Patents by Inventor Kamran Rahmani
Kamran Rahmani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11980009Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.Type: GrantFiled: September 9, 2022Date of Patent: May 7, 2024Assignee: Ciena CorporationInventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
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Publication number: 20240049434Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.Type: ApplicationFiled: October 10, 2023Publication date: February 8, 2024Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
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Publication number: 20230039781Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.Type: ApplicationFiled: September 9, 2022Publication date: February 9, 2023Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Shearman, Daniel Rivaud
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Publication number: 20220352651Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.Type: ApplicationFiled: September 9, 2020Publication date: November 3, 2022Inventors: Mitchell O'Leary, Victor Aldea, Kamran Rahmani, Trevor Meunier, Peter Ajersch, Terence Graham, Marc Leclair
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Patent number: 11378757Abstract: An optical fiber connector of a networking module faceplate assembly includes a shuttle body, a connection assembly, and a retention clip. The shuttle body including a fiber slot extending across the shuttle body and adapted for an optical fiber to extend therethrough. The connection assembly is adapted to connect the optical fiber of the networking module to an external optical fiber connector. The connection assembly includes a ferrule flange fiber termination, a split sleeve, and a ferrule. The ferrule flange fiber termination positioned within the shuttle body and adapted to splice to an end of the optical fiber. A length of the optical fiber connector can be less than half a length of the external optical fiber connector.Type: GrantFiled: December 17, 2020Date of Patent: July 5, 2022Assignee: Ciena CorporationInventors: Mitchell O'Leary, Yannick Brisebois, Victor Aldea, Trevor Meunier, Kamran Rahmani
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Publication number: 20220196923Abstract: An optical fiber connector of a networking module faceplate assembly includes a shuttle body, a connection assembly, and a retention clip. The shuttle body including a fiber slot extending across the shuttle body and adapted for an optical fiber to extend therethrough. The connection assembly is adapted to connect the optical fiber of the networking module to an external optical fiber connector. The connection assembly includes a ferrule flange fiber termination, a split sleeve, and a ferrule. The ferrule flange fiber termination positioned within the shuttle body and adapted to splice to an end of the optical fiber. A length of the optical fiber connector can be less than half a length of the external optical fiber connector.Type: ApplicationFiled: December 17, 2020Publication date: June 23, 2022Inventors: Mitchell O'Leary, Yannick Brisebois, Victor Aldea, Trevor Meunier, Kamran Rahmani
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Publication number: 20210112683Abstract: A network element include one or more modules each supporting one or more pluggable modules; and a first manifold and a second manifold each configured to connect to a conduit associated with a coldplate, wherein one of the first manifold and the second manifold is an inlet manifold and the other is an outlet manifold for a cooling fluid that flows through the conduit to cool the one or more pluggable modules. The one or more pluggable modules can be each a pluggable optical module that is one of compliant to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD and have a housing that has dimensions similar to any of XFP, SFP, XENPAK, X2, CFP, CFP2, CFP4, CFP8, QSFP, QSFP+, QSFP28, OSFP, and QSFP-DD.Type: ApplicationFiled: October 15, 2020Publication date: April 15, 2021Inventors: Behzad Mohajer, Terence Graham, Peter Ajersch, Bonnie L. Mack, Marko Nicolici, Michael Bishop, Kamran Rahmani, Simon J. Sherman
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Publication number: 20210084746Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.Type: ApplicationFiled: September 16, 2019Publication date: March 18, 2021Inventors: Mitchell O'Leary, Victor Aldea, Kamran Rahmani, Trevor Meunier, Peter Ajersch, Terence Graham, Marc Leclair
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Patent number: 10939536Abstract: A module for use in a hardware platform for networking, computing, and/or storage includes a printed circuit board assembly having a primary side and a secondary side, wherein the primary side includes more physical space, in a vertical direction extending out from the printed circuit board assembly, than the secondary side; electrical and/or optical components disposed on the primary side of the printed circuit board assembly; and a secondary side heatsink located on and extending from the secondary side, wherein the secondary side heatsink is disposed to one of i) an electrical and/or optical component disposed on the secondary side, and ii) an optical component disposed on the primary side, for thermal management.Type: GrantFiled: September 16, 2019Date of Patent: March 2, 2021Assignee: Ciena CorporationInventors: Mitchell O'Leary, Victor Aldea, Kamran Rahmani, Trevor Meunier, Peter Ajersch, Terence Graham, Marc Leclair
