Patents by Inventor Kang Hu
Kang Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240164753Abstract: The present application relates to a rope fixation device, a rope transmission device, and an ultrasound probe. The rope fixation device includes a drive shaft, a rope, and a fixing member. The drive shaft is provided with a rope through-hole and a fixing hole. The fixing hole is in communication with the rope through-hole. The rope through-hole penetrates through the drive shaft. Two opposite ends of the rope through-hole are both located on the side wall of the drive shaft. The rope extends through the rope through-hole, and two ends of the rope respectively protrude out from the two opposite ends of the rope through-hole. The fixing member is inserted into the fixing hole. One end of the fixing member adjacent to the rope through-hole includes an end surface. At least part of the end surface abuts against the rope, thereby fixing the rope in the rope through-hole.Type: ApplicationFiled: November 16, 2023Publication date: May 23, 2024Inventors: HAO HU, XIAO-YANG DONG, KANG SI
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Publication number: 20240166476Abstract: The present disclosure belongs to the technical field of mining equipment, and in particular related to an automatic driving system of a monorail hoist driven based on a digital twin and a method thereof. The system includes a railroad switch sensor module, a positioning system module, a data transferring system, an intelligent control system, a digital twin system and an automatic driving module. The railroad switch sensor module is configured to sense the connection-position state of a movable track in a monorail hoist railroad switch track. The data transferring system is configured to transmit the data on the surface and underground. The method applies the digital twin technology to the automatic driving in the monorail hoist, reduces the input of personnel in the mine, and avoids safety accidents caused by irregular management or improper operation of the driver, through the deploying of the automatic driving module for the monorail hoist.Type: ApplicationFiled: February 1, 2024Publication date: May 23, 2024Applicants: China University of Mining and Technology, Xuzhou Liren Monorail Transportation Equipment Co., Ltd.Inventors: Zhencai ZHU, Hao LU, Yidong ZHANG, Hengzhen HU, Fuping ZHENG, Yu TANG, Kang XU, Yuzhu ZHANG
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Publication number: 20240153806Abstract: An apparatus for automated wafer carrier handling includes a base plate and an active expansion component movably coupled to the base plate. The active expansion component is configured to change from a contracted form to an expanded form so as to be engaged with a top flange mounted on a wafer carrier.Type: ApplicationFiled: January 15, 2024Publication date: May 9, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ren-Hau Wu, Cheng-Lung Wu, Jiun-Rong Pai, Cheng-Kang Hu
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Patent number: 11967546Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.Type: GrantFiled: July 21, 2022Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
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Publication number: 20240115944Abstract: This application discloses a method for updating a virtual environment picture performed by a computer device. The method includes: displaying a first virtual environment picture of a virtual environment using a first observation position as an observation center, wherein a virtual character is located at a first position in the first virtual environment picture; in response to receiving a first directional operation on the virtual character, displaying a skill indicator in accordance with the first directional operation; and when at least a portion of the skill indicator is going to exceed the first virtual environment picture, replacing the first virtual environment picture with displaying a second virtual environment picture, wherein the virtual character is relocated from the first position in the first virtual environment picture to a second position in the second virtual environment picture so as to present the skill indicator in the second virtual environment picture.Type: ApplicationFiled: December 15, 2023Publication date: April 11, 2024Inventors: Jiacheng WEI, Xun Hu, Shandong Su, Xiangyu Zhang, Yong Zhang, Kang Zhang
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Patent number: 11954841Abstract: An image analysis device may align an image to determine a position of a wafer within the image. The wafer may include a plurality of wafer bumps. The image analysis device may mask, based on the position of the wafer, the image to obtain an image of a portion of the wafer. The image analysis device may binarize the image of the portion of the wafer to create a binarized image of the portion of the wafer. The image analysis device may determine a bump pattern, associated with the plurality of wafer bumps, based on the binarized image of the portion of the wafer. The image analysis device may perform a defect analysis of the determined bump pattern. The defect analysis may be associated with detecting regions of the portion of the wafer in which one or more wafer bumps have abnormal bump heights.Type: GrantFiled: June 3, 2022Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Lieh Chen, Cheng-Kang Hu, Cheng-Lung Wu, Jiun-Rong Pai
