Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and internal electrodes alternately disposed with the dielectric layers interposed therebetween; and an external electrode disposed on the capacitor body to be connected to one or more of the internal electrodes. Porosity of ends of the internal electrodes is less than 50% on an interfacial surface between a margin of the capacitor body in a width direction the capacitor body and the internal electrodes.

Abstract: A multilayer electronic component includes a body including a dielectric layer and a first internal electrode and a second internal electrode and having first to sixth surfaces, a first external electrode including a first connection portion on the third surface, a first band portion on the first surface, and a third band portion on the second surface, a second external electrode including a second connection portion on the fourth surface, a second band portion on the first surface, and a fourth band portion on the second surface, an insulating layer disposed on the second surface and extending onto the first and second connection portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. The insulating layer includes glass, and a region disposed on the second surface in the insulating layer has a convex shape in the first direction.

Abstract: A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately disposed while having the dielectric layer interposed therebetween; a first external electrode including a first connection portion and first and third band portions extending from ends of the first connection portion; a second external electrode including a second connection portion and second and fourth band portions extending from the second connection portion; an insulating layer disposed on the first and second connection portions and covering a top surface of the body and the third and fourth band portions; first and second plating layers disposed on the first and second band portions, respectively. An end of the plating layer and an end of the insulating layer contact with each other, and a thickness of the end of the plating layer and a thickness of the end of the insulating layer decreases toward the contact point.

Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes alternately disposed with respective dielectric layers interposed therebetween; a first external electrode including a first connection portion, and first and second band portions extending from the first connection portion; a second external electrode including a second connection portion, and second and fourth band portions extending from the second connection portion; an insulating layer disposed to extend to a portion on the first and second connection portions; a first plating layer disposed on the first band portion and disposed to extend to be in contact with the insulating layer; and a second plating layer disposed on the second band portion and disposed to extend to be in contact with the insulating layer. An average thickness of the first or second plating layer is smaller than an average thickness of the insulating layer.

Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a first portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a first portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions, the insulating layer including a first glass and a first oxide including aluminum (Al).

Abstract: An electronic component includes a body including a dielectric layer and internal electrodes, and including first to sixth surfaces; a first external electrode including a first connection portion on the third surface and a first band portion on the first surface; a second external electrode including a second connection portion on the fourth surface and a second band portion on the first surface; an insulating layer on the second surface and the first and second connection portions; and a plating layer on the first and second band portions. The plating layer extends onto the first and second connection portions and is in contact with the insulating layer. A thickness of an end of the insulating layer decreases toward the plating layer. An end of the plating layer includes a first region between the insulating layer and the first or second connection portion and a second region covering the insulating layer.

Abstract: A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes, the body having first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; a first external electrode disposed on the first surface, and extending onto a portion of each of the third to sixth surfaces; a second external electrode disposed on the second surface, and extending onto a portion of each of the third to sixth surfaces, wherein, in at least one of cross-sections in first and second directions or in first and third directions, in at least one of the first and second external electrodes, a maximum thickness in a peripheral portion of the first and second surfaces is greater than a maximum thickness in a center portion, and a maximum thickness in a center portion is greater than a maximum thickness in a corner portion.

Abstract: A multilayer capacitor includes a body including a dielectric layer and a plurality of internal electrodes stacked on one another with the dielectric layer interposed therebetween, and external electrodes disposed externally on the body, and each connected to the plurality of internal electrodes, wherein at least one of the plurality of internal electrodes includes an alloy region formed in a region in contact with a corresponding external electrode of the external electrodes, and the alloy region includes a nickel (Ni)-chromium (Cr) alloy.

Abstract: A multilayer electronic component, includes: a body including a dielectric layer, and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween; a first connection portion including a first conductive layer disposed on the third surface and connected to the first internal electrode, and a first insulating layer disposed on the first conductive layer; a second connection portion including a second conductive layer disposed on the fourth surface and connected to the second internal electrode, and a second insulating layer disposed on the second conductive layer; a first external electrode including a first electrode layer connected to the first conductive layer, wherein the first external electrode is disposed on any one of the first, second, fifth, and sixth surfaces; and a second external electrode including a second electrode layer connected to the second conductive layer.