Patents by Inventor Kang-Jun Kim

Kang-Jun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240173738
    Abstract: Provided is a substrate processing apparatus and substrate processing method capable of allowing a liquid chemical to penetrate deeply into patterns of a substrate, the substrate processing apparatus including a housing for forming a treatment space where a substrate is processed, a substrate supporter mounted in the treatment space to rotate about a rotational axis, and provided to support the substrate, a liquid chemical supplier provided above the substrate supporter to eject a liquid chemical toward an upper surface of the substrate supported by the substrate supporter, and an ejector provided at a side of the treatment space to eject a heat transfer medium with a temperature different from the temperature of the liquid chemical onto the substrate.
    Type: Application
    Filed: November 6, 2023
    Publication date: May 30, 2024
    Inventors: Yong Jun KIM, Tae-keun KIM, Junhee CHOI, Kang Sul KIM, Kyeong Min LEE
  • Publication number: 20240173752
    Abstract: Disclosed are a substrate processing apparatus and a substrate processing method that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a chamber having a processing space defined therein in which a substrate is processed; a chuck installed in the processing space and configured to support the substrate thereon; a chemical liquid supply formed on top of the chuck and configured to supply a chemical liquid droplet toward an upper surface of the substrate supported on the chuck; and a pressurizer formed on top of the chuck and configured to pressurize the chemical liquid droplet supplied on the upper surface of the substrate so that the pressed chemical liquid droplet fills a gap between patterns formed on the substrate.
    Type: Application
    Filed: November 21, 2023
    Publication date: May 30, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Junhee CHOI, Tae-keun KIM, Kang Sul KIM, Kyeong Min LEE, Yong Jun KIM
  • Publication number: 20240178009
    Abstract: Disclosed are a substrate processing apparatus that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a housing having a processing space defined therein in which a substrate is processed; a substrate support installed in the processing space so as to be rotatable about a rotation axis and configured to support the substrate; a chemical liquid supply disposed on top of the substrate support and configured to spray a chemical liquid toward an upper surface of the substrate supported on the substrate support; and a controller configured to repeatedly apply a first rotation control signal and a second rotation control signal indicating different rotation speeds to the substrate support so as to generate an inertial behavior of the chemical liquid coated on the substrate.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 30, 2024
    Applicant: SEMES CO., LTD.
    Inventors: Kang Sul KIM, Tae-keun KIM, Junhee CHOI, Kyeong Min LEE, Yong Jun KIM
  • Publication number: 20240113403
    Abstract: The present disclosure relates to an electrolyte injection system, and the electrolyte injection system is a system for injecting an electrolyte solution into a pouch in which an electrode assembly is embedded, the electrolyte injection system comprising: an injection pipe for injecting an electrolyte solution; an electrolyte solution supply portion supplying an electrolyte solution; and a manifold portion connecting an injection pipe and an electrolyte solution supply portion to prevent a reverse flow of the electrolyte solution and ensure precision of injection amount so that a large amount of electrolyte solution may be accurately and rapidly injected.
    Type: Application
    Filed: July 27, 2023
    Publication date: April 4, 2024
    Inventors: Jae Min RYU, Sang Jun PARK, Kang San KIM, Ji Eun AHN, Young Rae OH
  • Patent number: 8100997
    Abstract: The present invention relates to a diamond tool and a method of manufacturing the same, wherein multiple abrasive layers are formed through a brazing or electroplating method, thereby improving the performance and service life of the tool. According to the method of the present invention, a plurality of concave portions are formed in a surface of the shank. A bonding paste is coated into the concave portions and abrasives are dispersed in the bonding paste to thereby form a lower abrasive layer. Again, a bonding material is coated on the lower abrasive layer and abrasives are dispersed in the bonding material to thereby form an upper abrasive layer. Then, a heat treatment is executed to fusion-bond the bonding material and abrasives onto the surface of the shank.
    Type: Grant
    Filed: February 4, 2005
    Date of Patent: January 24, 2012
    Assignee: Shinhan Diamond Industrial Co., Ltd.
    Inventors: Min-Seok Song, Mun-Seok Park, Sug-Goo Kim, Sun-Jai Lee, Kang-Jun Kim, Kee-Jeong Cheong, Won-Ho Jee, Shin-Kyung Kim
  • Publication number: 20070151554
    Abstract: The present invention relates to a diamond tool and a method of manufacturing the same, wherein multiple abrasive layers are formed through a brazing or electroplating method, thereby improving the performance and service life of the tool. According to the method of the present invention, a plurality of concave portions are formed in a surface of the shank. A bonding paste is coated into the concave portions and abrasives are dispersed in the bonding paste to thereby form a lower abrasive layer. Again, a bonding material is coated on the lower abrasive layer and abrasives are dispersed in the bonding material to thereby form an upper abrasive layer. Then, a heat treatment is executed to fusion-bond the bonding material and abrasives onto the surface of the shank.
    Type: Application
    Filed: February 4, 2005
    Publication date: July 5, 2007
    Applicant: SHINHAN DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Min-Seok Song, Mun-Seok Park, Sug-Goo Kim, Sun-Jai Lee, Kang-Jun Kim, Kee-Jeong Cheong, Won-Ho Jee, Shin-Kyung Kim