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Publication number: 20240100434Abstract: Provided are a virtual object control method, apparatus, device, and computer-readable storage medium, belonging to the field of computer technologies. The method includes controlling a first virtual object to cast a first skill in response to a first operation on a first skill control, wherein the first virtual object moves from a first position to a second position when casting the first skill; obtaining a second operation on a second skill control during casting of the first skill by the first virtual object; displaying a skill casting indicator of a second skill based on the second position for the second operation, the skill casting indicator indicating an influence range of the second skill; and controlling the first virtual object to cast the second skill at the second position according to the influence range after the first virtual object completes casting of the first skill.Type: ApplicationFiled: December 5, 2023Publication date: March 28, 2024Inventors: Jiacheng WEI, Shandong SU, Kang ZHANG, Xun HU, Yulin WAN
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Patent number: 11926742Abstract: A method for preparing carbon black from pyrolysis char of waste tires by a molten salt thermal treatment and a product thereof are provided. The method includes heating one or two groups of a metal chloride salt group and a metal sulfate group to obtain a molten salt; adding pyrolysis char of waste tires into the molten salt and subjecting same to a molten salt thermal treatment under a preset reaction atmosphere; after the reaction is complete, separating the reaction product to obtain a secondary molten salt and treated pyrolysis char, washing the treated pyrolysis char with hot water and then drying same so as to obtain carbon black, and at the same time, recycling the secondary molten salt.Type: GrantFiled: May 15, 2020Date of Patent: March 12, 2024Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Hongyun Hu, Hua Tang, Aijun Li, Kang Xie, Yuhan Yang, Fu Yang, Hong Yao
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Patent number: 11929271Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.Type: GrantFiled: July 13, 2020Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Kang Hu, Shou-Wen Kuo, Sheng-Hsiang Chuang, Jiun-Rong Pai, Hsu-Shui Liu
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Publication number: 20240070974Abstract: This application discloses a method for operating virtual characters within a virtual environment performed by a computer device.Type: ApplicationFiled: November 8, 2023Publication date: February 29, 2024Inventors: Jiacheng WEI, Xun HU, Kang ZHANG, Xiangyu ZHANG, Shandong SU, Yong ZHANG
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Patent number: 11915958Abstract: An apparatus and an operating method for automated wafer carrier handling are provided. The operation method includes bring a base frame and an engaging mechanism of an automated wafer carrier handling apparatus into abutting contact with a top flange mounted on a wafer carrier to limit at least one degree of freedom of movement of the top flange, where the engaging mechanism is disposed on the base frame; transporting the wafer carrier to a destination location by the automated wafer carrier handling apparatus; and releasing the top flange mounted on the wafer carrier from the automated wafer carrier handling apparatus at the destination location.Type: GrantFiled: March 25, 2022Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ren-Hau Wu, Cheng-Lung Wu, Jiun-Rong Pai, Cheng-Kang Hu
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Publication number: 20230384776Abstract: A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.Type: ApplicationFiled: July 31, 2023Publication date: November 30, 2023Inventors: Yung-Yao LEE, Cheng-Kang HU, Jui-Chun PENG, Hsu-Shui LIU
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Publication number: 20230347713Abstract: Disclosed are a method for cooling a passenger compartment and a battery, comprising: step S101, determining the current driving stage of a vehicle; S102, querying, according to a correlation between a driving stage and a cooling strategy, a target cooling strategy corresponding to the current driving stage of the vehicle, wherein different driving stages correspond to different cooling strategies, and each cooling strategy comprises passenger compartment cooling and battery cooling; and S103, cooling a passenger compartment and/or a battery according to the target cooling strategy. Also disclosed are an apparatus for cooling a passenger compartment and a battery, and a vehicle to which the method is applied.Type: ApplicationFiled: December 10, 2021Publication date: November 2, 2023Inventor: Kang HU
