 2017Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K. N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Publication number: 20170037498Abstract: Embodiments herein present the invention of a class of Tungsten (W) free Cobalt based (?-??) superalloys with the basic chemical composition comprising in % by weight: 0.5 to 10 Aluminium (Al) and 1 to 15 Molybdenum (Mo) with at least one or both of 0.5 to 12 Niobium (Nb) and 0.5 to 12 Tantalum (Ta), with the remainder being Cobalt (Co). Some part of the cobalt can be replaced by nickel (50% or less). In Nickel added alloys, some part of either cobalt of nickel can be replaced by at least one among the transition metal selected from the group consisting of 10% or less Iridium, 10% or less Platinum, 10% or less Palladium, 15% or less Chromium and combination thereof.Type: ApplicationFiled: March 21, 2015Publication date: February 9, 2017Applicant: Indian Institute of ScienceInventors: Surendra Kumar MAKINENI, Nithin BALER, Kamanio CHATTOPADHYAY
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Publication number: 20160214213Abstract: A lead-free solder alloy, comprising from 35 to 59% wt Bi; Cu in a concentration up to 1.0 wt %; from 0.01 to 0.5 wt % Ni; and the balance Sn, together with any unavoidable impurities, with certain embodiments further comprising Ag, such as up to 1 wt % Ag.Type: ApplicationFiled: December 28, 2015Publication date: July 28, 2016Applicant: ALPHA METALS, INC.Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Publication number: 20160144462Abstract: A lead-free solder alloy comprising 35-59 wt % Bi, Mn in a concentration up to 1.0 wt %, Cu in a concentration of up to 1 wt %, and balance Sn, together with any unavoidable impurities. Some embodiments also contain up to about 1 wt % Ag.Type: ApplicationFiled: December 28, 2015Publication date: May 26, 2016Applicant: ALPHA METALS, INC.Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Publication number: 20150292062Abstract: The present subject matter describes Ni—Al—Zr alloys, which include Ni as the major component, with the additions of 9-20% Al and 4-14% Zr by atomic percentage. In one embodiment, the present subject matter describes a group of alloy compositions in a Nickel-Aluminium-Zirconium (Ni—Al—Zr) system corresponding to a concentration range of about 9-20% Al and about 4-14% Zr by atomic percentages, and the balance being Ni. In other embodiment, the present subject matter includes at least one cutectic constituent including at least two of the intermetallic compounds or phases Ni3Al, NiAl, Ni5Zr, Ni7Zr2 and derivatives that are realized within the aforementioned composition group.Type: ApplicationFiled: June 4, 2012Publication date: October 15, 2015Applicant: Indian Institute of ScienceInventors: Chandrasekhar Tiwary, Sanjay Kashyap, Olu Emmanuel Femi, Dipankar Banerjee, Kamanio Chattopadhyay
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Publication number: 20140219711Abstract: High Impact Toughness Alloy The invention provides an alloy, preferably a lead-free solder alloy, comprising: from 35 to 59% wt Bi; from 0 to 0.0 wt % Ag; from 0 to 1.0% wt Au; from 0 to 1.0% wt Cr; from 0 to 2.0% wt In; from 0 to 1.0% wt P; from 0 to 1.0% wt Sb; from 0 to 1.0% wt Sc; from 0 to 1.0% wt Y; from 0 to 1.0% wt Zn; from 0 to 1.0% wt rare earth elements; one or more of: 10 from greater than 0 to 1.0% wt Al; from 0.01 to 1.0% wt Ce; from greater than 0 to 1.0% wt Co; from greater than 0 to 0.0% wt Cu; from 0.001 to 1.0% wt Ge; from greater than 0 to 0.0% wt Mg; from greater than 0 to 1.0% wt Mn; from 0.01 to 1.0% wt Ni; and from greater than 0 to 1.0% wt Ti, and the 1 balance Sn, together with any unavoidable impurities.Type: ApplicationFiled: August 2, 2012Publication date: August 7, 2014Applicant: ALPHA METALS, INC.Inventors: Ranjit Pandher, Bawa Singh, Siuli Sarkar, Sujatha Chegudi, Anil K.N. Kumar, Kamanio Chattopadhyay, Dominic Lodge, Morgana de Avila Ribas
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Publication number: 20140199115Abstract: A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.Type: ApplicationFiled: August 2, 2012Publication date: July 17, 2014Applicant: ALPHA METALS, INC.Inventors: Morgana de Avila Ribas, Dominic Lodge, Ranjit Pandher, Bawa Singh, Ravindra M. Bhatkal, Rahul Raut, Siuli Sarkar, Kamanio Chattopadhyay, Proloy Nandi