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Patent number: 10782492Abstract: A heatsink for pluggable optical devices that incorporates features to limit the travel and deformation of the mating/mated spring clip that holds the heatsink to the cage of a pluggable optical device. The heatsink bearing surface takes the shape and contour of the leaf spring portion of the spring clip, thereby contacting and supporting it well before it plastically yields and permanently deforms. The shape of this feature, which may be coupled to or integrally formed with the heatsink bearing surface, can match exactly the shape of the spring clip or approximate the shape using a curved, variable, or other easier to manufacture profile, as long as the associated protrusions extend up into the corners of the leaf spring portion of the spring clip. This feature effectively acts as a hard stop and prevents the spring clip from being compromised due to improper handling or installation.Type: GrantFiled: February 8, 2019Date of Patent: September 22, 2020Assignee: Ciena CorporationInventors: Trevor Meunier, Mitchell O'Leary, Victor Aldea, Kamran Rahmani
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Publication number: 20200257067Abstract: A heatsink for pluggable optical devices that incorporates features to limit the travel and deformation of the mating/mated spring clip that holds the heatsink to the cage of a pluggable optical device. The heatsink bearing surface takes the shape and contour of the leaf spring portion of the spring clip, thereby contacting and supporting it well before it plastically yields and permanently deforms. The shape of this feature, which may be coupled to or integrally formed with the heatsink bearing surface, can match exactly the shape of the spring clip or approximate the shape using a curved, variable, or other easier to manufacture profile, as long as the associated protrusions extend up into the corners of the leaf spring portion of the spring clip. This feature effectively acts as a hard stop and prevents the spring clip from being compromised due to improper handling or installation.Type: ApplicationFiled: February 8, 2019Publication date: August 13, 2020Inventors: Trevor Meunier, Mitchell O'Leary, Victor Aldea, Kamran Rahmani
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Patent number: 10638631Abstract: A module includes a physical form factor with one or more openings in a faceplate for receiving a corresponding sub-slot module; module high-speed connectors configured to mate with high-speed connectors in the corresponding sub-slot module; and one or more micro latches for each of the one or more openings to engage a compliant faceplate insert on the corresponding sub-slot module, wherein a single micro latch is utilized to engage a single sub-slot module to provide built-in physical compliancy with a biasing force sufficient to engage the high-speed connectors with the module high-speed connectors. Each of the one or more micro latches includes a latching pin which engages an integrated channel in the compliant faceplate insert on the corresponding sub-slot module and which engages an end of the integrated channel to apply a force to a spring on the compliant faceplate insert.Type: GrantFiled: September 25, 2018Date of Patent: April 28, 2020Assignee: Ciena CorporationInventors: Mitchell O'Leary, Victor Aldea, Trevor Meunier, Kamran Rahmani, Yannick Brisebois
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Publication number: 20200100379Abstract: A module includes a physical form factor with one or more openings in a faceplate for receiving a corresponding sub-slot module; module high-speed connectors configured to mate with high-speed connectors in the corresponding sub-slot module; and one or more micro latches for each of the one or more openings to engage a compliant faceplate insert on the corresponding sub-slot module, wherein a single micro latch is utilized to engage a single sub-slot module to provide built-in physical compliancy with a biasing force sufficient to engage the high-speed connectors with the module high-speed connectors. Each of the one or more micro latches includes a latching pin which engages an integrated channel in the compliant faceplate insert on the corresponding sub-slot module and which engages an end of the integrated channel to apply a force to a spring on the compliant faceplate insert.Type: ApplicationFiled: September 25, 2018Publication date: March 26, 2020Inventors: Mitchell O'Leary, Victor Aldea, Trevor Meunier, Kamran Rahmani, Yannick Brisebois