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Publication number: 20230326776Abstract: A cart for wafer transportation includes a cart body, a separator disposed between first and second wafer holders, an airtight lock configured to seal the cart body. A wafer transfer system includes a cart including a space for holding a wafer holder, a first workstation configured to load the wafer holder into the space and pressurize the space, and a second workstation configured to depressurize the space and unload the wafer holder from the space, wherein the cart is transportable between the first workstation and the second workstation. A method for transporting wafers includes docking a cart in a workstation; loading a wafer holder into a space of the cart; pressurizing the space to cause a pressure of the space to be greater than an atmospheric pressure; maintaining the pressure of the space at the pressure; and moving the cart carrying the wafer holder away from the workstation.Type: ApplicationFiled: August 24, 2022Publication date: October 12, 2023Inventors: Ren-Hau Wu, Cheng-Kang Hu, Chieh-Chun Lin, Jia-Hong Liao, Cheng-Yi Liu
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Patent number: 11768484Abstract: A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.Type: GrantFiled: March 31, 2021Date of Patent: September 26, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yung-Yao Lee, Cheng-Kang Hu, Jui-Chun Peng, Hsu-Shui Liu
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Publication number: 20230294508Abstract: In the method and the apparatus for thermal management and control, and the vehicle according to the present disclosure, an overtemperature threshold of the vehicle may be adjusted in off-road conditions, and/or an operating temperature of the vehicle may be obtained, and driving parameters of the vehicle may be adjusted according to the operating temperature, so as to enhance the heat dissipation performance of the vehicle in the off-road conditions, and avoid that an over-temperature protection of the engine is easily triggered when the engine is operated at a high speed and a high torque in the off-road conditions, resulting in driving experience being affected by limited torque of the engine and turn-off of an air conditioning occurring in the vehicle, and driving safety also being affected, with no high-power fan and large-size radiator being additionally installed, and thus reducing weight and manufacturing cost of the vehicles.Type: ApplicationFiled: August 9, 2021Publication date: September 21, 2023Inventors: Tong WU, Ming SUN, Kang HU, Ming CHEN
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Publication number: 20230282494Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.Type: ApplicationFiled: May 15, 2023Publication date: September 7, 2023Inventors: Cheng-Fei YU, Chang-Chen Tsao, Ting-Yau Shiu, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai
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Patent number: 11707072Abstract: Food products and systems and methods for their production involve microfiltration (“MF”) of fluid skim to form a MF retentate, combining the MF retentate with cream and subjecting the combination to ultrafiltration (“UF”) to form a UF retentate. Prior to UF, the composition is formed of non-acidified components. Following UF, the UF retentate is acidified and forms a food product including a high solids content. The solids content may be further increased using evaporation. The resulting cheese or cheese base contains a lower whey protein ratio in a fat:casein:whey protein ratio compared to systems and methods that do not employ MF.Type: GrantFiled: November 22, 2019Date of Patent: July 25, 2023Assignee: Land O'Lakes, Inc.Inventors: Thomas Alexander Glenn, III, Clint Garoutte, Kang Hu, Jason Thompson, Orlando Maldonado
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Publication number: 20230207359Abstract: A load port receives a wafer carrier. An equipment front end module (EFEM) transfers semiconductor wafers to and from the wafer carrier via an access opening of a housing of the EFEM, and also transfers wafers to and from a semiconductor processing or characterization tool. A gas flow device disposed inside the housing of the EFEM is connected to receive a low humidity gas having relative humidity of 10% or less, and is positioned to flow the received low humidity gas across the access opening. A saturated pressure layer of the gas flow device has a permeability for the low humidity gas that increases with increasing distance from a gas inlet edge of the saturated pressure layer, for example due to holes of varying diameter and/or density passing through the saturated pressure layer. A filter layer of the gas flow device uniformizes the gas exiting the saturated pressure layer.Type: ApplicationFiled: February 24, 2022Publication date: June 29, 2023Inventors: Ren-Hau Wu, Cheng-Kang Hu, Yi-Fam Shiu, Cheng-Lung Wu, Hsu-Shui Liu
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Patent number: 11670524Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.Type: GrantFiled: December 2, 2020Date of Patent: June 6, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Fei Yu, Chang-Chen Tsao, Ting-Yau Shiu, Cheng-Kang Hu, Hsu-Shui Liu, Jiun-Rong Pai